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SMDSW.031 1OZ

Description
solder wire NO-clean 63/37 1oz.
CategoryTools and equipment   
File Size105KB,3 Pages
ManufacturerChip Quik
Download Datasheet Compare View All

SMDSW.031 1OZ Overview

solder wire NO-clean 63/37 1oz.

SMDSW.031 2OZ
Datasheet revision 1.7
www.chipquik.com
Solder Wire Sn63/Pb37 No-Clean with 2.2% Flux Core 2oz Spool
Product Highlights
No-Clean Water-Washable
Synthetic Flux Core
The clear, non-corrosive, non-conductive residue is meant to be left on the board. Residues that do remain are water soluble
if you want to remove them. Clean with hot water at 60°C (140°F) minimum.
2.2% flux core
Halogen content: None
Specifications
Alloy:
Wire Diameter:
Flux Type:
Flux Classification:
Melting Point:
Packaging:
Sn63/Pb37
0.031” (0.8mm)
No-Clean Water-Washable Synthetic
ROL0
183°C (361°F)
2 oz spool
Test Results
Test J-STD-004 or other
requirements as stated
Copper Mirror
Corrosion
Quantitative Halides
Electrochemical Migration
Surface Insulation Resistance 85°C,
85% RH @ 168 Hours
Visual
Conflict Minerals Compliance
REACH Compliance
Test Requirement
IPC-TM-650: 2.3.32
IPC-TM-650: 2.6.15
IPC-TM-650: 2.3.28.1
IPC-TM-650: 2.6.14.1
IPC-TM-650: 2.6.3.7
IPC-TM-650: 3.4.2.5
Electronic Industry Citizenship
Coalition (EICC)
Articles 33 and 67 of Regulation (EC)
No 1907/2006
Result
L: No breakthrough
L: No corrosion
L: <0.5%
L: <1 decade drop (No-clean)
L: ≥100MΩ (No-clean)
Clear and free from precipitation
Compliant
Contains Lead (Pb) CAS# 7439-92-1
No other SVHC present
Conforms to the following Industry Standards:
J-STD-004B, Amendment 1 (Solder Fluxes):
J-STD-006C, Amendments 1 & 2 (Solder Alloys and Fluxed/Non-Fluxed Solders):
RoHS 2 Directive 2011/65/EU:
Yes
Yes
No
1
© 1994-2018 Chip Quik® Inc.

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