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M27C4001-10L1X

Description
4 mbit 512kb x 8 UV eprom and otp eprom
Categorystorage    storage   
File Size157KB,17 Pages
ManufacturerSTMicroelectronics
Websitehttp://www.st.com/
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M27C4001-10L1X Overview

4 mbit 512kb x 8 UV eprom and otp eprom

M27C4001-10L1X Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Parts packaging codeQFJ
package instructionWINDOWED, CERAMIC, LCC-32
Contacts32
Reach Compliance Codenot_compliant
ECCN codeEAR99
Maximum access time100 ns
I/O typeCOMMON
JESD-30 codeR-CQCC-N32
JESD-609 codee0
length13.97 mm
memory density4194304 bit
Memory IC TypeUVPROM
memory width8
Number of functions1
Number of terminals32
word count524288 words
character code512000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize512KX8
Output characteristics3-STATE
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeWQCCN
Encapsulate equivalent codeLCC32,.45X.55
Package shapeRECTANGULAR
Package formCHIP CARRIER, WINDOW
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
Maximum seat height2.8 mm
Maximum standby current0.0001 A
Maximum slew rate0.03 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formNO LEAD
Terminal pitch1.27 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
width11.43 mm
Base Number Matches1
M27C4001
4 Mbit (512Kb x 8) UV EPROM and OTP EPROM
s
5V ± 10% SUPPLY VOLTAGE in READ
OPERATION
ACCESS TIME: 35ns
LOW POWER CONSUMPTION:
– Active Current 30mA at 5MHz
– Standby Current 100µA
1
32
s
s
32
1
s
s
s
PROGRAMMING VOLTAGE: 12.75V ± 0.25V
PROGRAMMING TIME: 100µs/word
ELECTRONIC SIGNATURE
– Manufacturer Code: 20h
– Device Code: 41h
FDIP32W (F)
PDIP32 (B)
LCCC32W (L)
DESCRIPTION
The M27C4001 is a 4 Mbit EPROM offered in the
two ranges UV (ultra violet erase) and OTP (one
time programmable). It is ideally suited for micro-
processor systems requiring large programs and
is organised as 524,288 by 8 bits.
The FDIP32W (window ceramic frit-seal package)
and LCCC32W (leadless chip carrier package)
have a transparent lid which allow the user to ex-
pose the chip to ultraviolet light to erase the bit pat-
tern. A new pattern can then be written to the
device by following the programming procedure.
For applications where the content is programmed
only one time and erasure is not required, the
M27C4001 is offered in PDIP32, PLCC32 and
TSOP32 (8 x 20 mm) packages.
PLCC32 (C)
TSOP32 (N)
8 x 20 mm
Figure 1. Logic Diagram
VCC
VPP
19
A0-A18
8
Q0-Q7
E
G
M27C4001
VSS
AI00721B
November 2000
1/17

M27C4001-10L1X Related Products

M27C4001-10L1X M27C4001-10L1TR
Description 4 mbit 512kb x 8 UV eprom and otp eprom 4 mbit 512kb x 8 UV eprom and otp eprom
Is it Rohs certified? incompatible incompatible
Parts packaging code QFJ QFJ
package instruction WINDOWED, CERAMIC, LCC-32 WINDOWED, CERAMIC, LCC-32
Contacts 32 32
Reach Compliance Code not_compliant not_compliant
ECCN code EAR99 EAR99
Maximum access time 100 ns 100 ns
I/O type COMMON COMMON
JESD-30 code R-CQCC-N32 R-CQCC-N32
JESD-609 code e0 e0
length 13.97 mm 13.97 mm
memory density 4194304 bit 4194304 bit
Memory IC Type UVPROM UVPROM
memory width 8 8
Number of functions 1 1
Number of terminals 32 32
word count 524288 words 524288 words
character code 512000 512000
Operating mode ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C
organize 512KX8 512KX8
Output characteristics 3-STATE 3-STATE
Package body material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
encapsulated code WQCCN WQCCN
Encapsulate equivalent code LCC32,.45X.55 LCC32,.45X.55
Package shape RECTANGULAR RECTANGULAR
Package form CHIP CARRIER, WINDOW CHIP CARRIER, WINDOW
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED
power supply 5 V 5 V
Certification status Not Qualified Not Qualified
Maximum seat height 2.8 mm 2.8 mm
Maximum standby current 0.0001 A 0.0001 A
Maximum slew rate 0.03 mA 0.03 mA
Maximum supply voltage (Vsup) 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V
surface mount YES YES
technology CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form NO LEAD NO LEAD
Terminal pitch 1.27 mm 1.27 mm
Terminal location QUAD QUAD
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED
width 11.43 mm 11.43 mm
Base Number Matches 1 1

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