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DAP222

Description
sot-416/SC-90 package common anode dual switching diode surface mount
CategoryDiscrete semiconductor    diode   
File Size91KB,6 Pages
ManufacturerMotorola ( NXP )
Websitehttps://www.nxp.com
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DAP222 Overview

sot-416/SC-90 package common anode dual switching diode surface mount

DAP222 Parametric

Parameter NameAttribute value
MakerMotorola ( NXP )
package instructionR-PDSO-G3
Reach Compliance Codeunknown
ECCN codeEAR99
ConfigurationCOMMON ANODE, 2 ELEMENTS
Diode component materialsSILICON
Diode typeRECTIFIER DIODE
Maximum forward voltage (VF)1.2 V
JESD-30 codeR-PDSO-G3
JESD-609 codee0
Maximum non-repetitive peak forward current4 A
Number of components2
Number of terminals3
Maximum operating temperature150 °C
Maximum output current0.1 A
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Maximum power dissipation0.15 W
Certification statusNot Qualified
Maximum repetitive peak reverse voltage80 V
Maximum reverse recovery time0.004 µs
surface mountYES
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal locationDUAL
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Order this document
by DAP222/D
Common Anode Silicon
Dual Switching Diode
This Common Anode Silicon Epitaxial Planar Dual Diode is designed for use in ultra
high speed switching applications. This device is housed in the SOT–416/SC–90
package which is designed for low power surface mount applications, where board
space is at a premium.
Fast trr
Low CD
Available in 8 mm Tape and Reel
DAP222
SOT–416/SC–90 PACKAGE
COMMON ANODE
DUAL SWITCHING DIODE
SURFACE MOUNT
3
2
1
CASE 463–01, STYLE 4
SOT–416/SC–90
MAXIMUM RATINGS
(TA = 25°C)
Rating
Reverse Voltage
Peak Reverse Voltage
Forward Current
Peak Forward Current
Peak Forward Surge Current
Symbol
VR
VRM
IF
IFM
IFSM(1)
Value
80
80
100
300
2.0
Unit
Vdc
Vdc
mAdc
mAdc
Adc
1
CATHODE
2
ANODE
3
DEVICE MARKING
DAP222 = P9
THERMAL CHARACTERISTICS
Rating
Power Dissipation
Junction Temperature
Storage Temperature
Symbol
PD
TJ
Tstg
Max
150
150
– 55 ~ + 150
Unit
mW
°C
°C
ELECTRICAL CHARACTERISTICS
(TA = 25°C)
Characteristic
Reverse Voltage Leakage Current
Forward Voltage
Reverse Breakdown Voltage
Diode Capacitance
Reverse Recovery Time
1. t = 1
µS
2. trr Test Circuit on following page.
Symbol
IR
VF
VR
CD
trr(2)
Condition
VR = 70 V
IF = 100 mA
IR = 100
µA
VR = 6.0 V, f = 1.0 MHz
IF = 5.0 mA, VR = 6.0 V, RL = 100
Ω,
Irr = 0.1 IR
Min
80
Max
0.1
1.2
3.5
4.0
Unit
µAdc
Vdc
Vdc
pF
ns
Thermal Clad is a trademark of the Bergquist Company
REV 1
Motorola Small–Signal Transistors, FETs and Diodes Device Data
©
Motorola, Inc. 1996
1
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