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ERTJ1VR332K

Description
NTC Thermistor, 3300ohm, Surface Mount, CHIP
CategoryPassive components    The resistor   
File Size572KB,8 Pages
ManufacturerPanasonic
Websitehttp://www.panasonic.co.jp/semicon/e-index.html
Environmental Compliance  
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ERTJ1VR332K Overview

NTC Thermistor, 3300ohm, Surface Mount, CHIP

ERTJ1VR332K Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
Objectid1503200008
package instructionCHIP
Reach Compliance Codecompliant
Country Of OriginJapan
ECCN codeEAR99
YTEOL7.75
JESD-609 codee3
Manufacturer's serial numberERTJ
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
Package shapeRECTANGULAR PACKAGE
resistance3300 Ω
Resistor typeNTC THERMISTOR
surface mountYES
Terminal surfaceTIN
Terminal locationDUAL
Terminal shapeWRAPAROUND
Thermal sensitivity index4300 K
Thermistor ApplicationsTEMPERATURE COMPENSATION
Tolerance10%

ERTJ1VR332K Preview

NTC Thermistors (Chip Type)
Multilayer Chip NTC Thermistors
Type:
ERTJ
The Multilayer Chip NTC Thermistors are especially
designed for surface mountings featuring the minia-
ture sizes of "0402" and "0603" type (EIA) with highly
reliable multilayer and monolithic structure.
n
Features
l
Highly reliable multilayer / monolithic structure
l
Superior heat resistance to reflow soldering and
excellent solderability thanks to the unique exter-
nal electrodes of three metallic layers
l
Wide ranges of operating temperature (Ð40 to 125 ¡C)
l
Low Capacitance (less 3pF)
n
Recommended Applications
l
Cellular Phone
¥ Temperature compensation for Crystal Oscillator
¥ Temperature compensation for Semiconductor
l
Personal Computer
¥ Temperature detection for CPU and memory
device
¥ Temperature compensation for Ink-viscosity (Inkjet
Printer)
l
Battery Pack
¥ Temperature detection for battery cell
l
Liquid Crystal Display
¥ Temperature compensation for contrast
¥ Temperature compensation for Back light
n
Explanation of Part Numbers
E
R
T
Product Code
Shape
Size Type
(EIA)
Packaging Styles
Center of B Value (K)
Resistance R
25
( )
Resistance Tolerance
Special
Specification
n
Construction
No
)
*
+
,
-
Name
Ceramic Semiconductor
Inner electrode
Substrate electrode
Intermediate electrode
External electrode
NTC Thermistors (Chip Type)
n
Dimensions in mm (not to scale)
L
1.00±0.10
1.60±0.15
W
0.50±0.05
0.80±0.10
T
0.50±0.05
0.80±0.10
L
1
, L
2
0.20±0.10
0.30±0.20
Size Code (EIA)
ÒJ0Ó Type (0402)
ÒJ1Ó Type (0603)
n
Packaging Specifications
l
Standard Packing Quantity
Style
Size Code
Thickness
l
Reel for Taping
Paper taping
Pitch 2 mm: 10000 pcs./reel
Pitch 4 mm: 4000 pcs./reel
J0 (0402)
J1 (0603)
0.5 mm
0.8 mm
l
Paper Taping
P
1
: 2mm
Symbol
Dim.
(mm)
A
B180
0
Ð3
B
C
D
E
W
W
1
B60.0
±0.5
13.0
±0.5
21.0
±0.8
2.0
±0.5
9.0
±0.3
11.4
±1.0
l
Leader Part and Taped End
Siz eCode
Symbol
A
B
W
F
E
P
1
P
2
P
0
BD
0
t
1
t
2
Dim.
J0
0.65 1.15 8.0 3.50 1.75 2.00 2.00 4.0 1.5 0.7 1.0
(mm) (0402) ±0.05 ±0.05 ±0.2 ±0.05 ±0.10 ±0.05 ±0.05 ±0.1 +0.1 max. max.
0
P
1
: 4mm
Leader part
Siz eCode
Symbol
A
B
W
F
E
P
1
P
2
P
0
BD
0
t
1
t
2
Dim.
J1
1.10 1.90 8.0 3.50 1.75 4.0 2.00 4.0 1.5 1.1 1.4
(mm) (0603) ±0.10 ±0.10 ±0.2 ±0.05 ±0.10 ±0.1 ±0.05 ±0.1 +0.1 max. max.
0
n
Ratings and Characteristics
Size Code
Ò10Ó Type
(1005)
Ò11Ó Type
(1608)
Part No.
ERTJ0EG103
]
ERTJ0ES104
ERTJ1VS104
]
]
l
Narrow Tolerance Type (Resistance Tolerance: ±2 %, ±1 %)
Zero-Power
Resistance
(at 25 ¡C)
10 k9
100 k9
10 kW
100 k9
B Value
B
25/50
(3375 K)
(4330 K)
(3375 K)
(4330 K)
B
25/85
3435 K±1%
4390 K±1%
3435 K±1%
4390 K±1%
Heat
]]
Operating Resistance
Dissipation Temperature to Soldering
Constant
Range
Heat
.. 2
=
(mW/¡C)
.
= 3
.
(mW/¡C)
Ð40 ¡C to
125 ¡C
270±5 ¡C
3±0.5 sec.
ERTJ1VG103
]
NTC Thermistors (Chip Type)
n
Ratings and Characteristics
l
Standard Type (Resistance Tolerance: ±10 %, ± 5%, ±3 %)
Size Code
(EIA)
Part No.
ERTJ0EA220
]
ERTJ0EA330
]
ERTJ0EA400
]
ERTJ0EA470
]
ERTJ0EA680
]
ERTJ0EA101
]
ERTJ0EA151
]
ERTJ0ET102
]
ERTJ0ET152
]
ERTJ0ET202
]
ERTJ0ET222
]
ERTJ0ET302
]
ERTJ0ET332
]
ERTJ0ET472
]
ERTJ0ER332
]
ERTJ0ER472
]
ERTJ0ER682
]
ERTJ0ER103
]
ERTJ0ER153
]
ERTJ0ER223
]
ERTJ0ER333
]
ERTJ0EP473
]
ERTJ0EV473
]
ERTJ0EV683
]
ERTJ0EV104
]
ERTJ0EV154
]
ERTJ1VA220
]
ERTJ1VA330
]
ERTJ1VA400
]
ERTJ1VA470
]
ERTJ1VA680
]
ERTJ1VA101
]
ERTJ1VT102
]
ERTJ1VT152
]
ERTJ1VT202
]
ERTJ1VT222
]
ERTJ1VT302
]
ERTJ1VT332
]
ERTJ1VT472
]
ERTJ1VR332
]
ERTJ1VR472
]
ERTJ1VR682
]
ERTJ1VR103
]
ERTJ1VR153
]
ERTJ1VR223
]
ERTJ1VR333
]
ERTJ1VR473
]
ERTJ1VR683
]
ERTJ1VP473
]
ERTJ1VV473
]
ERTJ1VV683
]
ERTJ1VV104
]
ERTJ1VV154
]
Zero-Power
Resistance
(at 25 ¡C)
22
9
33
9
40
9
47
9
68
9
100
9
150
9
1 k9
1.5 k9
2.0 k9
2.2 k9
3.0 k9
3.3 k9
4.7 k9
3.3 k9
4.7 k9
6.8 k9
10 k9
15 k9
22 k9
33 k9
47 k9
47 k9
68 k9
100 k9
150 k9
22
9
33
9
40
9
47
9
68
9
100
9
1 k9
1.5 k9
2.0 k9
2.2 k9
3.0 k9
3.3 k9
4.7 k9
3.3 k9
4.7 k9
6.8 k9
10 k9
15 k9
22 k9
33 k9
47 k9
68 k9
47 k9
47 k9
68 k9
100 k9
150 k9
B Value
B
25
/
50
2750 K±3 %
B
25
/
85
(2700 K)
Heat
Dissipation
Constant
Operating Resistance
Temperature to Soldering
Heat
Range
2800 K±3 %
(2750 K)
4500 K±2 %
(4450 K)
Approximately
2 mw/¡C
ÒJ0Ó
(0402)
4250 K±2 %
(4300 K)
4050 K±2 %
4700 K±2 %
2750 K±3 %
2800 K±3 %
(4100 K)
(4750 K)
(2700 K)
(2750 K)
Ð40 ¡C to
125 ¡C
Soldering
temp.
270±5 ¡C
Dipping
Time:
3.0±0.5
sec.
4500 K±2 %
(4450 K)
ÒJ1Ó
(0603)
Approximately
3 mw/¡C
4250 K±2 %
(4300 K)
4050 K±2 %
4700 K±2 %
(4100 K)
(4750 K)
]
]]
Resistance Tolerance
Mounted on a glass epoxy board (1.6t)
B25/50=
B25/85=
kn
(R
25
/R
50
)
1/298.15Ð1/323.15
kn
(R
25
/R
85
)
1/298.15Ð1/358.15
R
25
=Resistance at 25.0±0.1 ¡C
R
50
=Resistance at 50.0±0.1 ¡C
R
85
=Resistance at 85.0±0.1 ¡C
NTC Thermistors (Chip Type)
l
Resistance ratios to R25 at each temperature
ERTJA ERTJA ERTJT
T(¡C)
Ð40
Ð35
Ð30
Ð25
Ð20
Ð15
Ð10
Ð5
0
5
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
100
105
110
115
120
125
]
B25/85
ERTJR
(4250 K)
typical
42.791
30.248
21.628
15.635
11.420
8.424
6.271
4.710
3.567
2.723
2.096
1.626
1.271
1
0.7923
0.6318
0.5069
0.4090
0.3319
0.2710
0.2224
0.1834
0.1520
0.1266
0.1059
0.08894
0.07507
0.06361
0.05412
0.04622
0.03962
0.03408
0.02941
0.02547
ERTJP
(4050 K)
typical
36.401
26.052
18.865
13.813
10.219
7.636
5.759
4.382
3.362
2.600
2.026
1.591
1.257
1
0.8006
0.6450
0.5229
0.4264
0.3496
0.2882
0.2388
0.1989
0.1664
0.1398
0.1180
0.1000
0.08511
0.07271
0.06235
0.05366
0.04634
0.04015
0.03490
0.03043
ERTJV
(4700 K)
typical
59.797
41.298
28.758
20.267
14.428
10.368
7.519
5.500
4.056
3.015
2.260
1.709
1.302
1
0.7733
0.6022
0.4720
0.3723
0.2954
0.2358
0.1894
0.1530
0.1242
0.1014
0.08322
0.06862
0.05684
0.04731
0.03956
0.03322
0.02801
0.02371
0.02015
0.01719
ERTJG
]
ERTJS
]
(2750 K)
typical
12.965
10.177
8.060
6.438
5.184
4.205
3.436
2.826
2.340
1.949
1.634
1.379
1.171
1
0.8585
0.7409
0.6425
0.5598
0.4899
0.4286
0.3774
0.3345
0.2982
0.2674
0.2411
0.2185
0.1980
0.1801
0.1645
0.1507
0.1386
0.1279
0.1183
0.1098
(2800 K)
typical
13.583
10.615
8.372
6.660
5.341
4.317
3.514
2.880
2.376
1.973
1.649
1.387
1.174
1
0.8562
0.7369
0.6373
0.5539
0.4838
0.4220
0.3708
0.3279
0.2918
0.2611
0.2350
0.2125
0.1923
0.1746
0.1592
0.1456
0.1337
0.1232
0.1138
0.1055
(4500 K)
typical
62.936
42.679
29.347
20.445
14.421
10.291
7.425
5.414
3.987
2.964
2.226
1.689
1.294
1
0.7795
0.6127
0.4852
0.3872
0.3111
0.2517
0.2049
0.1679
0.1385
0.1148
0.09570
0.08021
0.06766
0.05735
0.04884
0.04177
0.03588
0.03094
0.02679
0.02328
(3435 K)
typical
(4390 K)
typical
20.238
15.292
11.669
8.988
6.984
5.472
4.322
3.439
2.755
2.221
1.803
1.473
1.210
1
0.8309
0.6941
0.5826
0.4914
0.4164
0.3543
0.3027
0.2596
0.2233
0.1928
0.1670
0.1451
0.1260
0.1097
0.09570
0.08370
0.07338
0.06448
0.05678
0.05011
45.549
32.019
22.774
16.379
11.904
8.738
6.475
4.841
3.650
2.773
2.124
1.640
1.276
1
0.7889
0.6265
0.5006
0.4024
0.3253
0.2645
0.2162
0.1776
0.1467
0.1217
0.1014
0.08486
0.07137
0.06027
0.05111
0.04350
0.03717
0.03187
0.02743
0.02368
NTC Thermistors (Chip Type)
Multilayer Chip NTC Thermistors
Handling Precautions
S
afety Precautions
The Multilayer Chip NTC Thermistors (hereafter referred to as
ÒThe ThermistorsÓ)
may fail
through burnout,
flaming or
glowing in the worst case, when subjected to severe conditions of electrical, environmental and/or
mechanical stresses.
The following
Ò
Safety Precautions
Ó and ÒApplication Notes"
should be studied carefully by you. If
you have a
question
about the
Handling Precautions, please
contact our engineering section or factory.
1.
Operating Conditions and Circuit Design
In applications
using Thermistors,
equipment should be
protected against deterioration and failure of the
Thermistors.
The Thermistors, should not be operated beyond the
specified Maximum Permissible power, otherwise,
burnout and
damage due to thermal
run away may
result.
(if operated in ambient temperatures
above 25 ¡C, power rating should be derated in
accordance with the derating curve.)
In applications using the Thermistor for
temperature detection, the accuracy of the
detection may be greatly influenced by the self
heat generation and heat dissipation of the
Thermistor, even if the Thermistor is operated
under the specified Maximum Permissible Power.
Take into account the Heat Dissipation
Constant and the specified Maximum Permissible
Power before use.
The safety and reliability should be checked in your
circuit.
1.1 Fail-Safe Design for Equipment
2.2 Design of Land Pattern
1.2 Operating Power
(1) Recommended Dimensions of Lands: As shown
in Table 1 and Fig.1.
Notes:
]
Too large land requires excess amount
of solder.
]]
The Dimensions shall be symetrical
Fig.1 Recommended Land Dimensions
Table 1 Recommended Land Dimensions in mm
Size
Code
(EIA)
Components
Dimensions
L
W
T
0.8
0.5
Land Dimensions
for Flow Soldering
a
Ñ
b
Ñ
c
Ñ
Land Dimensions
for Reflow Soldering
a
b
c
1.3 Restriction on Environmental Conditions
J1 (0603) 1.6 0.8
J0 (0402) 1.0 0.5
0.8Ð1.0 2.0Ð2.6 0.6Ð0.8 0.8Ð1.0 2.0Ð2.6 0.8Ð1.0
0.5Ð0.6 1.5Ð1.7 0.5Ð0.6
The Thermistors should not be operated and/or
stored under
the following
environmental conditions:
a)
Exposed
directly to water or salt water.
b)
Exposed
directly to sunlight.
c) Conditions
of dew formation.
d)
Conditions
of corrosive atmospheres such
as hydrogen sulfide, sulfurous acid, chlorine, or
ammonia etc.
e)
Severe
conditions of extreme vibration
or shock.
(2) Recommended amount of solder
Recommended amount of solder: As shown in
Fig.2
Excess amount of solder gives large mechanical
stresses to the Thermistors/components.
Fig.2 Recommended Amount of Solder
2.
Design of Printed Circuit Board
When the Thermistors are mounted and soldered
on an ÒAluminum SubstrateÓ, the substrate
influences
the
Thermistors' reliability
against
ÒTemperature CyclesÓ and ÒHeat shockÓ because
of
the difference
of
the thermal
expansion
coefficients
between them. It should be carefully confirmed that
the actual board
used
does not deteriorate the
characteristics of the Thermistors.
2.1 Selection of Printed Circuit Boards
×
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