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GT60M303(Q)

Description
igbt transistor 900v/60a dis+frd trench
CategoryDiscrete semiconductor    The transistor   
File Size420KB,6 Pages
ManufacturerToshiba Semiconductor
Websitehttp://toshiba-semicon-storage.com/
Environmental Compliance
Download Datasheet Parametric View All

GT60M303(Q) Overview

igbt transistor 900v/60a dis+frd trench

GT60M303(Q) Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
package instructionFLANGE MOUNT, R-PSFM-T3
Contacts3
Reach Compliance Codeunknown
ECCN codeEAR99
Shell connectionCOLLECTOR
Maximum collector current (IC)60 A
Collector-emitter maximum voltage900 V
ConfigurationSINGLE WITH BUILT-IN DIODE
Maximum landing time (tf)400 ns
Gate-emitter maximum voltage25 V
JESD-30 codeR-PSFM-T3
Number of components1
Number of terminals3
Maximum operating temperature150 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formFLANGE MOUNT
Polarity/channel typeN-CHANNEL
Maximum power dissipation(Abs)170 W
Maximum rise time (tr)600 ns
surface mountNO
Terminal formTHROUGH-HOLE
Terminal locationSINGLE
transistor applicationsPOWER CONTROL
Transistor component materialsSILICON
Nominal off time (toff)600 ns
Nominal on time (ton)460 ns
Base Number Matches1
GT60M303
TOSHIBA INSULATED GATE BIPOLAR TRANSISTOR
SILICON N CHANNEL IGBT
GT60M303
HIGH POWER SWITCHING APPLICATIONS
Fourth generation IGBT
FRD included between emitter and collector
Enhancement mode type
High speed
I
GBT
: t
f
= 0.25μs (TYP.)
FRD : t
rr
= 0.7μs (TYP.)
Low saturation voltage
: V
CE (sat)
= 2.1V (TYP.)
Unit: mm
ABSOLUTE MAXIMUM RATINGS
(Ta = 25°C)
CHARACTERISTIC
Collector−Emitter Voltage
Gate−Emitter Voltage
Collector Current
Emitter−Collector
Foward Current
Collector Power Dissipation
(Tc = 25°C)
Junction Temperature
Storage Temperature Range
Screw Torque
DC
1ms
DC
1ms
SYMBOL
V
CES
V
GES
I
C
I
CP
I
ECF
I
ECFP
P
C
T
j
T
stg
RATING
900
±25
60
120
15
120
170
150
−55~150
0.8
UNIT
V
V
A
A
W
°C
°C
N·m
JEDEC
JEITA
TOSHIBA
2-21F2C
Weight: 9.75 g (typ.)
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test report
and estimated failure rate, etc).
EQUIVALENT CIRCUIT
MARKING
Part No. (or abbreviation code)
TOSHIBA
GT60M303
Lot No.
JAPAN
A line indicates
lead (Pb)-free package or
lead (Pb)-free finish.
1
2006-11-01

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