FT61256-25DMBLF datasheet, PDF

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FT61256-25DMBLF: DescriptionStandard SRAM, 32KX8, 25ns, CMOS, CDIP28, 0.300 INCH, ROHS COMPLIANT, CERAMIC, DIP-28; Categorystorage storage; File Size1MB，16 Pages; ManufacturerForce Technologies Ltd.; Environmental Compliance

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FT61256-25DMBLF Overview

Standard SRAM, 32KX8, 25ns, CMOS, CDIP28, 0.300 INCH, ROHS COMPLIANT, CERAMIC, DIP-28

FT61256-25DMBLF Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Force Technologies Ltd.
Parts packaging code	DIP
package instruction	DIP,
Contacts	28
Reach Compliance Code	unknown
ECCN code	3A001.A.2.C
Maximum access time	25 ns
JESD-30 code	R-CDIP-T28
memory density	262144 bit
Memory IC Type	STANDARD SRAM
memory width	8
Number of functions	1
Number of terminals	28
word count	32768 words
character code	32000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	32KX8
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Filter level	MIL-STD-883
Maximum seat height	5.715 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7.62 mm
Base Number Matches	1

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High Speed 32Kx8 Static CMOS Ram

FEATURES

High Speed (Equal Access and Cycle Times)

– 12/15/20/25/35 ns (Commercial)

– 15/20/25/35/45 ns (Industrial)

– 20/25/35/45/55/70 ns (Military)

Low Power

Single 5V±10% Power Supply

Easy Memory Expansion Using

and

Inputs

Common Data I/O

Three-State Outputs

Fully TTL Compatible Inputs and Outputs

Advanced CMOS Technology

Fast t

Automatic Power Down

Packages

– 28-Pin 300 mil DIP, SOJ, TSOP

– 28-Pin 300 mil Ceramic DIP

– 28-Pin 600 mil Plastic and Ceramic DIP

– 28-Pin CERPACK

– 28-Pin Solder Seal Flat Pack

– 28-Pin SOP

– 28-Pin LCC (350 mil x 550 mil)

– 32-Pin LCC (450 mil x 550 mil)

FT61256

DESCRIPTION

FT6

OE)

FT6

FUNCTIONAL BLOCK DIAGRAM

PIN CONFIGURATIONS

DIP (P5, P6, C5, C5-1, D5-1, D5-2), SOJ (J5), SOP (S11-1, S11-3)

CERPACK (F4, FS-5) SIMILAR

2010

1/16

Rev 1.8

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