ACT SERIES, 8-BIT TRANSCEIVER, TRUE OUTPUT, CDIP24, 0.300 INCH, CERAMIC, DIP-24
| Parameter Name | Attribute value |
| package instruction | DIP, |
| Reach Compliance Code | unknown |
| Other features | WITH DIRECTION CONTROL |
| series | ACT |
| JESD-30 code | R-CDIP-T24 |
| Logic integrated circuit type | BUS TRANSCEIVER |
| Number of digits | 8 |
| Number of functions | 1 |
| Number of ports | 2 |
| Number of terminals | 24 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Output characteristics | 3-STATE |
| Output polarity | TRUE |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | DIP |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| propagation delay (tpd) | 9 ns |
| Certification status | Not Qualified |
| Maximum seat height | 5.715 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| width | 7.62 mm |
| Base Number Matches | 1 |
| 54ACTQ657SDM | 54ACTQ657LM | 54ACTQ657FM | |
|---|---|---|---|
| Description | ACT SERIES, 8-BIT TRANSCEIVER, TRUE OUTPUT, CDIP24, 0.300 INCH, CERAMIC, DIP-24 | ACT SERIES, 8-BIT TRANSCEIVER, TRUE OUTPUT, CQCC28, CERAMIC, LCC-28 | ACT SERIES, 8-BIT TRANSCEIVER, TRUE OUTPUT, CDFP24, CERAMIC, DFP-24 |
| package instruction | DIP, | QCCN, | DFP, |
| Reach Compliance Code | unknown | unknown | unknown |
| Other features | WITH DIRECTION CONTROL | WITH DIRECTION CONTROL | WITH DIRECTION CONTROL |
| series | ACT | ACT | ACT |
| JESD-30 code | R-CDIP-T24 | S-CQCC-N28 | R-CDFP-F24 |
| Logic integrated circuit type | BUS TRANSCEIVER | BUS TRANSCEIVER | BUS TRANSCEIVER |
| Number of digits | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 |
| Number of ports | 2 | 2 | 2 |
| Number of terminals | 24 | 28 | 24 |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE |
| Output polarity | TRUE | TRUE | TRUE |
| Package body material | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | DIP | QCCN | DFP |
| Package shape | RECTANGULAR | SQUARE | RECTANGULAR |
| Package form | IN-LINE | CHIP CARRIER | FLATPACK |
| propagation delay (tpd) | 9 ns | 9 ns | 9 ns |
| Certification status | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 5.715 mm | 1.905 mm | 2.286 mm |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V |
| surface mount | NO | YES | YES |
| technology | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | MILITARY |
| Terminal form | THROUGH-HOLE | NO LEAD | FLAT |
| Terminal pitch | 2.54 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | QUAD | DUAL |
| Base Number Matches | 1 | 1 | 1 |
| width | 7.62 mm | 11.43 mm | - |
| length | - | 11.43 mm | 15.4305 mm |
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