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ISM64-32B9H2-155.520MHZ

Description
LVPECL Output Clock Oscillator, 155.52MHz Nom, SMD, 6 PIN
CategoryPassive components    oscillator   
File Size100KB,3 Pages
ManufacturerAbracon
Websitehttp://www.abracon.com/index.htm
Environmental Compliance
Download Datasheet Parametric View All

ISM64-32B9H2-155.520MHZ Overview

LVPECL Output Clock Oscillator, 155.52MHz Nom, SMD, 6 PIN

ISM64-32B9H2-155.520MHZ Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Objectid4035504796
package instructionSMD, 6 PIN
Reach Compliance Codecompliant
YTEOL0
Other featuresENABLE/DISABLE FUNCTION; COMPLEMENTARY OUTPUT
maximum descent time0.6 ns
Frequency Adjustment - MechanicalNO
frequency stability50%
Installation featuresSURFACE MOUNT
Number of terminals6
Nominal operating frequency155.52 MHz
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Oscillator typeLVPECL
Output load50 OHM
Package body materialCERAMIC
Encapsulate equivalent codeSOLCC6,.12
physical size5.0mm x 3.2mm x 1.4mm
longest rise time0.6 ns
Maximum slew rate65 mA
Maximum supply voltage3.63 V
Minimum supply voltage2.97 V
Nominal supply voltage3.3 V
surface mountYES
maximum symmetry45/55 %

ISM64-32B9H2-155.520MHZ Preview

3.2 mm x 5.0 mm Ceramic Package SMD Oscillator,
LVCMOS / LVPECL / LVDS
ISM64 Series
Product Features
Small Surface Mount Package
Fast Sample Delivery
Frequencies to 1500 MHz
Pb Free/ RoHS Compliant
Leadfree Processing
Applications
xDSL
Broadcast video
Wireless Base Stations
Sonet /SDH
WiMAX/WLAN
Server and Storage
Ethernet/LAN/WAN
Optical modules
Clock and data recovery
FPGA/ASIC
Backplanes
GPON
Frequency
LVCMOS
LVPECL
LVDS
Output Level
LVCMOS
LVPECL
LVDS
Duty Cycle
LVCMOS
LVPECL
LVDS
Rise / Fall Time
LVCMOS
LVPECL
LVDS
Output Load
LVCMOS
LVPECL
LVDS
Frequency Stability
Supply Voltage
Current
Phase Jitter (RMS)
At 12kHz to 20 MHz
Operating Temp.
Range
Storage
10 MHz to 250 MHz
10 MHz to 1500 MHz
10 MHz to 1500 MHz
VOH=90% VDD min., VOL=10 % VDD max.
VOH=VDD-1.03V max. (Nom. Load), VOL=VDD-1.6V max. (Nom. Load)
VOD=(Diff. Output) 350mV Typ.
50% ±5% @ 50%VDD
50% ±5% @ 50%*
50% ±5% @ 50%*
3.0 ns max. (90%/10%)*
0.6 ns max. (80%/20%)*
0.6 ns max. (80%/20%)*
15pF
50
to VDD - 2.0 VDC
RL=100
/CL=10pF
See Table Below
3.3 VDC ± 10%, 2.5VDC ± 5%
LVCMOS = 45 mA max., LVPECL = 65 mA max. LVDS = 35 mA max.
0.9 ps typical
See Table Below
-40
C to +100
C
Bypass =0.01 uF
Recommended Pad Layout
Pin
1
2
3
4
5
6
Connection
Enable/Disable or N.C.
Enable/Disable or N.C
Ground
Output
Output or N.C.
V
DD
Dimension Units: mm
Part Number Guide
Package
Input
Voltage
3 = 3.3V
6 = 2.5V
Sample Part Number:
Operating
Temperature
1 = 0 C to +70 C
3 = -20 C to +70 C
2 = -40 C to +85 C
ISM64–31A9H2–155.520
Output
3 = LVCMOS
8 = LVDS
9 = LVPECL
Stability
(in ppm)
F =
20
A =
25
B =
50
Enable / Disable
H = Enable (Pin 1)
K = Enable (Pin 2)
Complimentary
Ouput (Pin 5) **
1 = N.C.
2 = Output
Frequency
ISM64
-155.520 MHz
NOTE: A 0.01 µF bypass capacitor is recommended between V
DD
(pin 6) and GND (pin 3) to minimize power supply noise. * Measured as percent of
waveform. ** Available on LVDS and LVPECL ouput only
.
ILSI America Phone 775-851-8880
Fax 775-851-8882
●email:
e-mail@ilsiamerica.com
www.ilsiamerica.com
Specifications subject to change without notice
Rev: 11/08/13_E
Page 1 of 3
3.2 mm x 5.0 mm Ceramic Package SMD Oscillator,
LVCMOS / LVPECL / LVDS
ISM64 Series
Typical Application:
Pb Free Solder Reflow Profile:
*Units are backward compatible with 240C reflow processes
Package Information:
MSL = N.A. (package does not contain plastic, storage life is
unlimited under normal room conditions).
Termination = e4 (Au over Ni over W base metallization).
Tape and Reel Information:
Quantity per
Reel
A
B
C
D
E
F
1000
16 +/-.3
8 +/-.2
7.5 +/-.2
17.5 +/-1
50 / 60 / 80
180 / 250
ILSI America Phone 775-851-8880
Fax 775-851-8882
●email:
e-mail@ilsiamerica.com
www.ilsiamerica.com
Specifications subject to change without notice
Rev: 11/08/13_E
Page 2 of 3
3.2 mm x 5.0 mm Ceramic Package SMD Oscillator,
LVCMOS / LVPECL / LVDS
ISM64 Series
Environmental Specifications
Thermal Shock
Moisture Resistance
Mechanical Shock
Mechanical Vibration
Resistance to Soldering Heat
Hazardous Substance
Solderability
Terminal Strength
Gross Leak
Fine Leak
Solvent Resistance
MIL-STD-883, Method 1011, Condition A
MIL-STD-883, Method 1004
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 2007, Condition A
J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)
Pb-Free / RoHS / Green Compliant
JESD22-B102-D Method 2 (Preconditioning E)
MIL-STD-883, Method 2004, Test Condition D
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s
MIL-STD-202, Method 215
Marking
Line 1: ILSI and Date Code (YWW)
Line 2: Frequency
ILSI America Phone 775-851-8880
Fax 775-851-8882
●email:
e-mail@ilsiamerica.com
www.ilsiamerica.com
Specifications subject to change without notice
Rev: 11/08/13_E
Page 3 of 3
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