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C8422-02

Description
IC and device socketLO-profile 22 pins mylar wafer tin
CategoryThe connector    socket   
File Size600KB,1 Pages
ManufacturerAries Electronics
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C8422-02 Overview

IC and device socketLO-profile 22 pins mylar wafer tin

C8422-02 Parametric

Parameter NameAttribute value
MakerAries Electronics
Reach Compliance Codecompliant
ECCN codeEAR99
Other featuresMYLAR WAFER
body width0.5 inch
subject depth0.15 inch
body length1.1 inch
Contact to complete cooperationSN
Contact completed and terminatedGOLD
Contact materialCU ALLOY
Contact styleSQ PIN-SKT
current rating1 A
Device slot typeIC SOCKET
Type of equipment usedDIP22
Dielectric withstand voltage1000VAC V
Shell materialPOLYBUTYLENE TEREPHTHALATE
Insulation resistance1000000000 Ω
Manufacturer's serial numberC84
Plug contact pitch0.1 inch
Installation methodSTRAIGHT
Number of contacts22
PCB contact patternRECTANGULAR
PCB contact row spacing0.4 mm
Terminal pitch2.54 mm
Termination typeSOLDER
Series C84/93 LO-PRO
®
file
Dual Beam Edge-Grip Socket w/Solder Tails
FEATURES
• Anti-wicking design on LO-PRO
®
file sockets eliminates flux or solder contamination
• Dual beam, edge-grip contacts provide high retention and positive contact
• End-to-end and side-to-side stackable
GENERAL SPECIFICATIONS
• BODY: black UL 94V-0 glass-filled Nylon 4/6
• DUAL BEAM CONTACT: Phosphor Bronze 521
• CONTACT PLATING: (overall 50μ [1.27μ] Ni per SAE AMS-QQN-290); Sn 200μ
[5.08μ] min. matte Sn per ASTM B545-97; Sn/Pb 100-150μ [2.54-3.81μ] min.
90/10 Sn/Pb per MIL-P-81728; Au 10μ [0.25μ] min. Au per MIL-G-45204 in
contact area and 100-150μ [2.54-3.81μ] min. 90/10 Sn/Pb per MIL-P-81728 on
CUSTOMIZATION:
In addition to the standard products shown
Solder Tail
on this page, Aries specializes in custom design and production.
• WAFER: Nomex, 0.005 [0.13] thick
Special materials, platings, sizes, and configurations can be
furnished, depending on the quantity.
NOTE:
Aries reserves the
• CONTACT CURRENT RATING: 1 amp
right to change product general specifications without notice.
• CONTACT RESISTANCE: 20 mΩ initial
• INSULATION RESISTANCE: 100 mΩ @ 500VDC per MIL-STD-1344, Method 3003.1
• DIELECTRIC WITHSTANDING VOLTAGE: 1000 VAC
ORDERING INFORMATION
• OPERATING TEMPERATURE: -67°F [-55°C] to [105°C] 221°F for
C XX-XX XX-TL
Sn: -67°F [-55°C] to 257°F [125°C] for Au
• ACCEPTS LEADS: up to 0.011 x 0.018 ±0.003 [0.28 x 0.46
Optional Plating Sn/Pb
Socket Series
±0.08]
or
0.021 [0.53] dia., 0.070-0.135 [1.78-3.43] long
02 = Nomex Wafer
(std)
Pin Plating
93 = Au
MOUNTING CONSIDERATIONS
84 = Sn
• SUGGESTED PCB HOLE SIZE: 0.036 ±0.002 [0.91 ±0.05] dia.
No. of Pins
(see Table)
ALL DIMENSIONS: INCHES [MILLIMETERS]
ALL TOLERANCES: ±0.005 [0.13] UNLESS OTHERWISE SPECIFIED
CONSULT FACTORY FOR OTHER SIZES AND CONFIGURATIONS
No. of Pins
6
8
14
16
18
20
24
28
40
Dim “A”
0.290 [7.37]
0.390 [9.91]
0.690 [17.53]
0.790 [20.07]
0.890 [22.61]
0.990 [25.15]
1.190 [30.23]
1.390 [35.31]
1.990 [50.55]
Dim. “B”
0.200 [5.08]
0.300 [7.62]
0.600 [15.24]
0.700 [17.78]
0.800 [20.32]
0.900 [22.86]
1.100 [27.94]
1.300 [33.02]
1.900 [48.26]
Centers “C”
0.300 [7.62]
0.300 [7.62]
0.300 [7.62]
0.300 [7.62]
0.300 [7.62]
0.300 [7.62]
0.600 [15.24]
0.600 [15.24]
0.600 [15.24]
Dim. “D”
0.395 [10.03]
0.395 [10.03]
0.395 [10.03]
0.395 [10.03]
0.395 [10.03]
0.395 [10.03]
Dim. “E”
Dim. “F”
0.350 [8.89]
0.400 [10.16]
0.450 [11.43]
0.500 [12.70]
0.695 [17.65] 0.400 [10.16]
0.695 [17.65] 0.500 [12.70]
0.695 [17.65] 0.500 [12.70] 1.000 [25.40]
Bristol, PA 19007-6810 USA
TEL (215) 781-9956 • FAX (215) 781-9845
WWW.ARIESELEC.COM • INFO@ARIESELEC.COM
PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED
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