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3SMBJ5933BHE3-TP

Description
Zener Diode,
CategoryDiscrete semiconductor    diode   
File Size319KB,4 Pages
ManufacturerMicro Commercial Components (MCC)
Environmental Compliance
Download Datasheet Parametric View All

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3SMBJ5933BHE3-TP Overview

Zener Diode,

3SMBJ5933BHE3-TP Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerMicro Commercial Components (MCC)
package instructionSMB, 2 PIN
Reach Compliance Codenot_compliant
ECCN codeEAR99
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeZENER DIODE
Maximum dynamic impedance17.5 Ω
Maximum forward voltage (VF)1.5 V
JEDEC-95 codeDO-214AA
JESD-30 codeR-PDSO-C2
Maximum knee impedance650 Ω
Humidity sensitivity level1
Number of components1
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
polarityUNIDIRECTIONAL
Maximum power dissipation3 W
GuidelineAEC-Q101
Nominal reference voltage22 V
Maximum reverse current1 µA
Reverse test voltage16.7 V
surface mountYES
technologyZENER
Terminal formC BEND
Terminal locationDUAL
Maximum voltage tolerance5%
Working test current17 mA
Base Number Matches1
MCC
Features
TM
Micro Commercial Components
  omponents
20736 Marilla Street Chatsworth

  !"#
$ %    !"#
3SMBJ5925BHE3
THRU
3SMBJ5956BHE3
3.0 Watt
Surface Mount
Silicon
Zener Diodes
DO-214AA
(SMB) (LEAD FRAME)
Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates
Compliant. See ordering information)
10 thru 200 Volt Voltage Range
Low Inductance, Low Profile Mounting
Glasss Passivated Junction
Available On Tape and Reel
Halogen
free
Epoxy meets UL 94 V-0 flammability rating
Moisture Sensitivity Level 1
AEC-Q101 Qualified
Mechanical Data
Terminals solderable per MIL-STD-750, Method 2026
Polarity is indicated by cathode band.
Packaging: Standard 12mm Tape (see EIA 481)
A
Maximum temperature for soldering: 260
0
C for 10 seconds.
Maximum Ratings @ 25
o
C Unless Otherwise Specified
C
B
Maximum
Forward
Voltage
Steady State
Power
Dissipation
Operation and
Storage
Temperature
V
F
P
d
T
J
, T
STG
1.5V
3.0W
-55
o
C to
+150
o
C
42
o
C
/W
(Note:
2)
(Note:
3)
E
D
F
H
G
DIMENSIONS
INCHES
MIN
.160
.130
.006
.030
.200
.079
.075
.002
MM
MIN
4.06
3.30
0.15
0.76
5.08
2.00
1.91
0.05
Thermal Resistance
R
thJA
Junction to
Ambient
Note:
DIM
A
B
C
D
E
F
G
H
MAX
.185
.155
.012
.060
.220
.096
.087
.008
MAX
4.70
3.94
0.31
1
..52
5.59
2.44
2.21
0.203
NOTE
1.
High Temperature Solder Exemptions Applied, see EU Directive Annex 7.
2.
3.
Forward Current @ 200mA.
Mounted on 5.0mm (1oz thick) Iand areas.
Lead temperature at T
L
=75 C
o
2
SUGGESTED SOLDER
PAD LAYOUT
0.106"
0.083”
0.050”
Revision:
A
www.mccsemi.com
1 of 4
2015/06/11

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