8S256-55/BXCJC datasheet, PDF - EEWORLD Datasheet

8S256-55/BXCJC: DescriptionMEMORY MODULE,SRAM,256KX8,HYBRID,DIP,32PIN,CERAMIC; Categorystorage storage; File Size448KB，6 Pages; ManufacturerFREESCALE (NXP)

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8S256-55/BXCJC Overview

MEMORY MODULE,SRAM,256KX8,HYBRID,DIP,32PIN,CERAMIC

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Objectid	105359102
package instruction	DIP, DIP32,.6
Reach Compliance Code	unknown
ECCN code	3A001.A.2.C
YTEOL	0
Maximum access time	55 ns
I/O type	COMMON
JESD-30 code	R-XDIP-T32
JESD-609 code	e0
memory density	2097152 bit
Memory IC Type	SRAM MODULE
memory width	8
Number of terminals	32
word count	262144 words
character code	256000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	256KX8
Output characteristics	3-STATE
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP32,.6
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Filter level	38535Q/M;38534H;883B
Maximum standby current	0.035 A
Minimum standby current	4.5 V
Maximum slew rate	0.095 mA
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	HYBRID
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

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