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DP5Z2MW16PA3-20M

Description
Flash Module, 2MX16, 150ns, HERMETIC SEALED, CERAMIC, MODULE, SLCC, PGA-50
Categorystorage    storage   
File Size4MB,21 Pages
ManufacturerTwilight Technology Inc.
Download Datasheet Parametric View All

DP5Z2MW16PA3-20M Overview

Flash Module, 2MX16, 150ns, HERMETIC SEALED, CERAMIC, MODULE, SLCC, PGA-50

DP5Z2MW16PA3-20M Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerTwilight Technology Inc.
Parts packaging codePGA
package instructionAPGA, PGA50,5X10
Contacts50
Reach Compliance Codeunknown
ECCN code3A001.A.2.C
Maximum access time150 ns
Other featuresHARDWARE DATA PROTECTION
Data pollingNO
JESD-30 codeR-XPGA-P50
length25.146 mm
memory density33554432 bit
Memory IC TypeFLASH MODULE
memory width16
Number of functions1
Number of departments/size32
Number of terminals50
word count2097152 words
character code2000000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize2MX16
Package body materialUNSPECIFIED
encapsulated codeAPGA
Encapsulate equivalent codePGA50,5X10
Package shapeRECTANGULAR
Package formGRID ARRAY, PIGGYBACK
page size64 words
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Programming voltage5 V
Certification statusNot Qualified
Filter levelMIL-STD-883 Class B (Modified)
Maximum seat height7.4676 mm
Department size64K
Maximum standby current0.0004 A
Maximum slew rate0.1 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelMILITARY
Terminal formPIN/PEG
Terminal pitch2.54 mm
Terminal locationPERPENDICULAR
Maximum time at peak reflow temperatureNOT SPECIFIED
switch bitNO
typeNOR TYPE
width13.716 mm
Base Number Matches1
2Mx16, 120 - 200ns, STACK/PGA
30A161-22
A
32 Megabit FLASH EEPROM
DP5Z2MW16Pn3
PRELIMINARY
DESCRIPTION:
The DP5Z2MW16Pn3 ‘’SLCC’’ devices are a revolutionary new memory
subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip
Carriers (SLCC). Available unleaded, straight leaded, ‘’J’’ leaded, gullwing
leaded packages, or mounted on a 50-pin PGA co-fired ceramic substrate.
The Device packs 64-Megabits of FLASH EEPROM in an area as small as 0.463
in
2
, while maintaining a total height as low as 0.171 inches.
The DP5Z2MW16Pn3 contains two individual 1 Meg x 16 FLASH EEPROM
memory devices. Each SLCC is hermetically sealed making the module
suitable for commercial, industrial and military applications.
By using SLCCs, the ‘’Stack’’ family of modules offer a higher board density
of memory than available with conventional through-hole, surface mount or
hybrid techniques.
SLCC Stack
FEATURES:
Organization: 2Meg x 16
Fast Access Times: 120, 150, 200ns (max.)
Single 5.0 Volt
High-Density Symmetrically Blocked Architecture
- Sixteen 64 K Word Blocks Per Device
Extended Cycling Capability
- 100K Write/Erase Cycles
Automated Erase and Program Cycles
- Command User Interface
- Status Register
SRAM-Compatible Write Interface
Hardware Data Protection Feature
- Erase / Write Lockout during Power Transitions
Packages Available:
DP5Z2MW16PY3 48 - Pin SLCC
DP5Z2MW16PI3
48 - Pin Straight Leaded SLCC
DP5Z2MW16PH3 48 - Pin Gullwing Leaded SLCC
DP5Z2MW16PJ3
48 - Pin ‘’J’’ Leaded SLCC
DP5Z2MW16PA3 50 - Pin PGA Dense-SLCC
Straight Leaded
Stack
‘’J’’ Leaded
Stack
Dense-Stack
Gullwing
Leaded Stack
30A161-22
REV. B
This document contains information on a product presently under
development at Dense-Pac Microsystems, Inc. Dense-Pac reserves the
right to change products or specifications herein without prior notice.
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