1KX8 OTPROM, 200ns, CDIP24, 0.600 INCH, CERAMIC, DIP-24
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Texas Instruments |
| Parts packaging code | DIP |
| package instruction | 0.600 INCH, CERAMIC, DIP-24 |
| Contacts | 24 |
| Reach Compliance Code | not_compliant |
| ECCN code | EAR99 |
| Maximum access time | 200 ns |
| JESD-30 code | R-GDIP-T24 |
| length | 32.07 mm |
| memory density | 8192 bit |
| Memory IC Type | OTP ROM |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 24 |
| word count | 1024 words |
| character code | 1000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 1KX8 |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP24,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum seat height | 5.7 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | BIPOLAR |
| Temperature level | MILITARY |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 15.24 mm |
| Base Number Matches | 1 |
| TBP28L86AMJW | TBP28L166NW | TBP28L22N | TBP28L42N | TBP28L86AJW | TBP28L22MJ | TBP28L22J | TBP28L46MJW | TBP28LA22J | |
|---|---|---|---|---|---|---|---|---|---|
| Description | 1KX8 OTPROM, 200ns, CDIP24, 0.600 INCH, CERAMIC, DIP-24 | 2KX8 OTPROM, 125ns, PDIP24, 0.600 INCH, PLASTIC, DIP-24 | 256X8 OTPROM, 70ns, PDIP20, DIP-20 | 512X8 OTPROM, 95ns, PDIP20, DIP-20 | 1KX8 OTPROM, 110ns, CDIP24, 0.600 INCH, CERAMIC, DIP-24 | 256X8 OTPROM, 75ns, CDIP20, CERAMIC, DIP-20 | 256X8 OTPROM, 70ns, CDIP20, CERAMIC, DIP-20 | 512X8 OTPROM, 110ns, CDIP24, 0.600 INCH, CERAMIC, DIP-24 | 256X8 OTPROM, 75ns, CDIP20, CERAMIC, DIP-20 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Parts packaging code | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
| package instruction | 0.600 INCH, CERAMIC, DIP-24 | DIP, DIP24,.6 | DIP, DIP20,.3 | DIP-20 | 0.600 INCH, CERAMIC, DIP-24 | DIP, DIP20,.3 | DIP, DIP20,.3 | DIP, DIP24,.6 | DIP, DIP20,.3 |
| Contacts | 24 | 24 | 20 | 20 | 24 | 20 | 20 | 24 | 20 |
| Reach Compliance Code | not_compliant | _compli | _compli | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Maximum access time | 200 ns | 125 ns | 70 ns | 95 ns | 110 ns | 75 ns | 70 ns | 110 ns | 75 ns |
| JESD-30 code | R-GDIP-T24 | R-PDIP-T24 | R-PDIP-T20 | R-PDIP-T20 | R-GDIP-T24 | R-GDIP-T20 | R-GDIP-T20 | R-GDIP-T24 | R-GDIP-T20 |
| length | 32.07 mm | 31.75 mm | 24.325 mm | 24.325 mm | 32.07 mm | 24.195 mm | 24.195 mm | 32.07 mm | 24.195 mm |
| memory density | 8192 bit | 16384 bi | 2048 bi | 4096 bit | 8192 bit | 2048 bit | 2048 bit | 4096 bit | 2048 bit |
| Memory IC Type | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM |
| memory width | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 24 | 24 | 20 | 20 | 24 | 20 | 20 | 24 | 20 |
| word count | 1024 words | 2048 words | 256 words | 512 words | 1024 words | 256 words | 256 words | 512 words | 256 words |
| character code | 1000 | 2000 | 256 | 512 | 1000 | 256 | 256 | 512 | 256 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C | 70 °C | 70 °C | 70 °C | 70 °C | 125 °C | 70 °C | 125 °C | 70 °C |
| organize | 1KX8 | 2KX8 | 256X8 | 512X8 | 1KX8 | 256X8 | 256X8 | 512X8 | 256X8 |
| Package body material | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
| Encapsulate equivalent code | DIP24,.6 | DIP24,.6 | DIP20,.3 | DIP20,.3 | DIP24,.6 | DIP20,.3 | DIP20,.3 | DIP24,.6 | DIP20,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 5.7 mm | 5.08 mm | 5.08 mm | 5.08 mm | 5.7 mm | 5.08 mm | 5.08 mm | 5.7 mm | 5.08 mm |
| Maximum supply voltage (Vsup) | 5.5 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.5 V | 5.25 V | 5.5 V | 5.25 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.5 V | 4.75 V | 4.5 V | 4.75 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| technology | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| Temperature level | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | MILITARY | COMMERCIAL | MILITARY | COMMERCIAL |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 15.24 mm | 15.24 mm | 7.62 mm | 7.62 mm | 15.24 mm | 7.62 mm | 7.62 mm | 15.24 mm | 7.62 mm |
| Maker | Texas Instruments | - | Texas Instruments | Texas Instruments | Texas Instruments | - | - | - | Texas Instruments |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - |
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