583489 datasheet, PDF - EEWORLD Datasheet

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583489: Description63/37 mp200 solder flux 25gm; CategoryTools and equipment; File Size105KB，3 Pages; ManufacturerHenkel

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63/37 mp200 solder flux 25gm

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Technical Data Sheet

MP200

December-2011

PRODUCT DESCRIPTION

MP200 provides the following product characteristics:

Technology

Application

Solder paste

Sn/Pb soldering

Solder Paste Typical Properties

Alloys

Multicore Powder Size Coding

Metal Loading (Weight %)

Slump, J-STD-005, mm

RT, 15 minutes

0.33 x 2.03 mm pads

0.63 x 2.03 mm pads

150°C, 15 minutes

0.33 x 2.03 mm pads

0.63 x 2.03 mm pads

63S4

ACP

90% metal

IPC A21 Pattern

0.06

0.33

0.08

0.33

MP200 solder pastes have been formulated as no-clean,

Sn/Pb solder paste for high speed printing and reflow in both

air and nitrogen. The product was specifically formulated to

have increased reflow operating window.

FEATURES AND BENEFITS

●

Suitable for fine pitch, high speed printing up to 200mms

-1

Extended printer open time and tack life

Long abandon time

Colorless residues

Soft residues make pin testing easier eliminating any need for

cleaning

● Resistant to both hot and cold slump

● 63S4 alloy for Anti-Tombstoning

● Halide free flux classification: ROL0 to ANSI/J-STD-004 (Jan.

1995)

Brookfield Viscosity TF spindle, 25°C, 5rpm after 680,000

2 minutes, mPa∙s

Thixotropic Index (Ti), 25°C

0.58

(Ti = log(viscosity @ 1.8s

-1

/ viscosity @ 18s

-1

)

Malcom Rheology, 10rpm, 25°C, Rate 6s

-1

1,400

Initial tack force, gF

86.4

Useful open time, hours

>24

Based on type 3 powder.

Solder Paste Typical Properties

Alloys

Powder Particle Size, µm

Multicore Powder Size Coding

IPC Equivalent

Metal Loading (Weight %)

Slump J-STD-005, mm

RT, 15 minutes

0.33 x 2.03 mm pads

0.63 x 2.03 mm pads

150°C, 15 minutes

0.33 x 2.03 mm pads

0.63 x 2.03 mm pads

TYPICAL PROPERTIES

Solder Powder:

Careful control of the atomisation process for production of

solder powders for MP200 solder pastes ensures that the

solder powder is produced to a quality level that exceeds

IPC/J-STD-006 & EN29453 requirements for sphericity, size

distribution, impurities and oxide levels. Minimum order

requirements may apply to certain alloys and powder sizes, for

availability contact your local technical service helpdesk.

DIRECTIONS FOR USE

Printing:

1. MP200 is available for stencil printing down to 0.4mm

(0.016") pitch QFP devices, with type 3 (AGS) powder.

2. Printing at speeds between 25 mm/s (1 "/s) and 200 mm/s

(8 "/s) can be achieved using laser cut, electropolished or

electroformed stencils and metal squeegees (preferably

60°).

3. Unlike some pastes, high squeegee pressures are not

required, making Multicore MP200 particularly useful for

second side printing processes.

4. Acceptable first prints have been achieved at 0.4 mm (16

mils) pitch after printer down times of >90 minutes without

requiring a knead cycle.

Reflow:

● Any of the available methods of heating to cause reflow

may be used including IR, convection, hot belt, vapor

phase and laser soldering.

● There is no single reflow profile which is suitable for all

processes and applications, but the following graphs

show profile examples that have given good results in

practice.

● 63S4 anti-tombstoning is selected when tombstone

defects are experienced with standard alloys and when it

is not possible to eliminate by design changes..

● Typical reflow profile as follows:

SN62, SN63

25-45

AGS

Type 3

90% metal

IPC A21 Pattern

0.08

0.33

0.08

0.33

Brookfield Viscosity TF spindle, 25°C, 5rpm after 680,000

2 minutes, mPa∙s

Thixotropic Index (Ti), 25°C

0.61

(Ti = log(viscosity @ 1.8s

-1

/ viscosity @ 18s

-1

)

Malcom Rheology, 10rpm, 25°C, Rate 6s

-1

1,350

Initial tack force, gF

86.4

Useful open time, hours

>24

63S4 ANTI-TOMBSTONING ALLOY

63S4 alloy offers an instant solution where tombstoning is a

particular process problem. 63S4 alloy is a blend of different

melting point alloys with a special mix of solder particle sizes.

This modification extends the melting range of the alloy

reducing the possibility that one solder deposit at a component

termination can fully reflow before the other.

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