To all our customers
Regarding the change of names mentioned in the document, such as Mitsubishi
Electric and Mitsubishi XX, to Renesas Technology Corp.
The semiconductor operations of Hitachi and Mitsubishi Electric were transferred to Renesas
Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog
and discrete devices, and memory chips other than DRAMs (flash memory, SRAMs etc.)
Accordingly, although Mitsubishi Electric, Mitsubishi Electric Corporation, Mitsubishi
Semiconductors, and other Mitsubishi brand names are mentioned in the document, these names
have in fact all been changed to Renesas Technology Corp. Thank you for your understanding.
Except for our corporate trademark, logo and corporate statement, no changes whatsoever have been
made to the contents of the document, and these changes do not constitute any alteration to the
contents of the document itself.
Note : Mitsubishi Electric will continue the business operations of high frequency & optical devices
and power devices.
Renesas Technology Corp.
Customer Support Dept.
April 1, 2003
Keep safety first in your circuit designs!
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Mitsubishi Electric Corporation puts the maximum effort into making semiconductor
products better and more reliable, but there is always the possibility that trouble may
occur with them. Trouble with semiconductors may lead to personal injury, fire or
property damage. Remember to give due consideration to safety when making your
circuit designs, with appropriate measures such as (i) placement of substitutive,
auxiliary circuits, (ii) use of non-flammable material or (iii) prevention against any
malfunction or mishap.
Notes regarding these materials
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These materials are intended as a reference to assist our customers in the selection
of the Mitsubishi semiconductor product best suited to the customer's application;
they do not convey any license under any intellectual property rights, or any other
rights, belonging to Mitsubishi Electric Corporation or a third party.
Mitsubishi Electric Corporation assumes no responsibility for any damage, or
infringement of any third-party's rights, originating in the use of any product data,
diagrams, charts, programs, algorithms, or circuit application examples contained in
these materials.
All information contained in these materials, including product data, diagrams, charts,
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of these materials, and are subject to change by Mitsubishi Electric Corporation
without notice due to product improvements or other reasons. It is therefore
recommended that customers contact Mitsubishi Electric Corporation or an authorized
Mitsubishi Semiconductor product distributor for the latest product information before
purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical
errors. Mitsubishi Electric Corporation assumes no responsibility for any damage,
liability, or other loss rising from these inaccuracies or errors.
Please also pay attention to information published by Mitsubishi Electric Corporation
by various means, including the Mitsubishi Semiconductor home page (http://
www.mitsubishichips.com).
When using any or all of the information contained in these materials, including
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contained herein.
Mitsubishi Electric Corporation semiconductors are not designed or manufactured
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Please contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semicon
ductor product distributor for further details on these materials or the products con
tained therein.
How to Use This Manual
This user's manual is written for the M16C/62 group.
The reader of this manual is expected to have the basic knowledge of electric and logic
circuits and microcomputers.
This manual explains a function of the following kind.
• M30620M8-XXXFP/GP
• M30620MA-XXXFP/GP
• M30620MC-XXXFP/GP
• M30620EC-XXXFP/GP
• M30620ECFS
• M30620SFP/GP
• M30622M4-XXXFP/GP
• M30622M8-XXXFP/GP
• M30622MA-XXXFP/GP
• M30622MC-XXXFP/GP
• M30622SFP/GP
• M30624MG-XXXFP/GP
• M30624FGFP/GP
• M30624FGLFP/GP
These products have similar features except for the memories, which differ from one product to
another. This manual gives descriptions of M30622MC-XXXFP. An electric characteristic refer
to data sheet responded to. Memories built-in are as shown below. Be careful when writing a
program, as the memories have different capacities.
ROM Size
(Byte)
External
ROM
256K
128K
96K
64K
32K
M30624MG-XXXFP/GP
M30620MC-XXXFP/GP
M30622MC-XXXFP/GP M30620ECFP/GP
M30620MA-XXXFP/GP
M30622MA-XXXFP/GP
M30620M8-XXXFP/GP
M30622M8-XXXFP/GP
M30622M4-XXXFP/GP
Mask ROM version
One-time PROM version
EPROM version
Flash memory version
External ROM version
M30620ECFS
M30624FGFP/GP
M30624FGLFP/GP
M30620SFP/GP
M30622SFP/GP
The figure of each register configuration describes its functions, contents at reset, and attributes
as follows :
• Bit attribute
R.....Read
O.....Possible to read
X.....Impossible to read
Timer Ai mode register
b7
b6
b5
b4
b3
b2
b1
b0
W.....Write
O.....Possible to write
X.....Impossible to write
Bit attribute
Symbol
TAiMR(i=0 to 4)
Address
When reset
00
16
0396
16
to 039A
16
Bit symbol
TMOD0
Bit name
Operation mode select bit
b1 b0
Function
0 0 : Timer mode
0 1 : Event counter mode
1 0 : One-shot timer mode
1 1 : Pulse width modulation
(PWM) mode
RW
TMOD1
MR0
MR1
MR2
MR3
TCK0
TCK1
Function varies with each operation mode
Count source select bit
(Function varies with each operation mode)
This manual comprises of eight chapters. Use the suggested chapters as a reference for the
following topics:
* To understand hardware specifications ................................................... Chapter 1 Hardware
* To understand the basic way of using peripheral
features and the operation timing ................................ Chapter 2 Peripheral Functions Usage
* To observe applications of
peripheral features ........................ Chapter 3 Examples of Peripheral Functions Applications
* To understand interrupt timing in detail .................................................... Chapter 4 Interrupts
* To understand how to use external buses ....................................... Chapter 5 External Buses
* To know the difference between
the mask ROM Version and external ROM Version ............ Chapter 6 External ROM Version
* To understand standard data............................................ Chapter 7 Standard Characteristics
This manual includes a quick reference immediately following the Table of Contents, indicate
the page of the topic to be pursued.
* To find a page describing a specific register
by the register address ............................... Quick Reference to Pages Classified by Address
Extra application note explains follows, and please refer to each application note in addition to
above.
* I
2
C BUS ............................................................................... M16C/62 Group SIMPLE I
2
C BUS
* Three-phase motor control timer function ... M16C/62 Group THREE-PHASE MOTOR CONTROL
FPGA/CPLD
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