64/256/512/1K/2K/4K/8K x 9 synchronous fifos
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Cypress Semiconductor |
| Parts packaging code | QFJ |
| package instruction | PLASTIC, LCC-32 |
| Contacts | 32 |
| Reach Compliance Code | not_compliant |
| ECCN code | EAR99 |
| Maximum access time | 8 ns |
| Maximum clock frequency (fCLK) | 100 MHz |
| period time | 10 ns |
| JESD-30 code | R-PQCC-J32 |
| JESD-609 code | e0 |
| length | 13.97 mm |
| memory density | 36864 bit |
| Memory IC Type | OTHER FIFO |
| memory width | 9 |
| Number of functions | 1 |
| Number of terminals | 32 |
| word count | 4096 words |
| character code | 4000 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 4KX9 |
| Output characteristics | 3-STATE |
| Exportable | YES |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | QCCJ |
| Encapsulate equivalent code | LDCC32,.5X.6 |
| Package shape | RECTANGULAR |
| Package form | CHIP CARRIER |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | 225 |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum seat height | 3.55 mm |
| Maximum standby current | 0.03 A |
| Maximum slew rate | 0.15 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | J BEND |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | 30 |
| width | 11.43 mm |
| Base Number Matches | 1 |
| CY7C4241-10JC | |||||||||
|---|---|---|---|---|---|---|---|---|---|
| Description | 64/256/512/1K/2K/4K/8K x 9 synchronous fifos | ||||||||
| Is it Rohs certified? | incompatible | ||||||||
| Maker | Cypress Semiconductor | ||||||||
| Parts packaging code | QFJ | ||||||||
| package instruction | PLASTIC, LCC-32 | ||||||||
| Contacts | 32 | ||||||||
| Reach Compliance Code | not_compliant | ||||||||
| ECCN code | EAR99 | ||||||||
| Maximum access time | 8 ns | ||||||||
| Maximum clock frequency (fCLK) | 100 MHz | ||||||||
| period time | 10 ns | ||||||||
| JESD-30 code | R-PQCC-J32 | ||||||||
| JESD-609 code | e0 | ||||||||
| length | 13.97 mm | ||||||||
| memory density | 36864 bit | ||||||||
| Memory IC Type | OTHER FIFO | ||||||||
| memory width | 9 | ||||||||
| Number of functions | 1 | ||||||||
| Number of terminals | 32 | ||||||||
| word count | 4096 words | ||||||||
| character code | 4000 | ||||||||
| Operating mode | SYNCHRONOUS | ||||||||
| Maximum operating temperature | 70 °C | ||||||||
| organize | 4KX9 | ||||||||
| Output characteristics | 3-STATE | ||||||||
| Exportable | YES | ||||||||
| Package body material | PLASTIC/EPOXY | ||||||||
| encapsulated code | QCCJ | ||||||||
| Encapsulate equivalent code | LDCC32,.5X.6 | ||||||||
| Package shape | RECTANGULAR | ||||||||
| Package form | CHIP CARRIER | ||||||||
| Parallel/Serial | PARALLEL | ||||||||
| Peak Reflow Temperature (Celsius) | 225 | ||||||||
| power supply | 5 V | ||||||||
| Certification status | Not Qualified | ||||||||
| Maximum seat height | 3.55 mm | ||||||||
| Maximum standby current | 0.03 A | ||||||||
| Maximum slew rate | 0.15 mA | ||||||||
| Maximum supply voltage (Vsup) | 5.5 V | ||||||||
| Minimum supply voltage (Vsup) | 4.5 V | ||||||||
| Nominal supply voltage (Vsup) | 5 V | ||||||||
| surface mount | YES | ||||||||
| technology | CMOS | ||||||||
| Temperature level | COMMERCIAL | ||||||||
| Terminal surface | Tin/Lead (Sn/Pb) | ||||||||
| Terminal form | J BEND | ||||||||
| Terminal pitch | 1.27 mm | ||||||||
| Terminal location | QUAD | ||||||||
| Maximum time at peak reflow temperature | 30 | ||||||||
| width | 11.43 mm | ||||||||
| Base Number Matches | 1 |