GS73024AB
BGA
Commercial Temp
Industrial Temp
Features
• Fast access time: 8, 10, 12 ns
• CMOS low power operation: 250/200/170 mA at minimum
cycle time
• Single 3.3 V ± 0.3V power supply
• All inputs and outputs are TTL-compatible
• Fully static operation
• Industrial Temperature Option: –40 to 85°C
• Package
B: 14 mm x 22 mm, 119-bump, 1.27mm pitch BGA
GB: RoHS-compliant 119-bump BGA*
128K x 24
3Mb Asynchronous SRAM
119-Bump Ball Grid Array Package
8, 10, 12 ns
3.3 V V
DD
Center V
DD
and V
SS
Description
The GS73024A is a high speed CMOS Static RAM organized
as 131,072 words by 24 bits. Static design eliminates the need
for external clocks or timing strobes. Operating on a single
3.3 V power supply, and all inputs and outputs are
TTL-compatible. The GS73024A is available in a 119-bump
BGA package.
Pin Descriptions
Symbol
A
0
to A
16
WE
CE
V
DD
Description
Address input
Write enable input
Chip enable input
+3.3 V power supply
Symbol
DQ
1
to DQ
24
OE
V
SS
Description
Data input/output
Output enable input
Ground
*All GSI Technology packages are at least 5/6 RoHS compliant.
Packages listed with the additional “G” designator are 6/6 RoHS compliant.
Rev: 1.04b 3/2007
1/13
© 2003, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS73024AB
119-Bump, 1.27 mm Pitch BGA Pad Out—Top View (Package B)
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
NC
NC
DQ
13
DQ
14
DQ
15
DQ
16
DQ
17
DQ
18
V
DD
DQ
19
DQ
20
DQ
21
DQ
22
DQ
23
DQ
24
NC
NC
2
A
3
A
7
NC
V
DD
NC
V
DD
NC
V
DD
V
SS
V
DD
NC
V
DD
NC
V
DD
NC
A
11
A
15
3
A
2
A
6
NC
V
SS
V
DD
V
SS
V
DD
V
SS
V
DD
V
SS
V
DD
V
SS
V
DD
V
SS
NC
A
10
A
14
4
A
16
CE
NC
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
NC
WE
OE
5
A
1
A
5
NC
V
SS
V
DD
V
SS
V
DD
V
SS
V
DD
V
SS
V
DD
V
SS
V
DD
V
SS
NC
A
9
A
13
6
A
0
A
4
NC
V
DD
NC
V
DD
NC
V
DD
V
SS
V
DD
NC
V
DD
NC
V
DD
NC
A
8
A
12
7
NC
NC
DQ
12
DQ
11
DQ
10
DQ
9
DQ
8
DQ
7
V
DD
DQ
6
DQ
5
DQ
4
DQ
3
DQ
2
DQ
1
NC
NC
Rev: 1.04b 3/2007
3/13
© 2003, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS73024AB
Truth Table
CE
H
L
L
L
X: “H” or “L”
OE
X
L
X
H
WE
X
H
L
H
Mode
Not selected
Read
Write
Output disable
DQ0 to DQ23
High Z
Data Out
Data In
High Z
I
DD
V
DD
Current
ISB1, ISB2
Absolute Maximum Ratings
Parameter
Supply Voltage
Input Voltage
Output Voltage
Allowable BGA power dissipation
Storage temperature
Symbol
V
DD
V
IN
V
OUT
PD
T
STG
Rating
–0.5 to +4.6
–0.5 to V
DD
+0.5
(≤ 4.6 V max.)
–0.5 to V
DD
+0.5
(≤ 4.6 V max.)
1.5
–55 to 150
Unit
V
V
V
W
o
C
Note:
Permanent device damage may occur if Absolute Maximum Ratings are exceeded. Functional operation shall be restricted to Recommended
Operating Conditions. Exposure to higher than recommended voltages for extended periods of time could affect device reliability.
Rev: 1.04b 3/2007
4/13
© 2003, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS73024AB
Recommended Operating Conditions
Parameter
Supply Voltage for -10/12
Supply Voltage for -8
Input High Voltage
Input Low Voltage
Ambient Temperature,
Commercial Range
Ambient Temperature,
Industrial Range
Symbol
V
DD
V
DD
V
IH
V
IL
T
Ac
T
Ai
Min
3.0
3.135
2.0
–0.3
0
–40
Typ
3.3
3.3
—
—
—
—
Max
3.6
3.6
V
DD
+0.3
0.8
70
85
Unit
V
V
V
V
o
C
C
o
Notes:
1. Input overshoot voltage should be less than V
DD
+2 V and not exceed 20 ns.
2. Input undershoot voltage should be greater than –2 V and not exceed 20 ns.
Capacitance
Parameter
Input Capacitance
I/O Capacitance
Symbol
C
IN
C
OUT
Test Condition
V
IN
= 0 V
V
OUT
= 0 V
Max
5
7
Unit
pF
pF
Notes:
1. Tested at T
A
= 25°C, f = 1 MHz
2. These parameters are sampled and are not 100% tested.
DC I/O Pin Characteristics
Parameter
Input Leakage Current
Output Leakage Current
Output High Voltage
Output Low Voltage
Symbol
I
IL
I
OL
V
OH
V
OL
Test Conditions
V
IN
= 0 to V
DD
Output High Z,
V
OUT
= 0 to V
DD
I
OH
= –4 mA
I
OL
= +4 mA
Min
–1 uA
–1 uA
2.4
—
Max
1 uA
1 uA
—
0.4 V
Rev: 1.04b 3/2007
5/13
© 2003, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
京公网安备 11010802033920号
EEWORLD
