AP-CF128ME3ER-NRJ datasheet, PDF

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AP-CF128ME3ER-NRJ: DescriptionMemory module cfiii 128mb; Categorystorage storage; File Size916KB，69 Pages; ManufacturerApacer; Environmental Compliance

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AP-CF128ME3ER-NRJ Overview

Memory module cfiii 128mb

AP-CF128ME3ER-NRJ Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Apacer
package instruction	DIE,
Reach Compliance Code	unknown
Other features	ALSO OPERATES AT 5V NOMINAL SUPPLY
JESD-30 code	R-XUUC-N50
length	42.8 mm
memory density	1073741824 bit
Memory IC Type	FLASH CARD
memory width	8
Number of functions	1
Number of terminals	50
word count	134217728 words
character code	128000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	128MX8
Package body material	UNSPECIFIED
encapsulated code	DIE
Package shape	RECTANGULAR
Package form	UNCASED CHIP
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Programming voltage	3.3 V
Maximum seat height	3.4 mm
Maximum supply voltage (Vsup)	3.465 V
Minimum supply voltage (Vsup)	3.135 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	NO LEAD
Terminal location	UPPER
Maximum time at peak reflow temperature	NOT SPECIFIED
width	36.4 mm

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Value Added

Compact Flash

Ⅲ

series

AP-CFxxxxE3XR-XXXXJ

RoHS Compliant

Value Added

Compact Flash Series

Ⅲ

Datasheet for Industrial CF

June 16, 2009

Version 1.6

Apacer Technology Inc.

4 Fl., 75 Hsin Tai Wu Rd., Sec.1, Hsichih, Taipei Hsien 221, Taiwan

Tel: +886-2-2698-2888

Fax: +886-2-2698-2889

www.apacer.com

Value Added

Compact Flash

Ⅲ

series

AP-CFxxxxE3XR-XXXXJ

Table of Contents

1. GENERAL DESCRIPTION ......................................................................................... 4

1.1 P

ERFORMANCE

-O

PTIMIZED

ONTROLLER

............................................................................................... 4

1.1.1 Power Management Unit (PMU)................................................................................................... 4

1.1.2 SRAM Buffer ................................................................................................................................. 4

2. FUNCTIONAL BLOCK ............................................................................................... 5

3. PIN ASSIGNMENTS ................................................................................................... 6

4. CAPACITY SPECIFICATION ..................................................................................... 8

4.1 P

ERFORMANCE

PECIFICATION

.............................................................................................................. 8

4.2 E

NVIRONMENTAL

PECIFICATIONS

.......................................................................................................... 9

5. FLASH MANAGEMENT ........................................................................................... 10

5.1 I

NTELLIGENT

NDURANCE

ESIGN

........................................................................................................ 10

5.1.1 Advanced wear-leveling algorithms ............................................................................................ 10

5.1.2 S.M.A.R.T. Technology............................................................................................................... 10

5.1.3 Built-in Hardware ECC................................................................................................................ 10

5.1.4 Enhanced Data Integrity ............................................................................................................. 10

5.2 I

NTELLIGENT

OWER

AILURE

ECOVERY

............................................................................................. 11

6. SOFTWARE INTERFACE ....................................................................................... 12

6.1 C

OMMAND

.................................................................................................................................... 12

6.1.1 Check-Power-Mode – E5H or 98H ............................................................................................. 14

6.1.2 Execute-Drive-Diagnostic – 90H................................................................................................. 14

6.1.3 Erase-Sector(s) – C0H ............................................................................................................... 14

6.1.4 Flush-Cache – E7H .................................................................................................................... 15

6.1.5 Format-Track – 50H.................................................................................................................... 15

6.1.6 Identify-Drive – ECH ................................................................................................................... 15

6.1.7 Idle – E3H or 97H ....................................................................................................................... 24

6.1.8 Idle-Immediate – E1H or 95H ..................................................................................................... 24

6.1.9 Initialize-Drive-Parameters – 91H............................................................................................... 24

6.1.10 NOP – 00H................................................................................................................................ 25

6.1.11 Read-Buffer – E4H ................................................................................................................... 25

6.1.12 Read DMA – C8H or C9H......................................................................................................... 25

6.1.13 Read-Multiple – C4H ................................................................................................................ 26

6.1.14 Read Sectors – 20H or 21H...................................................................................................... 27

6.1.15 Read Verify Sector(s) – 40H or 41H ......................................................................................... 27

6.1.16 Recalibrate – 1XH..................................................................................................................... 27

6.1.17 Request-sense – 03H ............................................................................................................... 28

6.1.18 Seek – 7XH............................................................................................................................... 29

6.1.19 Set-Features – EFH .................................................................................................................. 29

6.1.20 SMART – B0H .......................................................................................................................... 30

6.1.21 Set-Multiple-Mode – C6H ......................................................................................................... 33

6.1.22 Set-Sleep-Mode – E6H or 99H ................................................................................................. 34

6.1.23 Standby – E2H or 96H.............................................................................................................. 34

6.1.24 Standby-Immediate – E0H or 94H............................................................................................ 34

Rev. 1.6

Value Added

Compact Flash

Ⅲ

series

AP-CFxxxxE3XR-XXXXJ

6.1.25 Translate-Sector – 87H............................................................................................................. 35

6.1.26 Write-Buffer – E8H.................................................................................................................... 35

6.1.27 Write-DMA – CAH or CBH........................................................................................................ 36

6.1.28 Write-Multiple – C5H................................................................................................................. 36

6.1.29 Write-Multiple-Without-Erase – CDH ........................................................................................ 37

6.1.30 Write-Sector(s) – 30H or 31H ................................................................................................... 37

6.1.31 Write-Sector(s)-Without-Erase – 38H ....................................................................................... 38

6.1.32 Write-Verify – 3CH .................................................................................................................... 38

7. ELECTRICAL SPECIFICATION .............................................................................. 39

7.1 DC C

HARACTERISTICS

......................................................................................................................... 40

7.2 AC C

HARACTERISTICS

......................................................................................................................... 41

7.2.1 Attribute Memory Read Timing Specification ............................................................................. 42

7.2.2 Configuration Register (Attribute Memory) Write Specification .................................................. 43

7.2.3 Common Memory Read Timing Specification ............................................................................ 44

7.2.4 Common Memory Write Timing Specification ............................................................................ 45

7.2.5 I/O Input (Read) Timing Specification......................................................................................... 46

7.2.6 I/O Output (Write) Timing Specification ...................................................................................... 47

7.2.7 Ultra DMA Mode Data Transfer Input/Output (Read/Write) Timing............................................ 48

7.2.8 Media Side Interface I/O Timing Specifications.......................................................................... 60

8. PHYSICAL CHARACTERISTICS ............................................................................ 63

8.1 D

IMENSION

.......................................................................................................................................... 63

9. PRODUCT ORDERING INFORMATION ................................................................. 64

9.1 P

RODUCT

ODE

ESIGNATIONS

........................................................................................................... 64

9.2 V

ALID

OMBINATIONS

.......................................................................................................................... 65

Rev. 1.6

AP-CF128ME3ER-NRJ Related Products

	AP-CF128ME3ER-NRJ	AP-CF008GE3FR-ETNDNRJ	AP-CF128ME3ER-ETNDNRJ	AP-CF008GE3FR-NDNRJ	AP-CF512ME3FR-ETNRJ	AP-CF256ME3FR-NRJ
Description	Memory module cfiii 128mb	Memory module cfc iii-ET 8gb	Memory module cfc iii-ET 128mb	Memory module cfiii 8gb	Memory module cfc iii-ET 512mb	Memory module cfiii 256mb
Is it Rohs certified?	conform to	conform to	-	conform to	-	conform to
Maker	Apacer	Apacer	-	Apacer	-	Apacer
package instruction	DIE,	DIE,	-	DIE,	-	DIE,
Reach Compliance Code	unknown	unknown	-	unknown	-	unknown
Other features	ALSO OPERATES AT 5V NOMINAL SUPPLY	ALSO OPERATES AT 5V NOMINAL SUPPLY	-	ALSO OPERATES AT 5V NOMINAL SUPPLY	-	ALSO OPERATES AT 5V NOMINAL SUPPLY
JESD-30 code	R-XUUC-N50	R-XUUC-N50	-	R-XUUC-N50	-	R-XUUC-N50
length	42.8 mm	42.8 mm	-	42.8 mm	-	42.8 mm
memory density	1073741824 bit	68719476736 bit	-	68719476736 bit	-	2147483648 bit
Memory IC Type	FLASH CARD	FLASH CARD	-	FLASH CARD	-	FLASH CARD
memory width	8	8	-	8	-	8
Number of functions	1	1	-	1	-	1
Number of terminals	50	50	-	50	-	50
word count	134217728 words	8589934592 words	-	8589934592 words	-	268435456 words
character code	128000000	8000000000	-	8000000000	-	256000000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	-	ASYNCHRONOUS	-	ASYNCHRONOUS
Maximum operating temperature	70 °C	85 °C	-	70 °C	-	70 °C
organize	128MX8	8GX8	-	8GX8	-	256MX8
Package body material	UNSPECIFIED	UNSPECIFIED	-	UNSPECIFIED	-	UNSPECIFIED
encapsulated code	DIE	DIE	-	DIE	-	DIE
Package shape	RECTANGULAR	RECTANGULAR	-	RECTANGULAR	-	RECTANGULAR
Package form	UNCASED CHIP	UNCASED CHIP	-	UNCASED CHIP	-	UNCASED CHIP
Parallel/Serial	PARALLEL	PARALLEL	-	PARALLEL	-	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	-	NOT SPECIFIED
Programming voltage	3.3 V	3.3 V	-	3.3 V	-	3.3 V
Maximum seat height	3.4 mm	3.4 mm	-	3.4 mm	-	3.4 mm
Maximum supply voltage (Vsup)	3.465 V	3.465 V	-	3.465 V	-	3.465 V
Minimum supply voltage (Vsup)	3.135 V	3.135 V	-	3.135 V	-	3.135 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	-	3.3 V	-	3.3 V
surface mount	YES	YES	-	YES	-	YES
technology	CMOS	CMOS	-	CMOS	-	CMOS
Temperature level	COMMERCIAL	INDUSTRIAL	-	COMMERCIAL	-	COMMERCIAL
Terminal form	NO LEAD	NO LEAD	-	NO LEAD	-	NO LEAD
Terminal location	UPPER	UPPER	-	UPPER	-	UPPER
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	-	NOT SPECIFIED
width	36.4 mm	36.4 mm	-	36.4 mm	-	36.4 mm

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Shortcut: 00 01 02 03 04 05 06 07 08 09 0A 0C 0F 0J 0L 0M 0R 0S 0T 0Z 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F 1H 1K 1M 1N 1P 1S 1T 1V 1X 1Z 20 21 22 23 24 25 26 27 28 29 2A 2B 2C 2D 2E 2F 2G 2K 2M 2N 2P 2Q 2R 2S 2T 2W 2Z 30 31 32 33 34 35 36 37 38 39 3A 3B 3C 3D 3E 3F 3G 3H 3J 3K 3L 3M 3N 3P 3R 3S 3T 3V 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4M 4N 4P 4S 4T 50 51 52 53 54 55 56 57 58 59 5A 5B 5C 5E 5G 5H 5K 5M 5N 5P 5S 5T 5V 60 61 62 63 64 65 66 67 68 69 6A 6C 6E 6F 6M 6N 6P 6R 6S 6T 70 71 72 73 74 75 76 77 78 79 7A 7B 7C 7M 7N 7P 7Q 7V 7W 7X 80 81 82 83 84 85 86 87 88 89 8A 8D 8E 8L 8N 8P 8S 8T 8W 8Y 8Z 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9F 9G 9H 9L 9S 9T 9W

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