EEWORLDEEWORLDEEWORLD

Part Number

Search

D55342H07B1B26M-TR

Description
Fixed Resistor, Thin Film, 0.25W, 1260ohm, 100V, 0.1% +/-Tol, 50ppm/Cel, Surface Mount, 1206, CHIP
CategoryPassive components    The resistor   
File Size1MB,1 Pages
ManufacturerState of the Art Inc.
Download Datasheet Parametric View All

D55342H07B1B26M-TR Overview

Fixed Resistor, Thin Film, 0.25W, 1260ohm, 100V, 0.1% +/-Tol, 50ppm/Cel, Surface Mount, 1206, CHIP

D55342H07B1B26M-TR Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
Objectid1613337673
package instructionCHIP
Reach Compliance Codenot_compliant
Country Of OriginUSA
ECCN codeEAR99
YTEOL6.15
Other featuresPRECISION
structureRectangular
JESD-609 codee0
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-65 °C
Package height0.46 mm
Package length3.2 mm
Package shapeRECTANGULAR PACKAGE
Package formSMT
Package width1.55 mm
method of packingTR
Rated power dissipation(P)0.25 W
Rated temperature70 °C
GuidelineMIL-PRF-55342/07
resistance1260 Ω
Resistor typeFIXED RESISTOR
size code1206
surface mountYES
technologyTHIN FILM
Temperature Coefficient50 ppm/°C
Terminal surfaceTin/Lead (Sn60Pb40) - with Nickel (Ni) barrier
Terminal shapeWRAPAROUND
Tolerance0.1%
Operating Voltage100 V
State of the Art, Inc.
Precision Thin Film Chip Resistor
MIL-PRF-55342/07 Solderable RM1206
5.6Ω to 1.5 MΩ
0.1, 0.25, 0.5, 1, 2, 5, 10
25, 50, 100
250 mW
100 V
-65 to 150°C
M, P, R, S, U, V, T
Noise
c
d
a
b
e
Performance
Resistance Range*
Tolerances (± %)*
TCR (± ppm/°C)*
Power Rating
Voltage Rating
Operating Range
Product Levels
0
Noise (dB)
-10
-20
-30
-40
125
100
75
50
25
0
0
0.5
ceramic board
1.0 1.5 2.0
Power (W)
2.5
Power Dissipation
fiber epoxy board
*see QPL55342 for part number availability
1
1k
1M
Resistance Value (Ω)
Maximum Allowable Drift
Temperature Characteristic
TCR (ppm/°C)
Thermal Shock
Power Conditioning
Low Temperature Operation
Short Time Overload
High Temperature Exposure
Moisture Resistance
Life (Qualification)
Life (FR Level)
Resistance to Soldering Heat
Resistance to Bonding Exposure
E
±25
±0.1%
±0.2%
±0.1%
±0.1%
±0.1%
±0.2%
±0.5%
±2.0%
±0.2%
±0.2%
H
±50
±0.25%
±0.25%
±0.25%
±0.1%
±0.2%
±0.4%
±0.5%
±2.0%
±0.25%
±0.25%
K
±100
±0.5%
±0.5%
±0.25%
±0.25%
±0.5%
±0.5%
±0.5%
±2.0%
±0.25%
±0.25%
0.5
Drift (|%∆R|)
0.4
0.3
0.2
0.1
0
0
2k
Life Test
Percent Power
100
75
50
25
0
Temperature Rise (°C)
Power Derating
4k 6k
Hours
8k
10k
-10
70
150
Ambient Temperature (°C)
Part Number
D55342E07B100AS -TR
Packaging: -TR: Tape & Reel
Product Level (/1000 hrs.): M: 1%
Resistance Value and Tolerance:
Three numerals and a letter indicating
decimal, value range, and tolerance
-W: Waffle Tray
P: 0.1%
R & U: 0.01%
S & V: 0.001%
T: Space 0.001%
Ω: A: 0.1% R: 0.25% W: 0.5% D: 1% G: 2% J: 5% M: 10%
kΩ: B: 0.1% U: 0.25% Y: 0.5% E: 1% H: 2% K: 5% N: 10%
MΩ: C: 0.1% V: 0.25% Z: 0.5% F: 1% T: 2% L: 5% P: 10%
Termination Material: B: Solderable (SnPb solder over nickel)
Size: 07: RM1206
Temperature Characteristic (ppm/°C): E: ±25
Performance Specification MIL-PRF-55342
H: ±50
K: ±100
Mechanical
Length (a)
Width (b)
Thickness (c)
Top Termination (d)
Bottom Termination (e)
Approximate Weight
Inches
.126(.118 - .134)
.061(.058 - .068)
.018(.015 - .033)
.015(.010 - .025)
.021(.015 - .025)
0.00840 g
Millimeters
3.20(3.00 - 3.40)
1.55(1.47 - 1.73)
0.46(0.38 - 0.84)
0.38(0.25 - 0.64)
0.53(0.25 - 0.64)
.156
Recommended
Minimum
Bond Pads
(inches)
.039
.079
.067
State of the Art, Inc.
www.resistor.com
Specifications Subject to Change Without Notice
2470 Fox Hill Road, State College, PA, USA 16803-1797
Telephone: 814-355-8004 Toll Free: 800-458-3401 Fax: 814-355-2714
All Products Made in the USA
Copyright 2016 by State of the Art, Inc.
EEWORLD University ---- FPGA Course Basics (Intel Official FPGA Tutorial Series)
FPGA Course Basics (Intel Official FPGA Tutorial Series) : https://training.eeworld.com.cn/course/5558This series of courses is derived from Intel FPGA online training courses, which mainly introduces...
Lemontree FPGA/CPLD
Plasma Etching
[table=90%][tr][td]Plasma etching (also known as dry etching) is one of the key processes in integrated circuit manufacturing. Its purpose is to completely copy the mask pattern to the surface of the ...
dongfangguo PCB Design
LED drive circuit
Generally, constant current drive circuit is better for LED. Now I want to use voltage to control the current through LED and thus control the luminous intensity of LED. I am looking for a suitable ci...
井子92 LED Zone
Asking Xiangshui City, can the I2C of STM32 be directly connected to 5V devices?
Xiangshui City, recently an instrument case selected the STM32F101VBT6 chip, and encountered some problems. 1. Can the I2C of STM32 directly connect to 5V devices, and require working at 400K? 2. Can ...
lordor stm32/stm8
Filtering
How to better filter out glitches in voltage signals? Is there any other method besides RC first-order filtering?...
yjy1996 Analog electronics
Ask a question about compilation. How to compile a MAP file under VxWorks?
In PSOS, after compilation, a MAP file will be generated as a memory mapping table, through which the value of a variable in the running program can be viewed. Can such a file be compiled in VxWorks? ...
ocon Real-time operating system RTOS

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2319  2391  1812  1500  663  47  49  37  31  14 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号