Section I. Cyclone II
Device Family Data Sheet
This section provides information for board layout designers to
successfully layout their boards for Cyclone
®
II devices. It contains the
required PCB layout guidelines, device pin tables, and package
specifications.
This section includes the following chapters:
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Chapter 1. Introduction
Chapter 2. Cyclone II Architecture
Chapter 3. Configuration & Testing
Chapter 4. Hot Socketing & Power-On Reset
Chapter 5. DC Characteristics and Timing Specifications
Chapter 6. Reference & Ordering Information
Revision History
Refer to each chapter for its own specific revision history. For information
on when each chapter was updated, refer to the Chapter Revision Dates
section, which appears in the complete handbook.
Altera Corporation
Section I–1
Preliminary
Revision History
Cyclone II Device Handbook, Volume 1
Section I–2
Preliminary
Altera Corporation
1. Introduction
CII51001-3.2
Introduction
Following the immensely successful first-generation Cyclone
®
device
family, Altera
®
Cyclone II FPGAs extend the low-cost FPGA density
range to 68,416 logic elements (LEs) and provide up to 622 usable I/O
pins and up to 1.1 Mbits of embedded memory. Cyclone II FPGAs are
manufactured on 300-mm wafers using TSMC's 90-nm low-k dielectric
process to ensure rapid availability and low cost. By minimizing silicon
area, Cyclone II devices can support complex digital systems on a single
chip at a cost that rivals that of ASICs. Unlike other FPGA vendors who
compromise power consumption and performance for low-cost, Altera’s
latest generation of low-cost FPGAs—Cyclone II FPGAs, offer 60% higher
performance and half the power consumption of competing 90-nm
FPGAs. The low cost and optimized feature set of Cyclone II FPGAs make
them ideal solutions for a wide array of automotive, consumer,
communications, video processing, test and measurement, and other
end-market solutions. Reference designs, system diagrams, and IP, found
at
www.altera.com,
are available to help you rapidly develop complete
end-market solutions using Cyclone II FPGAs.
Low-Cost Embedded Processing Solutions
Cyclone II devices support the Nios II embedded processor which allows
you to implement custom-fit embedded processing solutions. Cyclone II
devices can also expand the peripheral set, memory, I/O, or performance
of embedded processors. Single or multiple Nios II embedded processors
can be designed into a Cyclone II device to provide additional
co-processing power or even replace existing embedded processors in
your system. Using Cyclone II and Nios II together allow for low-cost,
high-performance embedded processing solutions, which allow you to
extend your product's life cycle and improve time to market over
standard product solutions.
Low-Cost DSP Solutions
Use Cyclone II FPGAs alone or as DSP co-processors to improve
price-to-performance ratios for digital signal processing (DSP)
applications. You can implement high-performance yet low-cost DSP
systems with the following Cyclone II features and design support:
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Altera Corporation
February 2008
Up to 150 18 × 18 multipliers
Up to 1.1 Mbit of on-chip embedded memory
High-speed interfaces to external memory
1–1
Features
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DSP intellectual property (IP) cores
DSP Builder interface to The Mathworks Simulink and Matlab
design environment
DSP Development Kit, Cyclone II Edition
Cyclone II devices include a powerful FPGA feature set optimized for
low-cost applications including a wide range of density, memory,
embedded multiplier, and packaging options. Cyclone II devices support
a wide range of common external memory interfaces and I/O protocols
required in low-cost applications. Parameterizable IP cores from Altera
and partners make using Cyclone II interfaces and protocols fast and easy.
Features
The Cyclone II device family offers the following features:
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High-density architecture with 4,608 to 68,416 LEs
●
M4K embedded memory blocks
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Up to 1.1 Mbits of RAM available without reducing available
logic
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4,096 memory bits per block (4,608 bits per block including 512
parity bits)
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Variable port configurations of ×1, ×2, ×4, ×8, ×9, ×16, ×18, ×32,
and ×36
●
True dual-port (one read and one write, two reads, or two
writes) operation for ×1, ×2, ×4, ×8, ×9, ×16, and ×18 modes
●
Byte enables for data input masking during writes
●
Up to 260-MHz operation
Embedded multipliers
●
Up to 150 18- × 18-bit multipliers are each configurable as two
independent 9- × 9-bit multipliers with up to 250-MHz
performance
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Optional input and output registers
Advanced I/O support
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High-speed differential I/O standard support, including LVDS,
RSDS, mini-LVDS, LVPECL, differential HSTL, and differential
SSTL
●
Single-ended I/O standard support, including 2.5-V and 1.8-V,
SSTL class I and II, 1.8-V and 1.5-V HSTL class I and II, 3.3-V PCI
and PCI-X 1.0, 3.3-, 2.5-, 1.8-, and 1.5-V LVCMOS, and 3.3-, 2.5-,
and 1.8-V LVTTL
●
Peripheral Component Interconnect Special Interest Group (PCI
SIG)
PCI Local Bus Specification, Revision 3.0
compliance for 3.3-V
operation at 33 or 66 MHz for 32- or 64-bit interfaces
●
PCI Express with an external TI PHY and an Altera PCI Express
×1 Megacore
®
function
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Cyclone II Device Handbook, Volume 1
Altera Corporation
February 2008
Introduction
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133-MHz PCI-X 1.0 specification compatibility
High-speed external memory support, including DDR, DDR2,
and SDR SDRAM, and QDRII SRAM supported by drop in
Altera IP MegaCore functions for ease of use
Three dedicated registers per I/O element (IOE): one input
register, one output register, and one output-enable register
Programmable bus-hold feature
Programmable output drive strength feature
Programmable delays from the pin to the IOE or logic array
I/O bank grouping for unique VCCIO and/or VREF bank
settings
MultiVolt
™
I/O standard support for 1.5-, 1.8-, 2.5-, and
3.3-interfaces
Hot-socketing operation support
Tri-state with weak pull-up on I/O pins before and during
configuration
Programmable open-drain outputs
Series on-chip termination support
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Flexible clock management circuitry
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Hierarchical clock network for up to 402.5-MHz performance
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Up to four PLLs per device provide clock multiplication and
division, phase shifting, programmable duty cycle, and external
clock outputs, allowing system-level clock management and
skew control
●
Up to 16 global clock lines in the global clock network that drive
throughout the entire device
Device configuration
●
Fast serial configuration allows configuration times less than
100 ms
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Decompression feature allows for smaller programming file
storage and faster configuration times
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Supports multiple configuration modes: active serial, passive
serial, and JTAG-based configuration
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Supports configuration through low-cost serial configuration
devices
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Device configuration supports multiple voltages (either 3.3, 2.5,
or 1.8 V)
Intellectual property
●
Altera megafunction and Altera MegaCore function support,
and Altera Megafunctions Partners Program (AMPP
SM
)
megafunction support, for a wide range of embedded
processors, on-chip and off-chip interfaces, peripheral
functions, DSP functions, and communications functions and
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Altera Corporation
February 2008
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Cyclone II Device Handbook, Volume 1
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