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CP300

Description
single-phase silicon bridge-P.C. mtg 2A, heat-sink mtg 3A
File Size123KB,2 Pages
ManufacturerTransys Electronics Limited
Websitehttp://www.transyselectronics.com
Download Datasheet View All

CP300 Overview

single-phase silicon bridge-P.C. mtg 2A, heat-sink mtg 3A

CP300 THRU CP3010
SINGLE-PHASE SILICON BRIDGE-P.C. MTG 2A, HEAT-SINK MTG 3A
VOLTAGE - 50 to 1000 Volts CURRENT - 3.0 Amperes
CP-3
FEATURES
l
l
l
l
l
Surge overload rating—50 Amperes peak
Low forward voltage drop and reverse leakage
Small size, simple installation
Plastic package has Underwriter Laboratory
Flammability Classification 94V-O
Reliable low cost construction utilizing molded
plastic technique
MECHANICAL DATA
Terminals: Leads solderable per MIL-STD-202,
Method 208
Weight: 0.08 ounce, 2.5 grams
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
At 25 ambient temperature unless otherwise noted; resistive or inductive load at 60Hz.
CP300
CP301
CP302
CP304
CP306
CP308 CP3010
UNITS
Max Recurrent Peak Rev Voltage
Max Bridge Input Voltage RMS
Max Average Rectified Output at T
C
=50 *
See Fig.2
at T
A
=25 **
Peak One Cycle Surge Overload Current
Max Forward Voltage Drop per element at
1.5A DC & 25 . See Fig.3
Max Rev Leakage at Rated DC Blocking
Voltage per element at 25
See Fig.4
at 100
2
I t Rating for fusing ( t<8.3ms)
Typical Junction capacitance per leg(Note 4)CJ
Typical Thermal Resistance per leg(Note 2) R JA
(Note 3) R JL
50
35
100
70
200
140
400
280
3.0
2.0
50
1.0
10.0
1.0
15.0
21.0
12.0
8.0
-55 TO +125
-55 TO +150
600
420
800
560
1000
700
V
V
A
A
V
A
m
A
A
2
Sec
P
F
/W
Operating Temperature Range
Storage Temperature Range
NOTES:
1. Bolt down on heat-sink with silicon thermal compound between bridge and mounting surface for
maximum heat transfer with #6 screw.
2. Unit mounted on 4.0
×
4.0
×
0.11” thick (10.5
×
10.5
×
0.3cm) AL. Plate.
3. Unit mounted on P.C.B at 0.375”(9.5mm) lead length with 0.5
×
0.5” (12
×
12mm) copper pads.
4. Measured at 1 MHz and applied reverse voltage of 4.0 Volts.
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