EEWORLDEEWORLDEEWORLD

Part Number

Search

392249

Description
63/37 400 2% .064dia/16swg
CategoryTools and equipment   
File Size79KB,2 Pages
ManufacturerHenkel
Download Datasheet View All

392249 Overview

63/37 400 2% .064dia/16swg

Technical Data Sheet
C400
April-2011
PRODUCT DESCRIPTION
C400 provides the following product characteristics:
Technology
Product Benefits
Cored solder wire
• Halide free
• No clean
• Clear residue
• Good wetting
• Fast soldering
• Heat stable
• Mild odor
• Pb-free and SnPb alloys available
ROL0
Soldering - Cored wire
Copper, Brass and Nickel
IPC/J-STD-004
Classification
Application
Surface Finishes
Soldering Iron:
● Good results can be obtained using a range of tip
temperatures. However, the optimum tip temperature and
heat capacity required for a hand-soldering process is a
function of both soldering iron design and the nature of
the task.
● Care should be exercised to avoid unnecessarily high tip
temperatures for extensive periods of time.
● A high tip temperature may increase any tendency to flux
spitting and it may produce some residue darkening.
● The tip of the soldering iron should be properly tinned.
Severely contaminated soldering iron tips should be
cleaned with Multicore® Tip Tinner/Cleaner.
● Wipe the tip on a clean, damp sponge before re-tinning
with C400 wire.
Soldering Process:
1. Apply the soldering iron tip to the work surface. The iron
tip should contact both the base material and the lead at
the same time to heat both surfaces properly. It should
take no more than a fraction of a second to heat both
surfaces adequately.
2. Apply C400 flux cored wire to a part of the joint surface
away from the soldering iron and allow to form a joint
fillet. This will be virtually instantaneous. Do not apply
excessive solder to the joint as this will not improve joint
integrity and it will leave excess flux residues on the
surface.
3. Remove solder from the work piece and then remove the
iron tip.
4. The total process will be very rapid, depending upon
thermal mass, tip temperature, tip configuration and the
solderability of the surfaces to be joined.
5. The resin and flux systems are designed to leave
relatively low residues and to minimize residual activity.
This is achieved by ensuring some decomposition and
volatilization takes place during the soldering process
Cleaning:
C400 flux cored solder wire has been formulated to leave
amber flux residues and resist spitting and fuming. In most
industrial and consumer electronics applications, cleaning will
not be required. The product may, therefore, be used to
complement a no-clean wave soldering or reflow process or to
allow repairs to cleaned boards without the need for a second
cleaning process. In high-reliability applications, the residues
should be removed.
Should cleaning be required, this is best achieved using
SC-01™ cleaner.
C400 cored solder wire has been specially formulated to
complement no clean wave and reflow soldering processes.
C400 wires provide fast soldering on copper, brass, and solder
coated materials.
TYPICAL PROPERTIES
Solder Cored Wire
Alloys - Tin/lead
• SN63
• SN60
• SN62
• 97SC (SAC305)
• 96SC (SAC387)
• 99C (SnCu)
• 95A (SnSb)
• 96S (SnAg)
205 to 220 mg KOH/g
Zero
2.2
Alloys - Lead Free
Acid Value
Halide content
Flux Content (%)
ALLOYS:
The alloys used in C400 cored solder wires conform to the
purity requirements of the common national and international
standards.
FLUX:
C400 solid flux is based on modified rosin and carefully
selected activators. In practice they exhibit a mild rosin odor
and leave a small quantity of clear residue.
DIRECTIONS FOR USE
Soldering with C400 does not require any special methods or
deviation from standard hand soldering practices.
2440 Learning (VIII) Linux I/O Multiplexing
[i=s]This post was last edited by lonerzf on 2014-7-27 21:36[/i] This post mainly records the learning of I/O reuse in Linux. The main content includes the usage of select, poll, and epoll. Today I wi...
lonerzf Linux and Android
Ask a question about STM32USB_OTG
Are you familiar with USB-OTG? I have a question:When using:USB_SIL_Write(EP2_IN,(uint8_t*)bbf,64);to send data, when the host program (VC++) does not read the corresponding port, it will always turn ...
leuliu stm32/stm8
【TI's First Low Power Design Competition】+ MSP430 Low Power Design Analysis
[i=s] This post was last edited by azhiking on 2015-1-5 23:02 [/i] The whole system consists of MCU, sensors (temperature, humidity, acceleration, height, etc.), memory (EEPROM), RTC chip (DS3231M), p...
azhiking Microcontroller MCU
STC12C5A60S2 MCU serial communication and timer interruption issues
Experts, I want to implement such a function: stc12c5a60s2 has two serial ports, called serial port 1 and serial port 2. Receive any byte of data through serial port 1, and send it to the serial port ...
wangwanzhao 51mcu
Programming skills
What is a good programmer? Does he know a lot of technical details? Or does he know low-level programming? Or does he program fast? I think none of them. For some technical details and low-level techn...
lixiaohai8211 MCU
Application of virtual technology in new product development1
1. IntroductionWith the rapid development of science and technology, competition among enterprises is becoming increasingly fierce, and market changes are accelerating. New product development by ente...
frozenviolet Robotics Development

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 570  1234  2470  2217  1022  12  25  50  45  21 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号