BZX884-B11,315 datasheet, PDF - EEWORLD Datasheet

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BZX884-B11,315: Descriptionzener diodes diode zener 2 pct; CategoryDiscrete semiconductor diode; File Size94KB，11 Pages; ManufacturerNXP; Websitehttps://www.nxp.com; Environmental Compliance

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BZX884-B11,315 Overview

zener diodes diode zener 2 pct

BZX884-B11,315 Parametric

Parameter Name	Attribute value
Brand Name	NXP Semiconductor
Is it Rohs certified?	conform to
Maker	NXP
Parts packaging code	DFN
package instruction	1 X 0.60 MM, 0.50 MM HEIGHT, LEADLESS, ULTRA SMALL, PLASTIC PACKAGE-2
Contacts	2
Manufacturer packaging code	SOD882
Reach Compliance Code	compliant
ECCN code	EAR99
Configuration	SINGLE
Diode component materials	SILICON
Diode type	ZENER DIODE
JESD-30 code	R-PBCC-N2
JESD-609 code	e3
Humidity sensitivity level	1
Number of components	1
Number of terminals	2
Maximum operating temperature	150 °C
Package body material	PLASTIC/EPOXY
Package shape	RECTANGULAR
Package form	CHIP CARRIER
Peak Reflow Temperature (Celsius)	260
polarity	UNIDIRECTIONAL
Maximum power dissipation	0.25 W
Certification status	Not Qualified
Nominal reference voltage	11 V
surface mount	YES
technology	ZENER
Terminal surface	Tin (Sn)
Terminal form	NO LEAD
Terminal location	BOTTOM
Maximum time at peak reflow temperature	40
Maximum voltage tolerance	2%
Working test current	5 mA
Base Number Matches	1

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M3D891

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BZX884 series

Voltage regulator diodes

Product data sheet

Supersedes data of 2003 May 15

2004 Mar 26

BZX884-B11,315 Related Products

	BZX884-B11,315	BZX884-B22,315	BZX884-B24,315	BZX884-B30,315
Description	zener diodes diode zener 2 pct	zener diodes diode zener 2 pct	zener diodes diode zener 2 pct	zener diodes diode zener 2 pct
Brand Name	NXP Semiconductor	NXP Semiconductor	NXP Semiconductor	NXP Semiconductor
Is it Rohs certified?	conform to	conform to	conform to	conform to
Maker	NXP	NXP	NXP	NXP
Parts packaging code	DFN	DFN	DFN	DFN
package instruction	1 X 0.60 MM, 0.50 MM HEIGHT, LEADLESS, ULTRA SMALL, PLASTIC PACKAGE-2	1 X 0.60 MM, 0.50 MM HEIGHT, LEADLESS, ULTRA SMALL, PLASTIC PACKAGE-2	1 X 0.60 MM, 0.50 MM HEIGHT, LEADLESS, ULTRA SMALL, PLASTIC PACKAGE-2	1 X 0.60 MM, 0.50 MM HEIGHT, LEADLESS, ULTRA SMALL, PLASTIC PACKAGE-2
Contacts	2	2	2	2
Manufacturer packaging code	SOD882	SOD882	SOD882	SOD882
Reach Compliance Code	compliant	compliant	compliant	compliant
ECCN code	EAR99	EAR99	EAR99	EAR99
Configuration	SINGLE	SINGLE	SINGLE	SINGLE
Diode component materials	SILICON	SILICON	SILICON	SILICON
Diode type	ZENER DIODE	ZENER DIODE	ZENER DIODE	ZENER DIODE
JESD-30 code	R-PBCC-N2	R-PBCC-N2	R-PBCC-N2	R-PBCC-N2
JESD-609 code	e3	e3	e3	e3
Humidity sensitivity level	1	1	1	1
Number of components	1	1	1	1
Number of terminals	2	2	2	2
Maximum operating temperature	150 °C	150 °C	150 °C	150 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER
Peak Reflow Temperature (Celsius)	260	260	260	260
polarity	UNIDIRECTIONAL	UNIDIRECTIONAL	UNIDIRECTIONAL	UNIDIRECTIONAL
Maximum power dissipation	0.25 W	0.25 W	0.25 W	0.25 W
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Nominal reference voltage	11 V	22 V	24 V	30 V
surface mount	YES	YES	YES	YES
technology	ZENER	ZENER	ZENER	ZENER
Terminal surface	Tin (Sn)	Tin (Sn)	Tin (Sn)	Tin (Sn)
Terminal form	NO LEAD	NO LEAD	NO LEAD	NO LEAD
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	40	40	40	40
Maximum voltage tolerance	2%	2%	2%	2%
Working test current	5 mA	5 mA	5 mA	2 mA
Base Number Matches	1	1	1	1

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