ES2AA thru ES2JA
Taiwan Semiconductor
CREAT BY ART
FEATURES
- Glass passivated junction chip
- Ideal for automated placement
- Low profile package
- Built-in strain rellef
- Super fast recovery time for high efficiency
- Moisture sensitivity level: level 1, per J-STD-020
- Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
- Halogen-free according to IEC 61249-2-21 definition
Surface Mount Super Fast Rectifiers
MECHANICAL DATA
Case:
DO-214AC (SMA)
Molding compound, UL flammability classification rating 94V-0
Base P/N with suffix "G" on packing code - Green compound (halogen-free)
Base P/N with prefix "H" on packing code - AEC-Q101 qualified
Terminal:
Matte tin plated leads, solderable per JESD22-B102
Meet JESD 201 class 1A whisker test
with prefix "H" on packing code meet JESD 201 class 2 whisker test
Polarity:
Indicated by cathode band
Weight:
0.06 g (approximately)
DO-214AC (SMA)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
(T
A
=25
o
C unless otherwise noted)
PARAMETER
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
Peak forward surge current, 8.3 ms single half sine-wave
superimposed on rated load
Maximum instantaneous forward voltage (Note 1)
@2A
Maximum reverse current @ rated VR
T
J
=25
o
C
T
J
=125
o
C
Maximum reverse recovery time (Note 2)
Typical junction capacitance (Note 3)
Typical thermal resistance
Operating junction temperature range
Storage temperature range
Note 1: Pulse test with PW=300μs, 1% duty cycle
Note 2: Reverse Recovery Test Conditions: I
F
=0.5A, I
R
=1.0A, I
RR
=0.25A
Note 3: Measured at 1 MHz and Applied V
R
=4.0 Volts
SYMBOL
V
RRM
V
RMS
V
DC
I
F(AV)
I
FSM
V
F
I
R
Trr
Cj
R
θJL
R
θJA
T
J
T
STG
25
20
75
- 55 to +150
- 55 to +150
0.95
10
350
35
20
O
ES
2AA
50
35
50
ES
2BA
100
70
100
ES
2CA
150
105
150
ES
2DA
200
140
200
2
50
ES
2FA
300
210
300
ES
400
280
400
ES
500
350
500
ES
2JA
600
420
600
2GA 2HA
UNIT
V
V
V
A
A
1.3
1.7
V
μA
ns
pF
C/W
O
O
C
C
Document Number: DS_D1407006
Version: I14
ES2AA thru ES2JA
Taiwan Semiconductor
ORDERING INFORMATION
PART NO.
AEC-Q101
QUALIFIED
PACKING
CODE
R3
R2
ES2xA
(Note 1)
Prefix "H"
M2
F3
F2
F4
N/A
E3
E2
Suffix "G"
GREEN COMPOUND
CODE
SMA
SMA
SMA
Folded SMA
Folded SMA
Folded SMA
Clip SMA
Clip SMA
1,800 / 7" Plastic reel
7,500 / 13" Paper reel
7,500 / 13" Plastic reel
1,800 / 7" Plastic reel
7,500 / 13" Paper reel
7,500 / 13" Plastic reel
1,800 / 7" Plastic reel
7,500 / 13" Plastic reel
PACKAGE
PACKING
Note 1: "xx" defines voltage from 50V (ES2AA) to 600V (ES2JA)
EXAMPLE
PREFERRED P/N
ES2JA R3
ES2JA R3G
ES2JAHR3
PART NO.
ES2JA
ES2JA
ES2JA
H
AEC-Q101
QUALIFIED
PACKING CODE
R3
R3
R3
G
Green compound
AEC-Q101 qualified
GREEN COMPOUND
CODE
DESCRIPTION
RATINGS AND CHARACTERISTICS CURVES
(TA=25
o
C unless otherwise noted)
FIG.1 MAXIMUM FORWARD CURRENT
DERATING CURVE
FIG. 2 TYPICAL REVERSE CHARACTERISTICS
1000
3
AVERAGE FORWARD CURRENT (A)
INSTANTANEOUS REVERSE CURRENT (μA)
100
T
J
=125
o
C
10
T
J
=75
o
C
1
T
J
=25
o
C
0.1
2
1
RESISTER OR
INDUCTIVE LOAD
0
80
90
100
110
120
130
140
150
0.01
0
20
40
60
80
100
120
140
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
LEAD TEMPERATURE (
o
C)
PEAK FORWARD SURGE CURRENT (A)
60
50
40
30
20
10
0
1
FIG. 3 MAXIMUM NON-REPETITIVE PEAK FORWARD
SURGE CURRENT
INSTANTANEOUS FORWARD CURRENT (A)
10
FIG. 4 TYPICAL INSTANTANEOUS
FORWARD CHARACTERISTICS
Pulse Width=300μs
1% Duty Cycle
8.3ms Single Half Sine Wave
1
ES2HA-2JA
0.1
ES2FA-2GA
ES2AA-2DA
0.01
0.4
0.6
0.8
1
1.2
1.4
FORWARD VOLTAGE (V)
1.6
1.8
10
NUMBER OF CYCLES AT 60 Hz
100
Document Number: DS_D1407006
Version: I14
ES2AA thru ES2JA
Taiwan Semiconductor
FIG. 5 TYPICAL JUNCTION CAPACITANCE
60
JUNCTION CAPACITANCE (pF)
50
40
30
20
ES2FA-JA
10
0
0.1
1
10
REVERSE VOLTAGE (V)
100
ES2AA-DA
f=1.0MHz
Vsig=50mVp-p
PACKAGE OUTLINE DIMENSIONS
DO-214AC (SMA)
DIM.
A
B
C
D
E
F
G
H
Unit (mm)
Min
1.27
4.06
2.29
1.99
0.90
4.95
0.10
0.15
Max
1.58
4.60
2.83
2.50
1.41
5.33
0.20
0.31
Unit (inch)
Min
0.050
0.160
0.090
0.078
0.035
0.195
0.004
0.006
Max
0.062
0.181
0.111
0.098
0.056
0.210
0.008
0.012
SUGGESTED PAD LAYOUT
Symbol
A
B
C
D
E
Unit (mm)
1.68
1.52
3.93
2.41
5.45
Unit (inch)
0.066
0.060
0.155
0.095
0.215
MARKING DIAGRAM
P/N =
G=
YW =
F=
Specific Device Code
Green Compound
Date Code
Factory Code
Document Number: DS_D1407006
Version: I14
ES2AA thru ES2JA
Taiwan Semiconductor
CREAT BY ART
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
assumes no responsibility or liability for any errors inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied,to
any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or seling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
Document Number: DS_D1407006
Version: I14
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