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500SC01H105MLU

Description
Ceramic Capacitor, Multilayer, Ceramic, 50V, -60ppm/Cel TC, 1uF, 4038
CategoryPassive components    capacitor   
File Size247KB,4 Pages
ManufacturerRakon Limited
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500SC01H105MLU Overview

Ceramic Capacitor, Multilayer, Ceramic, 50V, -60ppm/Cel TC, 1uF, 4038

500SC01H105MLU Parametric

Parameter NameAttribute value
MakerRakon Limited
package instruction, 4038
Reach Compliance Codeunknown
ECCN codeEAR99
capacitance1 µF
Capacitor typeCERAMIC CAPACITOR
Custom functionsLead Free
dielectric materialsCERAMIC
high2.7 mm
length10.2 mm
Manufacturer's serial numberSC01(50V)
multi-layerYes
negative tolerance20%
Number of terminals2
Maximum operating temperature200 °C
Minimum operating temperature-55 °C
Package formSMT
positive tolerance20%
Rated (DC) voltage (URdc)50 V
seriesSC01(50V)
size code4038
Temperature Coefficient-60ppm/Cel ppm/°C
width9.6 mm
Base Number Matches1
H
IGH
T
EMPERATURE
Multilayer Ceramic Capacitors
F
EATURES
Three product families indicated for high temperature (up to 175°C and up to 200°C)
SMD & stacked capacitors
B
ENEFITS
An improved lead-free Ni barrier termination compatible with lead free solders has been
developed in order to withstand high temperatures (up to 175°C only) and harsh mechanical
stresses.
R
ECOMMENDED
A
PPLICATIONS
High temperatures applications :
Automotive: requirements for environment protection, safety and security leads to an increased
demand for electronic control units (ECU’s) mounted near the working place. Such ECU
requires electronic components bearing high temperatures, rapid gradients and heavy
mechanical vibrations and shocks.
Aerospace & Oil drilling require components withstanding higher temperatures, up to 200°C,
and harsh mechanical stresses during transportation and operation on tools
T
ERMINATION
Pure Sn over Ni for SMD up to 175°C
AgPdPt termination, developed for high temperature: up to 200°C , less sensitive to thermal
shocks, compatible with high melting point solder containing lead.
DIL type J,L or N for stacked capacitors.
January 13
th
, 2005 - Preliminary Specification Issue A
1

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