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54ACTQ08DM-MLS

Description
ACT SERIES, QUAD 2-INPUT AND GATE, CDIP14, CERAMIC, DIP-14
Categorylogic    logic   
File Size121KB,5 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
Stay tuned Parametric Compare

54ACTQ08DM-MLS Overview

ACT SERIES, QUAD 2-INPUT AND GATE, CDIP14, CERAMIC, DIP-14

54ACTQ08DM-MLS Parametric

Parameter NameAttribute value
package instructionDIP,
Reach Compliance Codeunknown
seriesACT
JESD-30 codeR-GDIP-T14
length19.43 mm
Logic integrated circuit typeAND GATE
Number of functions4
Number of entries2
Number of terminals14
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package body materialCERAMIC, GLASS-SEALED
encapsulated codeDIP
Package shapeRECTANGULAR
Package formIN-LINE
propagation delay (tpd)8.6 ns
Certification statusNot Qualified
Maximum seat height5.08 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelMILITARY
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
width7.62 mm
Base Number Matches1

54ACTQ08DM-MLS Related Products

54ACTQ08DM-MLS 5962R8954702DA 54ACTQ08MDA 5962R8954702CA 5962R89547022A 54ACTQ08MDS
Description ACT SERIES, QUAD 2-INPUT AND GATE, CDIP14, CERAMIC, DIP-14 ACT SERIES, QUAD 2-INPUT AND GATE, CDFP14, CERAMIC, DFP-14 ACT SERIES, QUAD 2-INPUT AND GATE, UUC14 ACT SERIES, QUAD 2-INPUT AND GATE, CDIP14, CERAMIC, DIP-14 ACT SERIES, QUAD 2-INPUT AND GATE, CQCC20, CERAMIC, LCC-20 ACT SERIES, QUAD 2-INPUT AND GATE, UUC14
package instruction DIP, DFP, FL14,.3 DIE, DIP, DIP14,.3 QCCN, LCC20,.35SQ DIE,
Reach Compliance Code unknown unknow unknown unknown unknown compliant
series ACT ACT ACT ACT ACT ACT
JESD-30 code R-GDIP-T14 R-GDFP-F14 X-XUUC-N14 R-GDIP-T14 S-CQCC-N20 X-XUUC-N14
Logic integrated circuit type AND GATE AND GATE AND GATE AND GATE AND GATE AND GATE
Number of functions 4 4 4 4 4 4
Number of entries 2 2 2 2 2 2
Number of terminals 14 14 14 14 20 14
Package body material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED UNSPECIFIED CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED UNSPECIFIED
encapsulated code DIP DFP DIE DIP QCCN DIE
Package shape RECTANGULAR RECTANGULAR UNSPECIFIED RECTANGULAR SQUARE UNSPECIFIED
Package form IN-LINE FLATPACK UNCASED CHIP IN-LINE CHIP CARRIER UNCASED CHIP
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V
surface mount NO YES YES NO YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS
Terminal form THROUGH-HOLE FLAT NO LEAD THROUGH-HOLE NO LEAD NO LEAD
Terminal location DUAL DUAL UPPER DUAL QUAD UPPER
Base Number Matches 1 1 1 1 1 1
Maximum operating temperature 125 °C 125 °C - 125 °C 125 °C -
Minimum operating temperature -55 °C -55 °C - -55 °C -55 °C -
propagation delay (tpd) 8.6 ns 7.5 ns - 7.5 ns 7.5 ns -
Maximum seat height 5.08 mm 2.032 mm - 5.08 mm 1.905 mm -
Temperature level MILITARY MILITARY - MILITARY MILITARY -
Terminal pitch 2.54 mm 1.27 mm - 2.54 mm 1.27 mm -
width 7.62 mm 6.2865 mm - 7.62 mm 8.89 mm -
Is it Rohs certified? - incompatible - incompatible incompatible conform to
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