S i 3 2 1 0 / S i 3 2 11
P
RO
SLIC
®
P
ROGRAMMABLE
CMOS SLIC/C
ODEC
W I T H
R
INGING
/ B
A TT E R Y
V
OLTA GE
G
ENERATION
Features
Performs all BORSCHT functions
Software-programmable signal
generation and audio processing
Software-programmable internal balanced
DTMF generation and decoding
ringing up to 90 V
PK
12 kHz/16 kHz pulse metering generation
(5 REN up to 4 kft, 3 REN up to 8 kft)
Phase-continuous FSK (caller ID)
Integrated battery supply with dynamic
generation
voltage output (Si3210)
On-chip
dc-dc converter continuously
minimizes power in all operating modes
Entire solution can be powered from a single
3.3 or 5 V supply
3.3 to 35 V dc input range
Dynamic 0 to –94.5 V output
Low-cost inductor and high-efficiency
transformer versions supported
Dual
audio tone generators
Smooth and abrupt polarity reversal
µ-Law/A-Law and 16-bit linear PCM
audio
Multiple
Ordering Information
See page 129.
Extensive test and diagnostic features
voice loopback test modes
Real-time dc linefeed measurement
GR-909 line test capabilities
TSSOP Pin Assignments
Ringing frequency, amplitude, cadence, and
Software-programmable linefeed
parameters
Applications
waveform
2-wire ac impedance and hybrid
Constant current feed (20 to 41 mA)
Loop closure and ring trip thresholds and
filtering
SPI and PCM bus digital interfaces
Extensive programmable interrupts
100% software-configurable global
solution
Ideal for customer premise equipment
applications
RoHS-compliant packages available
Si3210/11
CS
INT
PCLK
DRX
DTX
FSYNC
RESET
SDCH/DIO1
SDCL/DIO2
V
DDA1
IREF
CAPP
QGND
CAPM
STIPDC
SRINGDC
STIPE
SVBAT
SRINGE
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
SCLK
SDI
SDO
SDITHRU
DCDRV/DCSW
DCFF/DOUT
TEST
GNDD
VDDD
ITIPN
ITIPP
V
DDA2
IRINGP
IRINGN
IGMP
GNDA
IGMN
SRINGAC
STIPAC
Voice-over-broadband systems:
DSL, codec, wireless
PBX/IP-PBX/key telephone systems
Terminal adapters:
ISDN, Ethernet, USB
Description
The ProSLIC
®
is a low-voltage CMOS device that provides a complete analog
telephone interface ideal for customer premise equipment (CPE) applications. The
ProSLIC integrates a subscriber line interface circuit (SLIC), codec, and battery
generation functionality into a single CMOS integrated circuit. The integrated battery
supply continuously adapts its output voltage to minimize power and enables the entire
solution to be powered from a single 3.3 V (Si3210M/Si3211M only) or 5 V supply. The
ProSLIC controls the phone line through Silicon Labs’ Si3201 Linefeed Interface Chip.
Si3210 features include software-configurable 5 REN internal ringing up to 90 V
PK
,
DTMF generation and decoding, and a comprehensive set of telephony signaling
capabilities for operation with only one hardware solution. The ProSLIC is packaged in
a 38-pin QFN and TSSOP, and the Si3201 is packaged in a thermally-enhanced 16-pin
SOIC.
U.S. Patent #6,567,521
U.S. Patent #6,812,744
Other patents pending
Functional Block Diagram
INT
RESET
Si3210/11
Line
Status
CS
SCLK
SDO
SDI
DTX
Control
Interface
Compression
DTMF
Decode
Gain/
Attenuation/
Filter
Tone
Generators
Gain/
Attenuation/
Filter
D/A
A/D
TIP
Line
Feed
Control
Linefeed
Interface
RING
Z
S
DRX
PCM
Interface
Expansion
Prog.
Hybrid
FSYNC
PCLK
PLL
DC-DC Converter Controller
(Si3210 only)
Discrete
Components
Rev. 1.45 1/09
Copyright © 2009 by Silicon Laboratories
Si3210
Si3210/Si3211
2
Rev. 1.45
Si3210/Si3211
T
ABLE
Section
OF
C
ONTENTS
Page
1. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
2. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
2.1. Linefeed Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
2.2. Battery Voltage Generation and Switching . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
2.3. Tone Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
2.4. Ringing Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
2.5. Pulse Metering Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
2.6. DTMF Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .47
2.7. Audio Path . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
2.8. Two-Wire Impedance Matching . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
2.9. Clock Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
2.10. Interrupt Logic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51
2.11. Serial Peripheral Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
2.12. PCM Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
2.13. Companding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
3. Control Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .59
4. Indirect Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .117
4.1. DTMF Decoding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .117
4.2. Oscillators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119
4.3. Digital Programmable Gain/Attenuation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121
4.4. SLIC Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122
4.5. FSK Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .124
5. Pin Descriptions: Si3210/11 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125
6. Pin Descriptions: Si3201 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128
7. Ordering Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129
8. Package Outline: 38-Pin QFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131
9. Package Outline: 38-Pin TSSOP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132
10. Package Outline: 16-Pin ESOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133
Document Change List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135
Contact Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .138
Rev. 1.45
3
Si3210/Si3211
1. Electrical Specifications
Table 1. Absolute Maximum Ratings and Thermal Information
1
Parameter
Symbol
Si3210/11
DC Supply Voltage
Input Current, Digital Input Pins
Digital Input Voltage
Operating Temperature Range
2
Storage Temperature Range
TSSOP-38 Thermal Resistance, Typical
QFN-38 Thermal Resistance, Typical
Continuous Power Dissipation
2
Si3201
DC Supply Voltage
Battery Supply Voltage
Input Voltage: TIP, RING, SRINGE, STIPE pins
Input Voltage: ITIPP, ITIPN, IRINGP, IRINGN pins
Operating Temperature Range
2
Storage Temperature Range
SOIC-16 Thermal Resistance, Typical
3
Continuous Power Dissipation
2
Value
Unit
V
DDD
, V
DDA1
, V
DDA2
I
IN
V
IND
T
A
T
STG
JA
JA
P
D
V
DD
V
BAT
V
INHV
V
IN
T
A
T
STG
JA
P
D
–0.5 to 6.0
±10
–0.3 to (V
DDD
+ 0.3)
–40 to 100
–40 to 150
70
35
0.7
V
mA
V
C
C
C/W
C/W
W
–0.5 to 6.0
–104
(V
BAT
– 0.3) to (V
DD
+ 0.3)
–0.3 to (V
DD
+ 0.3)
–40 to 100
–40 to 150
55
0.8 at 70 °C
0.6 at 85 °C
V
V
V
V
C
C
C/W
W
Notes:
1.
Permanent device damage may occur if the absolute maximum ratings are exceeded. Functional operation should be
restricted to the conditions as specified in the operational sections of this data sheet. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
2.
Operation above 125 °C junction temperature may degrade device reliability.
3.
Thermal resistance assumes a multi-layer PCB with the exposed pad soldered to a topside PCB pad.
4
Rev. 1.45
Si3210/Si3211
Table 2. Recommended Operating Conditions
Parameter
Ambient Temperature
Ambient Temperature
Si3210/11 Supply Voltage
Si3201 Supply Voltage
Si3201 Battery Voltage
Symbol
T
A
T
A
V
DDD
,V
DDA1
,
V
DDA2
V
DD
V
BAT
V
BATH
= V
BAT
Test Condition
K-grade
B-grade
Min*
0
–40
3.13
3.13
–96
Typ
25
25
3.3/5.0
3.3/5.0
—
Max*
70
85
5.25
5.25
–10
Unit
°
C
°
C
V
V
V
*Note:
All minimum and maximum specifications are guaranteed and apply across the recommended operating conditions.
Typical values apply at nominal supply voltages and an operating temperature of 25 °C unless otherwise stated.
Product specifications are only guaranteed for the typical application circuit (including component tolerances).
Table 3. AC Characteristics
(V
DDA
, V
DDD
= 3.13 to 5.25 V, T
A
= 0 to 70 °C for K-Grade, –40 to 85 °C for B-Grade)
Parameter
Test Condition
TX/RX Performance
Min
Typ
Max
Unit
Overload Level
Single Frequency Distortion
1
THD = 1.5%
2-wire – PCM or
PCM – 2-wire:
200 Hz–3.4 kHz
200 Hz to 3.4 kHz
D/A or A/D 8-bit
Active off-hook, and OHT,
any ZAC
0 dBm0, Active off-hook,
and OHT, any Zac
2-wire to PCM, 1014 Hz
PCM to 2-wire, 1014 Hz
2.5
—
—
—
—
–45
V
PK
dB
Signal-to-(Noise + Distortion) Ratio
2
Figure 1
—
—
Audio Tone Generator
Signal-to-Distortion Ratio
2
Intermodulation Distortion
Gain Accuracy
2
Gain Accuracy over Frequency
Group Delay over Frequency
45
—
–0.5
–0.5
Figure 3,4
Figure 5,6
—
—
0
0
—
—
—
–45
0.5
0.5
—
—
dB
dB
dB
dB
Gain Tracking
3
1014 Hz sine wave,
reference level –10 dBm
signal level:
3 to –37 dB
–37 to –50 dB
–50 to –60 dB
–0.25
–0.5
–1.0
—
–0.017
—
—
—
1100
—
0.25
0.5
1.0
—
0.017
dB
dB
dB
µs
dB
Round-Trip Group Delay
Gain Step Accuracy
at 1000 Hz
–6 to +6 dB
Rev. 1.45
5
Microcontroller MCU
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