|
7006S45L68 |
7006L45L68 |
| Description |
Multi-Port SRAM, 16KX8, 45ns, CMOS, CQCC68 |
Multi-Port SRAM, 16KX8, 45ns, CMOS, CQCC68 |
| Is it lead-free? |
Contains lead |
Contains lead |
| Is it Rohs certified? |
incompatible |
incompatible |
| Maker |
IDT (Integrated Device Technology) |
IDT (Integrated Device Technology) |
| package instruction |
QCCN, LCC68,.95SQ |
QCCN, LCC68,.95SQ |
| Reach Compliance Code |
not_compliant |
not_compliant |
| Maximum access time |
45 ns |
45 ns |
| I/O type |
COMMON |
COMMON |
| JESD-30 code |
S-XQCC-N68 |
S-XQCC-N68 |
| JESD-609 code |
e0 |
e0 |
| memory density |
131072 bit |
131072 bit |
| Memory IC Type |
MULTI-PORT SRAM |
MULTI-PORT SRAM |
| memory width |
8 |
8 |
| Number of ports |
2 |
2 |
| Number of terminals |
68 |
68 |
| word count |
16384 words |
16384 words |
| character code |
16000 |
16000 |
| Operating mode |
ASYNCHRONOUS |
ASYNCHRONOUS |
| Maximum operating temperature |
70 °C |
70 °C |
| organize |
16KX8 |
16KX8 |
| Output characteristics |
3-STATE |
3-STATE |
| Package body material |
CERAMIC |
CERAMIC |
| encapsulated code |
QCCN |
QCCN |
| Encapsulate equivalent code |
LCC68,.95SQ |
LCC68,.95SQ |
| Package shape |
SQUARE |
SQUARE |
| Package form |
CHIP CARRIER |
CHIP CARRIER |
| Parallel/Serial |
PARALLEL |
PARALLEL |
| Peak Reflow Temperature (Celsius) |
225 |
225 |
| power supply |
5 V |
5 V |
| Certification status |
Not Qualified |
Not Qualified |
| Maximum standby current |
0.015 A |
0.0015 A |
| Minimum standby current |
4.5 V |
2 V |
| Maximum slew rate |
0.34 mA |
0.29 mA |
| Nominal supply voltage (Vsup) |
5 V |
5 V |
| surface mount |
YES |
YES |
| technology |
CMOS |
CMOS |
| Temperature level |
COMMERCIAL |
COMMERCIAL |
| Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
| Terminal form |
NO LEAD |
NO LEAD |
| Terminal pitch |
1.27 mm |
1.27 mm |
| Terminal location |
QUAD |
QUAD |
| Maximum time at peak reflow temperature |
30 |
30 |
| Base Number Matches |
1 |
1 |