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DFLS120L

Description
1.0A surface mount schottky barrier rectifier
Categorysemiconductor    Discrete semiconductor   
File Size164KB,3 Pages
ManufacturerDiodes
Websitehttp://www.diodes.com/
Environmental Compliance
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DFLS120L Overview

1.0A surface mount schottky barrier rectifier

SPICE MODEL: DFLS120L
DFLS120L
1.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER
PowerDI
123
NEW PRODUCT
Features
Guard Ring Die Construction for Transient Protection
Low Power Loss, High Efficiency
High Surge Capability
High Current Capability and Low Forward Voltage Drop
Lead Free Finish, RoHS Compliant (Note 4)
"Green" Molding Compound (No Br, Sb)
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
Case: PowerDI
123
Case Material: Molded Plastic, “Green” Molding
Compound. UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020C
Terminal Connections: Cathode Band
Terminals: Finish – Matte Tin annealed over Copper
leadframe. Solderable per MIL-STD-202,
Method 208
e
3
Marking & Type Code Information: See Last Page
Weight: 0.01 grams (approx.)
Ordering Information: See Last Page
TOP VIEW
BOTTOM VIEW
Maximum Ratings
@ T
A
= 25°C unless otherwise specified
Single phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%.
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Average Forward Current
Non-Repetitive Peak Forward Surge Current 8.3ms
single half sine-wave superimposed on rated load
Symbol
V
RRM
V
RWM
V
R
V
R(RMS)
I
F(AV)
I
FSM
Value
20
14
1.0
50
Unit
V
V
A
A
Thermal Characteristics
Characteristic
Power Dissipation (Note 1) @ T
A
= 25°C
Power Dissipation (Note 2) @ T
A
= 25°C
Thermal Resistance Junction to Ambient (Note 1)
Thermal Resistance Junction to Ambient (Note 2)
Thermal Resistance Junction to Soldering (Note 3)
Operating Temperature Range
Storage Temperature Range
Notes:
1.
2.
3.
4.
Symbol
P
D
P
D
R
θJA
R
θJA
R
θJS
T
j
T
STG
Value
1.67
556
60
180
10
-55 to +125
-55 to +150
Unit
W
mW
°C/W
°C/W
°C/W
°C
°C
Part mounted on 50.8mm X 50.8mm GETEK board with 25.4mm X 25.4mm copper pad, 25% anode, 75% cathode.
Part mounted on FR-4 board with 1.8mm X 2.5mm cathode and 1.8mm X 1.2mm anode, 1 oz. copper pads.
Theoretical R
θJS
calculated from the top center of the die straight down to the PCB/cathode tab solder junction.
RoHS revision 13.2.2003. Glass and High Temperature Solder Exemptions Applied, see
EU Directive Annex Notes 5 and 7.
DS30444 Rev. 3 - 2
PowerDI is a trademark of Diodes Incorporated.
1 of 3
www.diodes.com
DFLS120L
©
Diodes Incorporated
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