Approval sheet
Low Inductance Capacitors
MULTILAYER CERAMIC CAPACITORS
Low Inductance Series
0612 Size, 50V
X7R Dielectric
RoHS Compliance
*Contents in this sheet are subject to change without prior notice.
Page 1 of 7
ASC_ Low Inductance_(0612)_004J_AS
Oct. 2012
Approval sheet
Low Inductance Capacitors
1. DESCRIPTION
MLCC consists of a conducting material and electrodes. To manufacture a chip-type SMT and achieve miniaturization,
high density and high efficiency, ceramic condensers are used.
The total inductance of MLCC is determined by its length to width ratio and by the mutual inductance coupling between
its electrodes. The positioning of end terminations is along the length of MLCC to reduce ESR and ESL characteristics of
component over conventional products.
2. FEATURES
a.
b.
c.
d.
Standard size with thin thickness.
Small size with high capacitance.
Capacitor with lead-free termination (pure Tin).
MLCC with low ESL performance.
3. APPLICATIONS
a.
b.
c.
IC decoupling.
High-speed microprocessors.
High frequency digital equipments.
4. HOW TO ORDER
0612
Size
Inch (mm)
0612
(1632)
B
Dielectric
B=X7R
103
Capacitance
K
Tolerance
500
Rated voltage
C
Termination
T
Packaging
T=7”
reeled
Two significant digits
K=±10%
followed by no. of zeros.
M=±20%
And R is in place of
decimal point.
eg.:
103=10x10
3
=10nF
Two significant digits
C=Cu/Ni/Sn
followed by no. of
zeros. And R is in
place of decimal point.
eg.:
500=50x10
0
=50VDC
5. EXTERNAL DIMENSIONS
Size
Inch (mm)
0612 (1632)
L (mm)
3.20±0.15
W (mm)
1.60±0.15
T (mm)/Symbol
0.80±0.10
B
T
a
min. (mm) T
b
min. (mm)
W
L
0.5
0.13
Ta
Tb
T
Tb
* Reflow soldering process only is recommended.
Fig. 1 The outline of MLCC
Page 2 of 7
ASC_ Low Inductance_(0612)_004J_AS
Oct. 2012
Approval sheet
Low Inductance Capacitors
6. GENERAL ELECTRICAL DATA
Dielectric
Size
Capacitance range*
Capacitance tolerance**
Rated voltage (WVDC)
Tan
δ*
Insulation resistance at Ur
Operating temperature
Capacitance characteristic
Termination
ESL
X7R
0612
10nF to 150nF
K (±10%), M (±20%)
50V
≤2.5%
≥10G
±15%
Ni/Sn (lead-free termination)
500pH
or RxC≥500 xF whichever is less
-55 to +125°
C
* Measured at 1.0±0.2Vrms, 1.0kHz±10%, 30~70% related humidity, 25° ambient temperature.
C
** Preconditioning for Class II MLCC: Perform a heat treatment at 150±10° for 1 hour, then leave in a mbient condition for 24±2 hours
C
before measurement.
7. CAPACITANCE RANGE
DIELECTRIC
SIZE
RATED VOLTAGE (VDC)
10nF (103)
12nF (123)
15nF (153)
18nF (183)
22nF (223)
27nF (273)
33nF (333)
39nF (393)
47nF (473)
56nF (563)
68nF (683)
82nF (823)
100nF (104)
120nF (124)
150nF (154)
1. The letter in cell is expressed the symbol of product thickness.
Capacitance
X7R
0612
50
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
8. PACKAGING DIMENSION AND QUANTITY
Size
0612 (1632)
Thickness (mm)/Symbol
0.80±0.10
B
7” reel / Paper tape
4k
Unit: pieces
Page 3 of 7
ASC_ Low Inductance_(0612)_004J_AS
Oct. 2012
Approval sheet
Low Inductance Capacitors
9. RELIABILITY TEST CONDITIONS AND REQUIREMENTS
No.
1.
2.
3.
Item
Visual and
Mechanical
Capacitance
Q/ D.F.
(Dissipation
Factor)
1.0±0.2Vrms, 1kHz±10%
---
Test Condition
* No remarkable defect.
Requirements
* Dimensions to conform to individual specification sheet.
* Shall not exceed the limits given in the detailed spec.
X7R: ≤2.5%
4.
Dielectric
Strength
* To apply voltage: 250% rated voltage.
* Duration: 1 to 5 sec.
* Charge and discharge current less than 50mA.
* No evidence of damage or flash over during test.
5.
6.
Insulation
Resistance
Temperature
Coefficient
To apply rated voltage for max. 120 sec.
≥10G or RxC≥500 -F whichever is smaller.
With no electrical load.
T.C.
X7R
Operating Temp
-55~125°C at 25°C
T.C.
X7R
Capacitance Change
Within ±15%
7.
Adhesive
Strength of
Termination
* Pressurizing force：10N.
* Test time: 10±1 sec.
* No remarkable damage or removal of the terminations.
8.
Vibration
Resistance
* Vibration frequency: 10~55 Hz/min.
* Total amplitude: 1.5mm
* Test time: 6 hrs. (Two hrs each in three mutually
perpendicular directions.)
* Measurement to be made after keeping at room temp. for
24±2 hrs.
* No remarkable damage.
* Cap change and Q/D.F.: To meet initial spec.
9.
10.
Solderability
* Solder temperature: 235±5°C
* Dipping time: 2±0.5 sec.
95% min. coverage of all metalized area.
Bending Test
* The middle part of substrate shall be pressurized by means
* No remarkable damage.
of the pressurizing rod at a rate of about 1 mm per second until
* Cap change: X7R: within ±12.5%
the deflection becomes 1 mm and then the pressure shall be
maintained for 5±1 sec.
* Measurement to be made after keeping at room temp. for
24±2 hrs.
(This capacitance change means the change of capacitance under
specified flexure of substrate from the capacitance measured
before the test.)
11.
Resistance to
* Solder temperature: 260±5°
C
* No remarkable damage.
* Cap change: X7R: within ±7.5%
* Q/D.F., I.R. and dielectric strength: To meet initial requirements.
* 25% max. leaching on each edge.
Soldering Heat
* Dipping time: 10±1 sec
* Preheating: 120 to 150° for 1 minute before imme rse the
C
capacitor in a eutectic solder.
* Before initial measurement (Class II only): Perform
150+0/-10° for 1 hr and then set for 24±2 hrs at r oom temp.
C
* Measurement to be made after keeping at room temp. for
24±2 hrs.
12.
Temperature
Cycle
* Conduct the five cycles according to the temperatures and * No remarkable damage.
time.
Step
1
2
3
4
Temp. (°C)
Min. operating temp. +0/-3
Room temp.
Max. operating temp. +3/-0
Room temp.
Time (min.)
30±3
2~3
30±3
2~3
* Cap change: X7R: within ±7.5%
* Q/D.F., I.R. and dielectric strength: To meet initial requirements.
* Before initial measurement (Class II only): Perform
150+0/-10° for 1 hr and then set for 24±2 hrs at r oom temp.
C
* Measurement to be made after keeping at room temp. for
24±2 hrs.
Page 4 of 7
ASC_ Low Inductance_(0612)_004J_AS
Oct. 2012
Approval sheet
Low Inductance Capacitors
No.
13.
Item
Humidity
(Damp Heat)
Steady State
* Test temp.: 40±2°C
Test Condition
* Humidity: 90~95% RH
* Test time: 500+24/-0hrs.
*Before initial measurement (Class II only): Perform
150+0/-10° for 1 hr and then set for 24±2 hrs at r oom temp.
C
* Measurement to be made after keeping at room temp. for
24±2 hrs.
Requirements
* No remarkable damage.
* Cap change: X7R: within ±12.5%
* Q/D.F. value: X7R: ≤3.0%
* I.R.: ≥1G or RxC≥50 -F whichever is smaller.
14.
Humidity
(Damp Heat)
Load
* Test temp.: 40±2°C
* Humidity: 90~95%RH
* Test time: 500+24/-0 hrs.
* To apply voltage：rated voltage.
* Before initial measurement (Class II only): To apply test
voltage for 1hr at 40°C and then set for 24±2 hrs at room temp.
* Measurement to be made after keeping at room temp. for
24±2 hrs.
* No remarkable damage.
* Cap change: X7R: within ±12.5%
* Q/D.F. value: X7R: ≤3.0%
* I.R.: ≥500M or RxC≥25 -F whichever is smaller.
15.
High
Temperature
Load
(Endurance)
* Test temp.: X7R: 125±3°C
* To apply voltage: 200% of rated voltage.
* Test time: 1000+24/-0 hrs.
*Before initial measurement (Class II only): To apply test
voltage for 1hr at test temp. and then set for 24±2 hrs at room
temp.
*Measurement to be made after keeping at room temp. for
24±2 hrs
* No remarkable damage.
* Cap change: X7R: within ±12.5%
* Q/D.F. value: X7R: ≤3.0%
* I.R.: ≥1G or RxC≥50 -F whichever is smaller.
Page 5 of 7
ASC_ Low Inductance_(0612)_004J_AS
Oct. 2012
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