54AC818DMQB datasheet, PDF - EEWORLD Datasheet

54AC818DMQB: DescriptionIC,PIPELINE REGISTER,AC-CMOS,DIP,24PIN,CERAMIC; CategoryThe embedded processor and controller Microcontrollers and processors; File Size454KB，8 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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54AC818DMQB Overview

IC,PIPELINE REGISTER,AC-CMOS,DIP,24PIN,CERAMIC

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
package instruction	DIP, DIP24,.6
Reach Compliance Code	unknown
JESD-30 code	R-XDIP-T24
JESD-609 code	e0
Number of terminals	24
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP24,.6
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	3.3/5 V
Certification status	Not Qualified
Filter level	38535Q/M;38534H;883B
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
uPs/uCs/peripheral integrated circuit type	DSP PERIPHERAL, PIPELINE REGISTER
Base Number Matches	1

	54AC818DMQB	54AC818LMQB	54AC818FMQB
Description	IC,PIPELINE REGISTER,AC-CMOS,DIP,24PIN,CERAMIC	IC,PIPELINE REGISTER,AC-CMOS,LLCC,28PIN,CERAMIC	IC,PIPELINE REGISTER,AC-CMOS,FP,24PIN,CERAMIC
Is it Rohs certified?	incompatible	incompatible	incompatible
package instruction	DIP, DIP24,.6	QCCN, LCC28,.45SQ	DFP, FL24,.4
Reach Compliance Code	unknown	unknown	unknown
JESD-30 code	R-XDIP-T24	S-XQCC-N28	R-XDFP-F24
JESD-609 code	e0	e0	e0
Number of terminals	24	28	24
Maximum operating temperature	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C
Package body material	CERAMIC	CERAMIC	CERAMIC
encapsulated code	DIP	QCCN	DFP
Encapsulate equivalent code	DIP24,.6	LCC28,.45SQ	FL24,.4
Package shape	RECTANGULAR	SQUARE	RECTANGULAR
Package form	IN-LINE	CHIP CARRIER	FLATPACK
power supply	3.3/5 V	3.3/5 V	3.3/5 V
Certification status	Not Qualified	Not Qualified	Not Qualified
Filter level	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B
surface mount	NO	YES	YES
technology	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	NO LEAD	FLAT
Terminal pitch	2.54 mm	1.27 mm	1.27 mm
Terminal location	DUAL	QUAD	DUAL
uPs/uCs/peripheral integrated circuit type	DSP PERIPHERAL, PIPELINE REGISTER	DSP PERIPHERAL, PIPELINE REGISTER	DSP PERIPHERAL, PIPELINE REGISTER
Base Number Matches	1	1	1

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