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CY7C1471V33-100AXC

Description
72-mbit (2M x 36/4M x 18/1M x 72) flow-through sram with nobl architecture
Categorystorage    storage   
File Size373KB,29 Pages
ManufacturerCypress Semiconductor
Environmental Compliance
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CY7C1471V33-100AXC Overview

72-mbit (2M x 36/4M x 18/1M x 72) flow-through sram with nobl architecture

CY7C1471V33-100AXC Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerCypress Semiconductor
Parts packaging codeQFP
package instructionLQFP, QFP100,.63X.87
Contacts100
Reach Compliance Codecompliant
ECCN code3A991.B.2.A
Maximum access time8.5 ns
Other featuresFLOW-THROUGH ARCHITECTURE
Maximum clock frequency (fCLK)100 MHz
I/O typeCOMMON
JESD-30 codeR-PQFP-G100
JESD-609 codee3
length20 mm
memory density75497472 bit
Memory IC TypeZBT SRAM
memory width36
Humidity sensitivity level3
Number of functions1
Number of terminals100
word count2097152 words
character code2000000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize2MX36
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeLQFP
Encapsulate equivalent codeQFP100,.63X.87
Package shapeRECTANGULAR
Package formFLATPACK, LOW PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)260
power supply2.5/3.3,3.3 V
Certification statusNot Qualified
Maximum seat height1.6 mm
Minimum standby current3.14 V
Maximum supply voltage (Vsup)3.63 V
Minimum supply voltage (Vsup)3.135 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceMatte Tin (Sn)
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationQUAD
Maximum time at peak reflow temperature40
width14 mm
Base Number Matches1
PRELIMINARY
CY7C1471V33
CY7C1473V33
CY7C1475V33
72-Mbit (2M x 36/4M x 18/1M x 72) Flow-Through
SRAM with NoBL™ Architecture
Features
• No Bus Latency™ (NoBL™) architecture eliminates
dead cycles between write and read cycles.
• Can support up to 133-MHz bus operations with zero
wait states
• Data is transferred on every clock
• Pin compatible and functionally equivalent to ZBT™
devices
• Internally self-timed output buffer control to eliminate
the need to use OE
• Registered inputs for flow-through operation
• Byte Write capability
• 3.3V/2.5V I/O power supply
• Fast clock-to-output times
— 6.5 ns (for 133-MHz device)
— 8.5 ns (for 100-MHz device)
• Clock Enable (CEN) pin to enable clock and suspend
operation
• Synchronous self-timed writes
• Asynchronous Output Enable
• Offered in JEDEC-standard lead-free 100 TQFP, and
165-ball fBGA packages for CY7C1471V33 and
CY7C1473V33. 209-ball fBGA package for
CY7C1475V33.
• Three chip enables for simple depth expansion.
• Automatic Power-down feature available using ZZ
mode or CE deselect.
• JTAG boundary scan for BGA and fBGA packages
• Burst Capability—linear or interleaved burst order
• Low standby power
Functional Description
[1]
The CY7C1471V33, CY7C1473V33 and CY7C1475V33 are
3.3V, 2M x 36/4M x 18/1M x 72 Synchronous Flow-through
Burst SRAMs designed specifically to support unlimited true
back-to-back Read/Write operations without the insertion of
wait states. The CY7C1471V33, CY7C1473V33 and
CY7C1475V33 are equipped with the advanced No Bus
Latency (NoBL) logic required to enable consecutive
Read/Write operations with data being transferred on every
clock cycle. This feature dramatically improves the throughput
of data through the SRAM, especially in systems that require
frequent Write-Read transitions.
All synchronous inputs pass through input registers controlled
by the rising edge of the clock. The clock input is qualified by
the Clock Enable (CEN) signal, which when deasserted
suspends operation and extends the previous clock cycle.
Maximum access delay from the clock rise is 6.5 ns (133-MHz
device).
Write operations are controlled by the two or four Byte Write
Select (BW
X
) and a Write Enable (WE) input. All writes are
conducted with on-chip synchronous self-timed write circuitry.
Three synchronous Chip Enables (CE
1
, CE
2
, CE
3
) and an
asynchronous Output Enable (OE) provide for easy bank
selection and output tri-state control. In order to avoid bus
contention, the output drivers are synchronously tri-stated
during the data portion of a write sequence.
Selection Guide
133 MHz
Maximum Access Time
Maximum Operating Current
Maximum CMOS Standby Current
6.5
335
150
100 MHz
8.5
305
150
Unit
ns
mA
mA
Note:
1. For best-practices recommendations, please refer to the Cypress application note
System Design Guidelines
on www.cypress.com.
Cypress Semiconductor Corporation
Document #: 38-05288 Rev. *E
3901 North First Street
San Jose
,
CA 95134
408-943-2600
Revised December 5, 2004

CY7C1471V33-100AXC Related Products

CY7C1471V33-100AXC CY7C1475V33-133BGXC CY7C1475V33-133BGC CY7C1471V33-100BZC CY7C1473V33-100BZC CY7C1473V33-133BZXC CY7C1471V33 CY7C1471V33-100BZXC
Description 72-mbit (2M x 36/4M x 18/1M x 72) flow-through sram with nobl architecture 72-mbit (2M x 36/4M x 18/1M x 72) flow-through sram with nobl architecture 72-mbit (2M x 36/4M x 18/1M x 72) flow-through sram with nobl architecture 72-mbit (2M x 36/4M x 18/1M x 72) flow-through sram with nobl architecture 72-mbit (2M x 36/4M x 18/1M x 72) flow-through sram with nobl architecture 72-mbit (2M x 36/4M x 18/1M x 72) flow-through sram with nobl architecture 72-mbit (2M x 36/4M x 18/1M x 72) flow-through sram with nobl architecture 72-mbit (2M x 36/4M x 18/1M x 72) flow-through sram with nobl architecture

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