A range of dc rated multi-layer chip capacitors from
0.47pF to 22µF and in case sizes 0603 to 8060 in
C0G/NP0 and X7R dielectrics. Suitable for all general
purpose and high reliability applications where package
size and reliability are important. All are manufactured
using Syfer’s unique wet process and incorporate
precious metal electrodes.
Dissipation Factor
Ageing Rate
Range Dimensions – Standard MLCC Ranges
Length
(L1)
mm/inches
1.6 ± 0.2
0.063 ± 0.008
2.0 ± 0.3
0.08 ± 0.012
3.2 ± 0.3
0.126 ± 0.012
3.2 ± 0.3
0.126 ± 0.012
4.5 ± 0.35
0.18 ± 0.014
4.5 ± 0.35
0.18 ± 0.014
4.5 ± 0.35
0.18 ± 0.014
5.7 ± 0.4
0.225 ± 0.016
5.7 ± 0.4
0.225 ± 0.016
9.2 ± 0.5
0.36 ± 0.02
14.0 ± 0.5
0.55 ± 0.02
20.3 ± 0.5
0.8 ± 0.02
Width
(W)
mm/inches
0.8 ± 0.2
0.031 ± 0.008
1.25 ± 0.2
0.05 ± 0.008
1.6 ± 0.2
0.063 ± 0.008
2.5 ± 0.3
0.1 ± 0.012
2.0 ± 0.3
0.08 ± 0.012
3.2 ± 0.3
0.126 ± 0.012
6.30 ± 0.4
0.25 ± 0.016
5.0 ± 0.4
0.197 ± 0.016
6.3 ± 0.4
0.25 ± 0.016
10.16 ± 0.5
0.4 ± 0.02
12.7 ± 0.5
0.5 ± 0.02
15.24 ± 0.5
0.6 ± 0.02
Max. Thickness
(T)
mm/inches
0.8
0.013
1.3
0.051
1.6
0.063
2.0
0.08
2.0
0.08
2.5
0.1
2.5
0.1
4.2
0.16
4.2
0.16
2.5
0.1
4.2
0.16
2.5
0.1
Termination Band
(L2)
mm/inches
min
0.10
0.004
0.13
0.005
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.5
0.02
0.5
0.02
0.5
0.02
max
0.40
0.015
0.75
0.03
0.75
0.03
0.75
0.03
1.0
0.04
1.0
0.04
1.0
0.04
1.0
0.04
1.0
0.04
1.5
0.06
1.5
0.06
1.5
0.06
Size
0603
0805
1206
1210
1808
1812
1825
2220
2225
3640
5550
8060
Custom chip sizes not included in the table, but larger than 2225, can be considered with minimum tooling charges. Please refer specific requests direct to the sales office.
Max thickness relates to standard components and actual thickness may be considerably less. Thicker parts, or components with reduced maximum thickness, can be considered by request – please refer
P89C51RB2/RC2/RD2 has 16K32K64K parallel programmable non-volatile FLASH program memory, and can realize serial in-system programming and in-application programming of the device. In-system programmin...
[align=left][font=宋体][size=4] The first time I came into contact with digital and analog electronics was in the course design after finishing the digital and analog electronics course in my sophomore ...
[size=5]Recommendations for high-quality books on embedded development (Twenty-six) ---[color=rgb(0, 0, 0)][backcolor=rgb(237, 235, 235)][font=微软雅黑][b]ARM Embedded System Development: Software Design ...
[p=30, null, left][font=宋体][font=Verdana][color=#000000]What is LED flip chip? [/color][/font][/font][/p][p=30, null, left][font=宋体][font=Verdana][color=#000000]In the field of chips, flip chip techno...
No need to explain, just read it yourself, experts see the doorway, laymen see the excitement,http://www.st.com/mcu/inchtml-pages-stmtouch.htmlSTMTouch At your fingertips - final version.jpg(147.21 KB...
System design is a complex process. It is not enough to just use ICs. There are many details to consider. This article uses a high-fidelity music playback system as an example to introduce how to s...[Details]
In recent years, with the rapid development of the information industry, dot matrix LED display screens have been widely used in various advertising and information display systems such as the fina...[Details]
introduction
MEMS is a high-tech that has flourished on the basis of integrated circuit production technology and dedicated micro-electromechanical processing methods. Pressure sensors develop...[Details]
Problems such as the depletion of natural resources, air pollution, traffic congestion, and rising fossil fuel prices have forced societies and individuals to seek alternative means of transportati...[Details]
In today's body control module (BCM) designs, savvy engineers are moving away from electromechanical relays whenever possible. Their next step is to eliminate fuses. But is eliminating fuses a nece...[Details]
Motors, especially those with brushes, generate a lot of noise. This noise must be dealt with if the appliance is to meet the requirements of EMC standards. The means to solve EMC are nothing more ...[Details]
Today, the value of electronic components in cars accounts for 15-20% of the total vehicle. In the future, this proportion may be as high as 30-40% as more safety electronics, fuel consumption and ...[Details]
In the "digital pressure measurement" experimental device of applied physics, the subject technical knowledge of analog circuits, digital circuits, sensors and single-chip microcomputers is used. In o...[Details]
With the continuous advancement of various technologies in the field of measurement and control, the baseband subsystem of general measurement and control equipment has entered the fourth generation o...[Details]
Abstract: Based on the ZigBee parking lot SMS car search system, the location of the vehicle in the parking lot is sent to the owner through SMS, which is convenient for the owner to quickly find ...[Details]
LED is the abbreviation of the English word. Its main meanings are: LED = Light Emitting Diode, a solid-state semiconductor device that can convert electrical energy into visible light. It can dire...[Details]
People who often surf the Internet until late at night, their families always complain that turning on the big lights in the living room affects their rest, but some people don't have keyboard ligh...[Details]
The most important components of new energy electric vehicles are power batteries, electric motors and energy conversion control systems. The power battery must achieve high performance such as fas...[Details]
The automotive power electronics market has grown rapidly as comfort and active safety features become more common. As traditional mechanical functions shift to electronic applications, the demand ...[Details]
1 Introduction
CAN (Controller Area Network) bus is a kind of field bus. It is used in many industrial sectors due to its outstanding advantages such as high performance, high reliability, high...[Details]