A range of dc rated multi-layer chip capacitors from
0.47pF to 22µF and in case sizes 0603 to 8060 in
C0G/NP0 and X7R dielectrics. Suitable for all general
purpose and high reliability applications where package
size and reliability are important. All are manufactured
using Syfer’s unique wet process and incorporate
precious metal electrodes.
Dissipation Factor
Ageing Rate
Range Dimensions – Standard MLCC Ranges
Length
(L1)
mm/inches
1.6 ± 0.2
0.063 ± 0.008
2.0 ± 0.3
0.08 ± 0.012
3.2 ± 0.3
0.126 ± 0.012
3.2 ± 0.3
0.126 ± 0.012
4.5 ± 0.35
0.18 ± 0.014
4.5 ± 0.35
0.18 ± 0.014
4.5 ± 0.35
0.18 ± 0.014
5.7 ± 0.4
0.225 ± 0.016
5.7 ± 0.4
0.225 ± 0.016
9.2 ± 0.5
0.36 ± 0.02
14.0 ± 0.5
0.55 ± 0.02
20.3 ± 0.5
0.8 ± 0.02
Width
(W)
mm/inches
0.8 ± 0.2
0.031 ± 0.008
1.25 ± 0.2
0.05 ± 0.008
1.6 ± 0.2
0.063 ± 0.008
2.5 ± 0.3
0.1 ± 0.012
2.0 ± 0.3
0.08 ± 0.012
3.2 ± 0.3
0.126 ± 0.012
6.30 ± 0.4
0.25 ± 0.016
5.0 ± 0.4
0.197 ± 0.016
6.3 ± 0.4
0.25 ± 0.016
10.16 ± 0.5
0.4 ± 0.02
12.7 ± 0.5
0.5 ± 0.02
15.24 ± 0.5
0.6 ± 0.02
Max. Thickness
(T)
mm/inches
0.8
0.013
1.3
0.051
1.6
0.063
2.0
0.08
2.0
0.08
2.5
0.1
2.5
0.1
4.2
0.16
4.2
0.16
2.5
0.1
4.2
0.16
2.5
0.1
Termination Band
(L2)
mm/inches
min
0.10
0.004
0.13
0.005
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.5
0.02
0.5
0.02
0.5
0.02
max
0.40
0.015
0.75
0.03
0.75
0.03
0.75
0.03
1.0
0.04
1.0
0.04
1.0
0.04
1.0
0.04
1.0
0.04
1.5
0.06
1.5
0.06
1.5
0.06
Size
0603
0805
1206
1210
1808
1812
1825
2220
2225
3640
5550
8060
Custom chip sizes not included in the table, but larger than 2225, can be considered with minimum tooling charges. Please refer specific requests direct to the sales office.
Max thickness relates to standard components and actual thickness may be considerably less. Thicker parts, or components with reduced maximum thickness, can be considered by request – please refer
[i=s] This post was last edited by 不足论 on 2017-1-7 16:44 [/i] Course link: [url=https://training.eeworld.com.cn/course/3580/learn?iscs=1#lesson/7070]https://training.eeworld.com.cn/course/3580/learn?i...
Provide S5PC100 development board and related product customization. The S5PC100 development board uses Samsung S5PC100, whose core is ARMcortex A8. iPhone 3G uses S5PC100, but the mark is different. ...
Generally speaking, the principle of adding constraints is to add global constraints first, then add local constraints, and local constraints are relatively loose. The purpose is to relax constraints ...
After improvement after improvement, RF MEMS technology may finally make waves in the electronics market this year, thanks to recent improvements in manufacturing processes and device reliability. How...
China's new energy vehicles are in a transition period from research and development to real industrial development. In 2012, with the intensive launch of new energy vehicle policy planning, the de...[Details]
In this article, the high-performance DSP developed by TI can be used as an effective confidentiality method if it is applied to PC encryption cards.
As an effective network security solution,...[Details]
Abstract: In order to generate a stable excitation signal, the design of a digital frequency synthesizer is implemented on FPGA using Verilog hardware language. The design includes accumulator, wav...[Details]
As cellular phones become more advanced, the power consumption of the system during operation and the power consumption during standby are also increasing. Therefore, the power management design of...[Details]
1. Principle of displacement angle sensor
The angle sensor is used to detect angles. It has a hole in its body that fits the LEGO axle. When connected to the RCX, the angle sensor counts once ...[Details]
Contact resistance
is the resistance to current flow through a closed pair of contacts. This type of measurement is performed on devices such as connectors,
relays
, and switches. The...[Details]
Product series: PB-B-RS232/485 interface (hereinafter sometimes referred to as "interface") is a product in the PROFIBUS bus bridge series.
The main purpose of the bridge series ...[Details]
1 Introduction to HART Protocol
HART (Highway Addressable Remote Transducer), an open communication protocol for addressable remote sensor high-speed channels, was launched by Rosemen in the U...[Details]
In recent years, with the rapid development of the information industry, dot matrix LED display screens have been widely used in various advertising and information display systems such as the fina...[Details]
This controller uses PIC16C54 single-chip microcomputer as the controller, and it is very easy to use: just connect a telephone line to the loudspeaker through the controller, and you can rem...[Details]
Today, the value of electronic components in cars accounts for 15-20% of the total vehicle. In the future, this proportion may be as high as 30-40% as more safety electronics, fuel consumption and ...[Details]
Corelink Semiconductor has launched the CL1100-based 5-7W E27 LED lighting driver system solution DB2. This driver module meets the requirements of small size (L×W×H=5.1cm×2.1cm×1.8cm), low standby...[Details]
LED lighting: Basic circuit design can be completed in as little as one day
Semiconductor manufacturers are also getting involved in the LED lighting business. The power circuit of LED req...[Details]
The serial interface real-time clock chip DS1302 launched by Dallas Company in the United States can trickle charge the backup battery of the clock chip. Due to the main features of the chip such a...[Details]
The ARINC429 bus is one of the most commonly used communication buses between various subsystems of avionics. As the "skeleton" of modern avionics systems, once the bus system or the attached airbo...[Details]
TI Technology Forum
京公网安备 11010802033920号
EEWORLD
