TYC1812B223MDP datasheet, PDF - EEWORLD Datasheet

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TYC1812B223MDP: DescriptionCeramic Capacitor, Multilayer, Ceramic, 10V, 20% +Tol, 20% -Tol, X7R, -/+15ppm/Cel TC, 0.022uF, 1812; CategoryPassive components capacitor; File Size330KB，8 Pages; ManufacturerTE Connectivity; Websitehttp://www.te.com; Environmental Compliance

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TYC1812B223MDP Overview

Ceramic Capacitor, Multilayer, Ceramic, 10V, 20% +Tol, 20% -Tol, X7R, -/+15ppm/Cel TC, 0.022uF, 1812

TYC1812B223MDP Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Objectid	7137653806
package instruction	, 1812
Reach Compliance Code	unknown
ECCN code	EAR99
YTEOL	0
capacitance	0.022 µF
Capacitor type	CERAMIC CAPACITOR
dielectric materials	CERAMIC
high	1.25 mm
JESD-609 code	e3
length	4.5 mm
multi-layer	Yes
negative tolerance	20%
Number of terminals	2
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package form	SMT
method of packing	Tape, Plastic
positive tolerance	20%
Rated (DC) voltage (URdc)	10 V
size code	1812
Temperature characteristic code	X7R
Temperature Coefficient	15% ppm/°C
Terminal surface	Tin (Sn) - with Nickel (Ni) barrier
width	3.2 mm

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Multilayer Ceramic Chip Capacitor

Type TYC Series

Key Features

Choice of Dielectrics

(NP0, X7R, X5R, Y5V)

0402 to 1812 sizes as

standard

Other sizes available.

0201 available soon

6.3V to 50V in standard

range

Voltage ratings to 3kV

on selected products

Range of tolerances

available

RoHS Compliant

Excellent thermal stability

Low dissipation factor

Multilayer ceramic capacitors (MLCC) are manufactured by suspending ceramic powders in

liquid and casting into a thin green sheet from 20mm in thickness to 5mm or thinner.

Metal electrodes are sieved printed onto green sheets, which are later stacked to form a

laminated structure. The metal electrodes are arranged so that the termination alternates from

one edge to another of the capacitor.

Upon sintering at high temperature the part becomes a monolithic block, which can provide

an extremely high capacitance in small mechanical volumes.

Finally, the termination electrodes are formed by composite of outer metal-glass electrode and

followed by a barrier layer and pure-tin plating to permit MLCC to be soldered directly onto

printed circuit board.

Structure

End Termination

(4)

(5)

(3)

Ceramic

(1) Dielectric

(2) Internal

Electrode

Class 1

End Terminal

Specifications

Ceramic dielectric

Internal Electrode

Inner Layer

Middle Layer

Outer Layer

Material

Barium titanate base

Pb, PdAg

Class 2

End Terminal

Internal Electrode

Inner Layer

Middle Layer

Outer Layer

Specifications

Ceramic dielectric

Pb, PbAg

Material

Barium titanate base

1773291 CIS BI 06/2011

Dimensions are in millimeters

and inches unless otherwise

specified. Values in brackets

are standard equivalents.

Dimensions are shown for

reference purposes only.

Specifications subject

to change.

For email, phone or live chat, go to:

te.com/help

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