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1FRH360-762GGCS

Description
IC Socket, BGA360, 360 Contact(s),
CategoryThe connector    socket   
File Size433KB,2 Pages
ManufacturerAdvanced Interconnections Corp.
Environmental Compliance
Download Datasheet Parametric View All

1FRH360-762GGCS Overview

IC Socket, BGA360, 360 Contact(s),

1FRH360-762GGCS Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
Reach Compliance Codecompli
ECCN codeEAR99
Contact to complete cooperationGOLD OVER NICKEL
Contact completed and terminatedGold (Au) - with Nickel (Ni) barrie
Contact materialBERYLLIUM COPPER
Device slot typeIC SOCKET
Type of equipment usedBGA360
Shell materialLIQUID CRYSTAL POLYMER
JESD-609 codee4
Number of contacts360
Base Number Matches1
Flip-Top
BGA Sockets
TM
Flip-Top BGA Sockets
1.27mm and 1.00mm Pitch
Table of Models
Description:
Socket (FRG, 1.27mm pitch)
Guide Box and Base Mat’l: High Temp. Liquid
Crystal Polymer (LCP)
Index: -40°C to 260°C (-40°F to 500°F)
Description:
Socket (FRH, 1.00mm pitch)
Guide Box Mat’l: High Temp. Liquid Crystal
Polymer (LCP)
Index: -40°C to 260°C (-40°F to 500°F)
Base Mat’l: FR-4 Glass Filled Epoxy
Index: -40°C to 140°C (-40°F to 284°F)
Socket Size:
3.00mm wider and
10.00mm longer than
BGA device (for
packages larger than
15.00mm square).*
TM
Socket Size:
3.00mm wider and
10.00mm longer than
BGA device (for
packages larger than
15.00mm square).*
Features:
• Designed to save space on new
and existing PC boards in test,
development, programming and
production applications.
• No external hold-downs or
soldering of BGA device required.
• AIC exclusive solder ball terminals
offer superior processing.
• Uses same footprint as BGA device.
• Available with integral, finned heat
sink or coin screw clamp
assembly.
FRG replaces FTG.
* For device packages smaller than 15.00mm square, the socket size is X = .709/(18.00)
and Y = .984/(25.00).
How It Works
SMT models are shipped un-assembled to ease
solderability. Thru-hole models are shipped fully
assembled.
Chip support plate
(supplied)
BGA or LGA
device
Upper
assembly
Lower
assembly
1. Lower assembly is soldered to PC board with no
external hold-down mechanism. Thru-hole models may
be soldered to PC board or plugged into a mating
socket.
2. Upper assembly inserts easily to lower assembly by
aligning guide posts and installing four (supplied)
screws.
4. Lid opens easily by pressing latch.
Specifications:
Terminals:
Brass - Copper Alloy
(C36000) ASTM-B-16
Contacts:
Beryllium Copper
(C17200) ASTM-B-194
Plating:
G - Gold over Nickel
Terminal Support:
Polyimide Film
Spring Material:
Stainless Steel
Lid, Latch, Heat Sink/Coin Screw
and Support Plate Material:
Aluminum
Solder Ball:
Standard: 63Sn/37Pb
Lead-free: 95.5Sn/4.0Ag/0.5Cu
3. Finned heat sink or coin screw is screwed down to flush
with bottom of lid.
5. BGA device is inserted by aligning A1 position with
chamfered corner of Flip-Top™ socket. Place support
plate on top of device, close lid, engage heat sink or
coin screw, and socket is ready for use.
See page 15 for Generic
Reflow Profiles.
Detailed Installation and General Usage Instructions are
provided with product.
How To Order
1 FR G XXXX - 821 G G XX
Footprint Dash #
If Applicable*
Clamp Options
HS - Heat Sink (3 Fins Std.)
CS - Coin Screw
Model Type
RoHS Compliant Insulator:
FR - Flip-Top™ BGA Socket
Pitch
G = .050/(1.27mm)
H = .039/(1.00mm)
Number of Positions
*See footprints section or
online database.
Contact Plating
RoHS Compliant:
G - Gold
Terminal Plating
RoHS Compliant:
G - Gold
Terminal Type
See options
5 Energy Way, West Warwick, RI 02893 USA
Tel: 800.424.9850 | 401.823.5200
Fax: 401.823.8723
info@advanced.com | www.advanced.com
Catalog 16A
Products shown covered by patents issued and/or pending. Specifications subject to change without notice.
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