1812K1000224MXRE03 datasheet, PDF

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1812K1000224MXRE03: DescriptionFeed Through Capacitor, 2 Function(s), 100V, EIA STD PACKAGE SIZE 1812; CategoryAnalog mixed-signal IC filter; File Size175KB，4 Pages; ManufacturerSyfer

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1812K1000224MXRE03 Overview

Feed Through Capacitor, 2 Function(s), 100V, EIA STD PACKAGE SIZE 1812

1812K1000224MXRE03 Parametric

Parameter Name	Attribute value
Reach Compliance Code	compli
ECCN code	EAR99
Other features	FLEXICAP TERMINATION
capacitance	220000 µF
filter type	FEED THROUGH CAPACITOR
high	2 mm
Minimum insulation resistance	10000 MΩ
JESD-609 code	e3
length	4.5 mm
Manufacturer's serial number	X2Y
Installation type	SURFACE MOUNT
Number of functions	2
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
method of packing	REEL
physical size	L4.5XB3.2XH2.0 (mm)/L0.177XB0.126XH0.079 (inch)
Rated voltage	100 V
Terminal surface	MATTE TIN
width	3.2 mm
Base Number Matches	1

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Integrated

Passive Components

Balanced Line EMI Chip

X2Y

The Syfer Balanced Line Chip is a 3 terminal EMI chip device. The

revolutionary design provides simultaneous line-to-line and line-to-

ground filtering, using a single ceramic chip. In this way, differential

and common mode filtering are provided in one device. Capable of

replacing 2 or more conventional devices, it is ideal for balanced lines,

twisted pairs and dc motors, in automotive, audio, sensor and other

applications.

These filters can prove invaluable in meeting stringent EMC demands

particularly in automotive applications.

Specifications

Dielectric

Electrical Configuration

Capacitance Measurement

Typical Capacitance Matching

Temperature Rating

Dielectric Withstand Volage

Insulation Resistance

Termination Material

X7R or C0G/NP0

Multiple capacitance

At 1000hr point

Better than 5%

-55°C to 125°C

2.5 x Rated Volts for 5 secs.

Charging current limited to 50mA Max.

100Gohms or 1000s (whichever is the less)

100% matte tin over nickel

Advantages

●

Replaces 2 or 3 capacitors with one device

●

Matched capacitance line to ground on both lines

●

Low inductance due to cancellation effect

●

Capacitance line to line

●

Differential and common mode attenuation

●

Effects of temperature and voltage variation eliminated

●

Effect of ageing equal on both lines

●

High current capability

INPUT 1

GROUND

Applications

●

Balanced lines

●

Twisted pairs

●

EMI Suppression on DC motors

●

Sensor/transducer applications

●

Wireless communications

●

Audio

INPUT 2

Chip

Size

0603*

0805

1206

1410

1812

2220

1.6±0.2 (0.063±0.008)

2.0±0.3 (0.08±0.012)

3.2±0.3 (0.126±0.012)

3.6±0.3 (0.14±0.012)

4.5±0.35 (0.18±0.014)

5.7±0.4 (0.22±0.016)

0.8±0.2 (0.03±0.008)

1.25±0.2 (0.05±0.008)

1.60±0.2 (0.063±0.008)

2.5±0.3 (0.1±0.012)

3.2±0.3 (0.126±0.012)

5.0±0.4 (0.2±0.016)

0.5±0.15 (0.02±0.006)

1.0±0.15 (0.04±0.006)

1.1±0.2 (0.043±0.008)

2 max. (0.08 max.)

2.5 max. (0.1 max.)

0.3±0.2 (0.012±0.008)

0.5±0.25 (0.02±0.01)

0.95±0.3 (0.037±0.012)

1.20±0.3 (0.047±0.012)

1.5±0.35 (0.06±0.014)

2.25±0.4 (0.09±0.016)

0.2±0.1 (0.008±0.004)

0.3±0.15 (0.012±0.006)

0.5±0.25 (0.02±0.01)

0.75±0.25 (0.03±0.01)

Recommended Solder Lands

Insertion Loss Characteristics (common mode)

Typical 50 ohm system

220nF

4.7nF

2.2nF

1nF

470pF

220pF

100pF

47pF

22pF

Insertion Loss (dB)

100nF

47nF

22nF

10nF

Chip Size

0603*

0805

1206

1410

1812

2220

0.6 (0.024)

0.95 (0.037)

1.2 (0.047)

2.05 (0.08)

2.65 (0.104)

4.15 (0.163)

Dimensions mm (inches)

0.6 (0.024) 0.4 (0.016) 0.2 (0.008)

0.9 (0.035) 0.3 (0.012) 0.4 (0.016)

0.9 (0.035) 0.6 (0.024) 0.8 (0.03)

1.0 (0.04) 0.7 (0.028) 0.9 (0.035)

1.4 (0.055) 0.8 (0.03) 1.4 (0.055)

1.4 (0.055) 1.2 (0.047) 1.8 (0.071)

0.1

100

1000

Frequency (MHz)

The 0603 chip size is a development item. All technical information should

be considered provisional and subject to change. Refer to Sales office.

FILTSMX2Y.ver2

notes

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