3DSR32M32VB2410IBH-10 datasheet, PDF

3DSR32M32VB2410IBH-10: DescriptionStandard SRAM, 1MX32, CMOS, PBGA90, 0.80 MM PITCH, BGA-90; Categorystorage storage; File Size79KB，2 Pages; Manufacturer3D PLUS

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3DSR32M32VB2410IBH-10 Overview

Standard SRAM, 1MX32, CMOS, PBGA90, 0.80 MM PITCH, BGA-90

Parameter Name	Attribute value
Objectid	1829380164
package instruction	FBGA,
Reach Compliance Code	unknown
ECCN code	3A991.B.2.A
JESD-30 code	R-PBGA-B90
length	13.7 mm
memory density	33554432 bit
Memory IC Type	STANDARD SRAM
memory width	32
Number of functions	1
Number of terminals	90
word count	1048576 words
character code	1000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	1MX32
Package body material	PLASTIC/EPOXY
encapsulated code	FBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, FINE PITCH
Parallel/Serial	PARALLEL
Maximum seat height	3.45 mm
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.4 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
width	8.7 mm

Shortcut: E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF EG EH EI EJ EK EL EM EN EO EP EQ ER ES ET EU EV EW EX EY EZ F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF FG FH FI FJ FK FL FM FN FO FP FQ FR FS FT FU FV FW FX FY FZ G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 GA GB GC GD GE GF GG GH GI GJ GK GL GM GN GO GP GQ GR GS GT GU GV GW GX GZ H0 H1 H2 H3 H4 H5 H6 H7 H8 HA HB HC HD HE HF HG HH HI HJ HK HL HM HN HO HP HQ HR HS HT HU HV HW HX HY HZ I1 I2 I3 I4 I5 I6 I7 IA IB IC ID IE IF IG IH II IK IL IM IN IO IP IQ IR IS IT IU IV IW IX J0 J1 J2 J6 J7 JA JB JC JD JE JF JG JH JJ JK JL JM JN JP JQ JR JS JT JV JW JX JZ K0 K1 K2 K3 K4 K5 K6 K7 K8 K9 KA KB KC KD KE KF KG KH KI KJ KK KL KM KN KO KP KQ KR KS KT KU KV KW KX KY KZ

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