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K9K2G08U0A-JIB00

Description
Flash, 256MX8, 20ns, PBGA63, 9.50 X 12 MM, LEAD FREE, FBGA-63
Categorystorage    storage   
File Size992KB,38 Pages
ManufacturerSAMSUNG
Websitehttp://www.samsung.com/Products/Semiconductor/
Download Datasheet Parametric Compare View All

K9K2G08U0A-JIB00 Overview

Flash, 256MX8, 20ns, PBGA63, 9.50 X 12 MM, LEAD FREE, FBGA-63

K9K2G08U0A-JIB00 Parametric

Parameter NameAttribute value
MakerSAMSUNG
Parts packaging codeBGA
package instructionTFBGA,
Contacts63
Reach Compliance Codeunknown
ECCN code3A991.B.1.A
Maximum access time20 ns
JESD-30 codeR-PBGA-B63
length12 mm
memory density2147483648 bit
Memory IC TypeFLASH
memory width8
Number of functions1
Number of terminals63
word count268435456 words
character code256000000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize256MX8
Package body materialPLASTIC/EPOXY
encapsulated codeTFBGA
Package shapeRECTANGULAR
Package formGRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/SerialPARALLEL
Programming voltage2.7 V
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)2.7 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
typeSLC NAND TYPE
width9.5 mm
Base Number Matches1
K9K2G08U0A
K9K2G08R0A
FLASH MEMORY
K9K2G08X0A
INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS,
AND IS SUBJECT TO CHANGE WITHOUT NOTICE.
NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,
EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,
TO ANY INTELLECTUAL PROPERTY RIGHTS IN SAMSUNG PRODUCTS OR TECHNOLOGY. ALL
INFORMATION IN THIS DOCUMENT IS PROVIDED
ON AS "AS IS" BASIS WITHOUT GUARANTEE OR WARRANTY OF ANY KIND.
1. For updates or additional information about Samsung products, contact your nearest Samsung office.
2. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar
applications where Product failure could result in loss of life or personal or physical harm, or any military or
defense application, or any governmental procurement to which special terms or provisions may apply.
* Samsung Electronics reserves the right to change products or specification without notice.
1

K9K2G08U0A-JIB00 Related Products

K9K2G08U0A-JIB00 K9K2G08U0A-JCB00
Description Flash, 256MX8, 20ns, PBGA63, 9.50 X 12 MM, LEAD FREE, FBGA-63 Flash, 256MX8, 20ns, PBGA63, 9.50 X 12 MM, LEAD FREE, FBGA-63
Maker SAMSUNG SAMSUNG
Parts packaging code BGA BGA
package instruction TFBGA, 9.50 X 12 MM, LEAD FREE, FBGA-63
Contacts 63 63
Reach Compliance Code unknown unknown
ECCN code 3A991.B.1.A 3A991.B.1.A
Maximum access time 20 ns 20 ns
JESD-30 code R-PBGA-B63 R-PBGA-B63
length 12 mm 12 mm
memory density 2147483648 bit 2147483648 bit
Memory IC Type FLASH FLASH
memory width 8 8
Number of functions 1 1
Number of terminals 63 63
word count 268435456 words 268435456 words
character code 256000000 256000000
Operating mode ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 85 °C 70 °C
organize 256MX8 256MX8
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TFBGA TFBGA
Package shape RECTANGULAR RECTANGULAR
Package form GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Programming voltage 2.7 V 2.7 V
Certification status Not Qualified Not Qualified
Maximum seat height 1.2 mm 1.2 mm
Maximum supply voltage (Vsup) 3.6 V 3.6 V
Minimum supply voltage (Vsup) 2.7 V 2.7 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V
surface mount YES YES
technology CMOS CMOS
Temperature level INDUSTRIAL COMMERCIAL
Terminal form BALL BALL
Terminal pitch 0.8 mm 0.8 mm
Terminal location BOTTOM BOTTOM
type SLC NAND TYPE SLC NAND TYPE
width 9.5 mm 9.5 mm
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