GT28F640C3TC100 datasheet, PDF

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GT28F640C3TC100: DescriptionFlash, 4MX16, 100ns, PBGA48, CSP, MICRO, BGA-48; Categorystorage storage; File Size355KB，70 Pages; ManufacturerNumonyx ( Micron ); Websitehttps://www.micron.com

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GT28F640C3TC100 Overview

Flash, 4MX16, 100ns, PBGA48, CSP, MICRO, BGA-48

GT28F640C3TC100 Parametric

Parameter Name	Attribute value
Maker	Numonyx ( Micron )
Parts packaging code	BGA
package instruction	CSP, MICRO, BGA-48
Contacts	48
Reach Compliance Code	unknown
ECCN code	3A991.B.1.A
Maximum access time	100 ns
Other features	USER-SELECTABLE 3V OR 12V VPP; TOP BOOT BLOCK
startup block	TOP
JESD-30 code	R-PBGA-B48
length	13 mm
memory density	67108864 bit
Memory IC Type	FLASH
memory width	16
Number of functions	1
Number of terminals	48
word count	4194304 words
character code	4000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	4MX16
Package body material	PLASTIC/EPOXY
encapsulated code	TBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE
Parallel/Serial	PARALLEL
Programming voltage	3 V
Certification status	Not Qualified
Maximum seat height	1.2 mm
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
type	NOR TYPE
width	10 mm
Base Number Matches	1

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3 Volt Advanced+ Boot Block Flash

Memory

28F800C3, 28F160C3, 28F320C3, 28F640C3 (x16)

Preliminary Datasheet

Product Features

Flexible SmartVoltage Technology

— 2.7 V–3.6 V Read/Program/Erase

— 12 V for Fast Production Programming

High Performance

— 2.7 V–3.6 V: 70 ns Max Access Time

Optimized Architecture for Code Plus Data

Storage

— Eight 4-Kword Blocks, Top or Bottom

Locations

— Up to One Hundred-Twenty-Seven 32-

Kword Blocks

— Fast Program Suspend Capability

— Fast Erase Suspend Capability

Flexible Block Locking

— Lock/Unlock Any Block

— Full Protection on Power-Up

— WP# Pin for Hardware Block Protection

— V

= GND Option

— V

Lockout Voltage

Low Power Consumption

— 9 mA Typical Read Power

— 7 µA Typical Standby Power with

Automatic Power Savings Feature

12 V Fast Production Program

Extended Temperature Operation

— –40 °C to +85 °C

128-bit Protection Register

— 64-bit Unique Device Identifier

— 64-bit User Programmable OTP Cells

Extended Cycling Capability

— Minimum 100,000 Block Erase Cycles

Supports Intel

Flash Data Integrator

Software

— Flash Memory Manager

— System Interrupt Manager

— Supports Parameter Storage, Streaming

Data (e.g., voice)

Automated Word/Byte Program and Block

Erase

— Command User Interface

— Status Registers

Cross-Compatible Command Support

— Intel Basic Command Set

— Common Flash Interface

Standard Surface Mount Packaging

— 48-Ball CSP Packages

— 64-Ball Easy BGA Packages

— 48-Lead TSOP Package

ETOX™ VII (0.18

µ)

Flash Technology

— 28F160/320/640C3xC

— 8-, 16- and 32-Mbit also exist on

ETOX™ VI (0.25

µ)

Flash Technology

The 3 Volt Advanced+ Boot Block Flash memory, manufactured on Intel’s latest 0.18 µ

technology, represents a feature-rich solution for low power applications. 3 Volt Advanced+

Boot Block Flash memory devices incorporate low voltage capability (2.7 V read, program and

erase) with high-speed, low-power operation. Flexible block locking allows any block to be

independently locked or unlocked. Add to this the Intel

Flash Data Integrator (IFDI) software

and you have a cost-effective, flexible, monolithic code plus data storage solution. Intel

3 Volt

Advanced+ Boot Block products will be available in 48-lead TSOP, 48-ball CSP, and 64-ball

Easy BGA packages. Additional information on this product family can be obtained by

accessing the Intel

Flash website: http://www.intel.com/design/flash.

Notice:

This document contains preliminary information on new products in production. The

specifications are subject to change without notice. Verify with your local Intel sales office that

you have the latest datasheet before finalizing a design.

Order Number: 290645-010

October 2000

28F800C3, 28F160C3, 28F320C3, 28F640C3

Contents

1.0

2.0

Introduction

.................................................................................................................. 1

1.1

2.1

2.2

Product Overview .................................................................................................. 2

Package Pinouts ................................................................................................... 3

Block Organization ................................................................................................ 7

2.2.1 Parameter Blocks ..................................................................................... 7

2.2.2 Main Blocks .............................................................................................. 7

Bus Operation ....................................................................................................... 7

3.1.1 Read......................................................................................................... 7

3.1.2 Output Disable.......................................................................................... 8

3.1.3 Standby .................................................................................................... 8

3.1.4 Reset ........................................................................................................8

3.1.5 Write ......................................................................................................... 9

Modes of Operation............................................................................................... 9

3.2.1 Read Array ............................................................................................... 9

3.2.2 Read Configuration ................................................................................10

3.2.3 Read Status Register .............................................................................10

3.2.4 Read Query ............................................................................................11

3.2.5 Program Mode........................................................................................11

3.2.6 Erase Mode ............................................................................................12

Flexible Block Locking.........................................................................................15

3.3.1 Locking Operation ..................................................................................16

3.3.2 Unlocked State .......................................................................................16

3.3.3 Lock-Down State ....................................................................................16

3.3.4 Reading a Block’s Lock Status ...............................................................17

3.3.5 Locking Operations during Erase Suspend............................................17

3.3.6 Status Register Error Checking..............................................................17

128-Bit Protection Register .................................................................................18

3.4.1 Reading the Protection Register ............................................................18

3.4.2 Programming the Protection Register ....................................................19

3.4.3 Locking the Protection Register .............................................................19

Program and Erase Voltages .......................................................................19

3.5.1 Improved 12 Volt Production Programming ...........................................19

3.5.2 VPP £ VPPLK for Complete Protection..................................................20

Power Consumption ............................................................................................20

3.6.1 Active Power (Program/Erase/Read) .....................................................20

3.6.2 Automatic Power Savings (APS)............................................................21

3.6.3 Standby Power .......................................................................................21

3.6.4 Deep Power-Down Mode .......................................................................21

Power-Up/Down Operation .................................................................................21

3.7.1 RP# Connected to System Reset...........................................................21

3.7.2 VCC, VPP and RP# Transitions .............................................................22

Power Supply Decoupling ...................................................................................22

Product Description

.................................................................................................. 3

3.0

Principles of Operation

............................................................................................ 7

3.1

3.2

3.3

3.4

3.5

3.6

3.7

3.8

3UHOLPLQDU\

iii

28F800C3, 28F160C3, 28F320C3, 28F640C3

4.0

Electrical Specifications

........................................................................................ 23

4.1

4.2

4.3

4.4

4.5

4.6

4.7

4.8

Absolute Maximum Ratings ................................................................................ 23

Operating Conditions .......................................................................................... 24

Capacitance ........................................................................................................ 24

DC Characteristics .............................................................................................. 25

DC Characteristics, Continued............................................................................ 26

AC Characteristics—Read Operations................................................................ 28

AC Characteristics—Write Operations................................................................ 33

Erase and Program Timings ............................................................................... 37

Reset Operations ................................................................................................ 39

5.0

6.0

Ordering Information

.............................................................................................. 40

Additional Information

........................................................................................... 41

WSM Current/Next States

................................................................................ 42

Program/Erase Flowcharts

............................................................................. 44

Common Flash Interface Query Structure

............................................... 50

Architecture Block Diagram

........................................................................... 57

Word-Wide Memory Map Diagrams

............................................................. 58

Device ID Table

.................................................................................................... 62

Protection Register Addressing

................................................................... 63

Appendix A

Appendix B

Appendix C

Appendix D

Appendix E

Appendix F

Appendix G

3UHOLPLQDU\

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