0.5mm Pitch Connectors with Ground Plate for 2mm to 3mm Board-to-Board Connections
FX11 Series
Stacking height : 2mm
Stacking height : 2.5mm, 3mm
sFeatures
1. Low Profile Design
The board to board mating height of 2mm, 2.5mm and 3mm suits
smaller, thinner case designs.
10 Signal: 1 Ground Arrangement
2. Improved Transmission Efficiency Between Boards
Transmission characteristics have been improved through
a design that fixes ground plates to both sides of the
header and receptacle.
Ground Plate
Signal contact
mm
.75
0
m
m
5m
0.7
Housing
3. 10 Signal:1 Ground Arrangement
Signal and ground are arranged in a ratio of 10:1 with the
ground plate SMT connected to the board. The ground
stability achieved serves to reduce noise.
Metal fitting
m
0.5
4. Metal Fittings for Added Solder Weld Strength
Metal fittings provide greater adhesion to the board,
protecting against peeling.The unique connector design
provides a connection between the fitting and the ground
plate for a stronger ground.
Ground plate and metal fitting make contact
Stacking height variation
5. Suited to High-Density Applications
The signal contact pitch of 0.5mm produces a smaller
connector utilizing less board area for mounting.
2mm
2. 5 , 3
mm
6. Structure Prevents Solder Wicking
A solder gap has been designed into the contact SMT
portion to prevent solder wicking.
Note: 2.0mm type and 2.5mm, 3mm type are not mated with each other.
Structure Prevent solder vicking
7. High contact reliability
Effective mating length is 0.55mm (2mm height),
1mm(2.5mm, 3mm height) for signal contacts.
Solder gap portion
Contact
surface
Board mounting portion
Land
8. Optional Ground Plate
An alternate style without the ground plate is available.The
space provided by the ground plate removal has been filled
with additional signal contacts.
sApplications
Notebook computers, PDA, and other miniature electronic equipment.
2013.1
1
FX11 Seriesq0.5mm Pitch Connectors with Ground Plate for 2mm to 3mm Board-to-Board Connections
B
Stacking height variation
q
With ground plate
Receptacle
Header
FX11L#-πP / π-SV
2mm
FX11#-πP / π-SV
2.5mm
FX11#-πP / π-SV0.5
3mm
FX11L#-πS / π-SV
Header
Receptacle
FX11#-πS / π-SV
q
Without ground plate
Receptacle
Header
FX11L#-πP-SV
2mm
FX11L#-πS-SV
Header
Receptacle
FX11#-πP-SV
2.5mm
FX11#-πP-SV0.5
3mm
FX11#-πS-SV
Note 1: The thickness of the solder paste is not included in the stacking height.
Note 2: 2mm type and 2.5mm, 3mm type, with ground plate type and without ground type are not mated with each other.
B
Cross section of mating
q
Stacking height : 2mm
0.55 (Effective mating length)
Signal portion
0.55 (Effective mating length)
Ground portion
Header
Receptacle
q
Stacking height : 2.5mm, 3mm
1 (Effective mating length)
Signal portion
0.9 (Effective mating length)
Ground portion
Header
Receptacle
(Shown for stacking height 2.5mm type.)
2
FX11 Seriesq0.5mm Pitch Connectors with Ground Plate for 2mm to 3mm Board-to-Board Connections
s
Signal integrity
qPin
assignment
To match 100 ohm differential impedance and to reduce crosstalk, a staggered GSSG pin assignment is
recommended.(G=ground and S=signal)
GSSG
Signal
Ground
Diff pair
qImpedance
The differential impedance is 100 +/- 10 ohm for FX11 at 50 ps rise time(20% to 80%).
3mm(Without GND)
120
115
110
105
Z (Ohm)
100
95
90
85
FX11- 3mm DifferentialTDR
80
0.8
0.9
1
1.1
1.2
Time (ns )
1.3
1.4
1.5
qInsertion-loss-to-crosstalk
ratio (ICR)
The insertion-loss-to-crosstalk ratio (ICR) with five differential FEXT aggressors meets the extrapolated
IEEE802.3ap specification to 10
+
Gbps.
3mm(Without GND)
60
50
40
ICR (dB)
30
20
10
ICR
IEEEspec
1
2
3
4
5
6
Frequency (GHz)
7
8
9
10
0
0
3
FX11 Seriesq0.5mm Pitch Connectors with Ground Plate for 2mm to 3mm Board-to-Board Connections
Stacking height : 2mm
sProduct
Specifications
Rated current 0.3 A (Note 1) Operating temperature range -55 to 85ç
Rating Rated voltage 50 V AC
Operating humidity range
(No condensation)
Item
1. Insulation resistance
2. Voltage proof
3. Contact resistance
4. Vibration
5. Shock
6. Damp heat
(Steady state)
7. Temperature cycle
8. Durability
9. Resistance to
soldering heat
100 Mø or greater
No flashover or breakdown
60 mø or less
No electrical discontinuity for 1µs or greater
No damage, cracks, or parts looseness
No electrical discontinuity for 1µs or longer
No damage, cracks, or parts looseness
Contact resistance of 70 mø or less, insulation resistance of
100 Mø or greater, no damage, cracks, or parts looseness
Contact resistance of 70 mø or less, insulation resistance of
100 Mø or greater, no damage, cracks, or parts looseness
Contact resistance of 70 mø or less
No damage, cracks, or parts looseness
No melting of resin portion which affects performance
Storage temperature range -10 to +60ç (Note 2)
-40
to
-70%
(Note 2)
Relative humidity 95% or less Storage humidity range
Requirements
Measured at 100 V DC
Conditions
150 V AC applied for one minute
Measured at 100 mA
Frequency: 10 to 55 Hz, amplitude of 0.75 mm in 3 directions,
10 cycles each
Acceleration of 490 m/s
2
, 11ms duration, sine half-wave
waveform,for 3 cycles in the both directions of each of the 3 axes
Temperature of 40ç, humidity of 90 to 95%, duration 96 h
Temperature: -55ç
¡
15 to 35ç
¡
85ç
¡
15 to 35ç
Time: 30 min.
¡
2 to 3 min.
¡
30 min.
¡
2 to 3 min. for 5 cycles
50 times
Reflow: At the recommended temperature profile
Soldering iron temperature: 360ç for 5 seconds
Note 1: The term storage refers to an unused products prior to board mounting (including packing materials) that is being kept for a long period.
The operating temperature and humidity range are applied to the non-conducting condition following board assembly.
: Information contained in this catalog represents general requirements for this Series. Contact us for the drawings and specifications for
Note 2
a specific part number shown.
sMaterials
Part
Insulator
Contacts
Ground plate
Metal fitting
Metal plate
LCP
Copper alloy
Phosphor bronze
Phosphor bronze
Phosphor bronze
Material
Beige
Header
Receptacle
Tin plating
Tin plating
Engagement Area: Gold plating of 0.1µm
Termination Area: Flash plating
Finish
Remarks
UL94V-0
----------
----------
----------
----------
sOrdering
information
Type With Ground Plate
FX11L
#
-
π
P - /
π
- SV (
½ ½
)
1
2
4
3
5
6
Type Without Ground Plate
1
2
3
FX11L
#
-
π
P - SV (
½ ½
)
1
2
3
4
4
5
P : Header
S : Receptacle
5
6
Contact form
SV : Straight SMT
Blank, (71): Tray packaging (Without pick-and-place tape)
(21),(91): Embossed tape packaging (Without pick-and-place tape)
(22),(92): Embossed tape packaging (With pick-and-place tape)
6
Connector type
Series name : FX11L
Form Symbol
A : With guide post
B : Without guide post
Number of contacts
Type with ground plate
Signal/Ground:60/6, 80/8,
100/10, 120/12
Type without ground
Signal: 68, 92, 116, 140
4
FX11 Seriesq0.5mm Pitch Connectors with Ground Plate for 2mm to 3mm Board-to-Board Connections
sHeader
with ground Plate
q
2mm stacking height
5.25±0.3
5.05±0.2
1.2±0.2
(0.5)
A±0.2
0.2±0.05
(0.75)
(0.75)
(6)
B±0.2
1.9±0.3
C±0.3
(0.6)
2-(Ø0.8)
D±0.1
Guidepost
Unit : mm
Part Number
FX11LA-060P/06-SV(71)
FX11LA-080P/08-SV(71)
FX11LA-100P/10-SV(71)
FX11LA-120P/12-SV(71)
FX11LB-060P/06-SV(71)
FX11LB-080P/08-SV(71)
FX11LB-100P/10-SV(71)
FX11LB-120P/12-SV(71)
CL No.
573-0002-7-71
573-0003-0-71
573-0004-2-71
573-0005-5-71
573-0012-0-71
573-0013-3-71
573-0014-6-71
573-0015-9-71
Number of contacts
Signal
Ground
A
B
C
D
E
F
Remarks
RoHS
60
80
100
120
60
80
100
120
6
8
10
12
6
8
10
12
17.5
23.5
29.5
35.5
17.5
23.5
29.5
35.5
12
18
24
30
12
18
24
30
22.6
28.6
34.6
40.6
22.6
28.6
34.6
40.6
18
24
30
36
-----
-----
-----
-----
-----
-----
-----
-----
19.4
25.4
31.4
37.4
19.4
25.4
31.4
37.4
25.5
31.5
37.5
43.5
25.5
31.5
37.5
43.5
Without guideposts
With guideposts
YES
[Specifications number] – **, (**)
(71): Tray packaging
(91) : Embossed tape packaging (Without pick-and-place tape)
(92) : Embossed tape packaging (With pick-and-place tape)
Note 1: There is no polarity in terms of board mounting for this product.
Note 2: The coplanarity of this product's SMT leads is 0.1 mm or less.
Note 3: Please order embossed tape packaged items by the reel. (One reel holds 1,000 pieces.)
B
Recommended Land Pattern Dimensions (Metal Mask Dimensions)
4
F min
0.1
C
+0
Recommended metal mask thickness: 0.15 mm
E
--0
0.1
2.25
--0
2
0.1
D±0.05
A±0.05
0.5±0.03
0.75±0.03
0.75±0.03
2.95
--0
0.1
3.85
--0
0.1
0.1
5.65
+0
0.1
1.8
+0
3
Ø0.9±0.05
Ø1±0.05
1
6±0.05 0.7±0.03(Land)
3
0.25±0.05
3±0.05
0.6±0.03(Metal mask)
B±0.05
0.3±0.03(Land)
0.25±0.03(Metal Mask)
Note 1 Cross-hatched portions, totaling n places, indicate the ground circuits.
2 The cross-hatched area
inside the SMT land may come into contact with the connector contacts
and thus care should be taken that the pattern does not extend beyond the SMT land width.
3 Not required in products without guideposts.
4 Do not mount a part other than this product in the area of
. Doing so will prevent the engagement
of this and the mating connector.
4
6.7min
5
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Microcontroller MCU
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