LM3S1811-IBZ50-C1T datasheet, PDF

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LM3S1811-IBZ50-C1T: DescriptionARM Microcontrollers - MCU 1000 SERIES - STELLARIS MICROCONTROLLER; CategoryThe embedded processor and controller Microcontrollers and processors; File Size6MB，948 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/; Environmental Compliance

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ARM Microcontrollers - MCU 1000 SERIES - STELLARIS MICROCONTROLLER

LM3S1811-IBZ50-C1T Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Texas Instruments
Parts packaging code	BGA
package instruction	LFBGA, BGA108,12X12,32
Contacts	108
Reach Compliance Code	unknown
Has ADC	YES
Address bus width
bit size	32
maximum clock frequency	0.032 MHz
DAC channel	NO
DMA channel	YES
External data bus width
JESD-30 code	S-PBGA-B108
length	10 mm
Number of I/O lines	67
Number of terminals	108
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
PWM channel	YES
Package body material	PLASTIC/EPOXY
encapsulated code	LFBGA
Encapsulate equivalent code	BGA108,12X12,32
Package shape	SQUARE
Package form	GRID ARRAY
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	1.2,3.3 V
Certification status	Not Qualified
RAM (bytes)	32768
rom(word)	262144
ROM programmability	FLASH
Maximum seat height	1.5 mm
speed	80 MHz
Maximum supply voltage	1.32 V
Minimum supply voltage	1.08 V
Nominal supply voltage	1.2 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	10 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER

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Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	-	-	conform to
Maker	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	-	-	Texas Instruments
Parts packaging code	BGA	QFP	QFP	BGA	BGA	-	-	BGA
package instruction	LFBGA, BGA108,12X12,32	LFQFP, QFP100,.63SQ,20	LFQFP, QFP100,.63SQ,20	LFBGA, BGA108,12X12,32	LFBGA, BGA108,12X12,32	-	-	LFBGA, BGA108,12X12,32
Contacts	108	100	100	108	108	-	-	108
Reach Compliance Code	unknown	compli	compli	compli	compliant	-	-	unknown
Has ADC	YES	YES	YES	YES	YES	-	-	YES
bit size	32	32	32	32	32	-	-	32
maximum clock frequency	0.032 MHz	16 MHz	16 MHz	16 MHz	16 MHz	-	-	0.032 MHz
DAC channel	NO	NO	NO	NO	NO	-	-	NO
DMA channel	YES	YES	YES	YES	YES	-	-	YES
JESD-30 code	S-PBGA-B108	S-PQFP-G100	S-PQFP-G100	S-PBGA-B108	S-PBGA-B108	-	-	S-PBGA-B108
length	10 mm	14 mm	14 mm	10 mm	10 mm	-	-	10 mm
Number of I/O lines	67	67	67	67	67	-	-	67
Number of terminals	108	100	100	108	108	-	-	108
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	-	-	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-	-	-40 °C
PWM channel	YES	YES	YES	YES	YES	-	-	YES
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-	-	PLASTIC/EPOXY
encapsulated code	LFBGA	LFQFP	LFQFP	LFBGA	LFBGA	-	-	LFBGA
Encapsulate equivalent code	BGA108,12X12,32	QFP100,.63SQ,20	QFP100,.63SQ,20	BGA108,12X12,32	BGA108,12X12,32	-	-	BGA108,12X12,32
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	-	-	SQUARE
Package form	GRID ARRAY	FLATPACK	FLATPACK	GRID ARRAY	GRID ARRAY	-	-	GRID ARRAY
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	260	260	260	260	-	-	NOT SPECIFIED
power supply	1.2,3.3 V	1.2,3.3 V	1.2,3.3 V	1.2,3.3 V	1.2,3.3 V	-	-	1.2,3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-	-	Not Qualified
RAM (bytes)	32768	32768	32768	32768	32768	-	-	32768
rom(word)	262144	262144	262144	262144	262144	-	-	262144
ROM programmability	FLASH	FLASH	FLASH	FLASH	FLASH	-	-	FLASH
Maximum seat height	1.5 mm	1.6 mm	1.6 mm	1.5 mm	1.5 mm	-	-	1.5 mm
speed	80 MHz	50 MHz	50 MHz	50 MHz	50 MHz	-	-	80 MHz
Maximum supply voltage	1.32 V	3.6 V	3.6 V	3.6 V	3.6 V	-	-	1.32 V
Minimum supply voltage	1.08 V	3 V	3 V	3 V	3 V	-	-	1.08 V
Nominal supply voltage	1.2 V	3.3 V	3.3 V	3.3 V	3.3 V	-	-	1.2 V
surface mount	YES	YES	YES	YES	YES	-	-	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	-	-	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	-	-	INDUSTRIAL
Terminal form	BALL	GULL WING	GULL WING	BALL	BALL	-	-	BALL
Terminal pitch	0.8 mm	0.5 mm	0.5 mm	0.8 mm	0.8 mm	-	-	0.8 mm
Terminal location	BOTTOM	QUAD	QUAD	BOTTOM	BOTTOM	-	-	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	-	NOT SPECIFIED
width	10 mm	14 mm	14 mm	10 mm	10 mm	-	-	10 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	-	-	MICROCONTROLLER

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