3DSR32M32VB2410MSP-10 datasheet, PDF

3DSR32M32VB2410MSP-10: DescriptionStandard SRAM, 1MX32, CMOS, PBGA90, 0.80 MM PITCH, BGA-90; Categorystorage storage; File Size79KB，2 Pages; Manufacturer3D PLUS

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3DSR32M32VB2410MSP-10 Overview

Standard SRAM, 1MX32, CMOS, PBGA90, 0.80 MM PITCH, BGA-90

Parameter Name	Attribute value
Objectid	1829380136
package instruction	FBGA,
Reach Compliance Code	unknown
ECCN code	3A001.A.2.C
JESD-30 code	R-PBGA-B90
length	13.7 mm
memory density	33554432 bit
Memory IC Type	STANDARD SRAM
memory width	32
Number of functions	1
Number of terminals	90
word count	1048576 words
character code	1000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	1MX32
Package body material	PLASTIC/EPOXY
encapsulated code	FBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, FINE PITCH
Parallel/Serial	PARALLEL
Maximum seat height	3.45 mm
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.4 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
width	8.7 mm

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