LPC1110/11/12/13/14/15
32-bit ARM Cortex-M0 microcontroller; up to 64 kB flash and
8 kB SRAM
Rev. 9.2 — 26 March 2014
Product data sheet
1. General description
The LPC1110/11/12/13/14/15 are an ARM Cortex-M0 based, low-cost 32-bit MCU family,
designed for 8/16-bit microcontroller applications, offering performance, low power, simple
instruction set and memory addressing together with reduced code size compared to
existing 8/16-bit architectures.
The LPC1110/11/12/13/14/15 operate at CPU frequencies of up to 50 MHz.
The peripheral complement of the LPC1110/11/12/13/14/15 includes up to 64 kB of flash
memory, up to 8 kB of data memory, one Fast-mode Plus I
2
C-bus interface, one
RS-485/EIA-485 UART, up to two SPI interfaces with SSP features, four general purpose
counter/timers, a 10-bit ADC, and up to 42 general purpose I/O pins.
Remark:
The LPC111x series consists of the LPC1100 series (parts
LPC111x/101/201/301), LPC1100L series (parts LPC111x/002/102/202/302), and the
LPC1100XL series (parts LPC111x/103/203/303/323/333). The LPC1100L and
LPC1100XL series include the power profiles, a windowed watchdog timer, and a
configurable open-drain mode.
For related documentation, see
Section 16 “References”.
2. Features and benefits
System:
ARM Cortex-M0 processor, running at frequencies of up to 50 MHz.
ARM Cortex-M0 built-in Nested Vectored Interrupt Controller (NVIC).
Non-Maskable Interrupt (NMI) input selectable from several input sources
(LPC1100XL series only).
Serial Wire Debug.
System tick timer.
Memory:
64 kB (LPC1115), 56 kB (LPC1114/333), 48 kB (LPC1114/323), 32 kB
(LPC1114/102/201/202/203/301/302/303), 24 kB (LPC1113), 16 kB (LPC1112),
8 kB (LPC1111), or 4 kB (LPC1110) on-chip flash programming memory.
256 byte page erase function (LPC1100XL series only)
8 kB, 4 kB, 2 kB, or 1 kB SRAM.
In-System Programming (ISP) and In-Application Programming (IAP) via on-chip
bootloader software.
NXP Semiconductors
LPC1110/11/12/13/14/15
32-bit ARM Cortex-M0 microcontroller
Digital peripherals:
Up to 42 General Purpose I/O (GPIO) pins with configurable pull-up/pull-down
resistors. In addition, a configurable open-drain mode is supported on the
LPC1100L and LPC1100XL series.
GPIO pins can be used as edge and level sensitive interrupt sources.
High-current output driver (20 mA) on one pin.
High-current sink drivers (20 mA) on two I
2
C-bus pins in Fast-mode Plus (not on
LPC1112FDH20/102).
Four general purpose counter/timers with up to eight capture inputs and up to 13
match outputs.
Programmable WatchDog Timer (WDT) the LPC1100 series only.
Programmable windowed WDT on the LPC1100L and LPC1100XL series only.
Analog peripherals:
10-bit ADC with input multiplexing among 5, 6, or 8 pins depending on package
size.
Serial interfaces:
UART with fractional baud rate generation, internal FIFO, and RS-485 support.
Two SPI controllers with SSP features and with FIFO and multi-protocol
capabilities (second SPI on LPC1100 and LPC1100L series LQFP48 package
only).
I
2
C-bus interface supporting full I
2
C-bus specification and Fast-mode Plus with a
data rate of 1 Mbit/s with multiple address recognition and monitor mode (not on
LPC1112FDH20/102).
Clock generation:
12 MHz internal RC oscillator trimmed to 1 % accuracy that can optionally be used
as a system clock.
Crystal oscillator with an operating range of 1 MHz to 25 MHz.
Programmable watchdog oscillator with a frequency range of 9.4 kHz to 2.3 MHz.
PLL allows CPU operation up to the maximum CPU rate without the need for a
high-frequency crystal. May be run from the system oscillator or the internal RC
oscillator.
Clock output function with divider that can reflect the system oscillator clock, IRC
clock, CPU clock, and the Watchdog clock.
Power control:
Integrated PMU (Power Management Unit) to minimize power consumption during
Sleep, Deep-sleep, and Deep power-down modes.
Power profiles residing in boot ROM allowing to optimize performance and
minimize power consumption for any given application through one simple function
call. (LPC1100L and LPC1100XL series only.)
Three reduced power modes: Sleep, Deep-sleep, and Deep power-down.
Processor wake-up from Deep-sleep mode via a dedicated start logic using up to
13 of the functional pins.
Power-On Reset (POR).
Brownout detect with up to four separate thresholds for interrupt and forced reset.
Unique device serial number for identification.
Single power supply (1.8 V to 3.6 V).
Available as LQFP48 package, HVQFN33 package, and TFBGA48 package.
LPC111X
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet
Rev. 9.2 — 26 March 2014
2 of 127
NXP Semiconductors
LPC1110/11/12/13/14/15
32-bit ARM Cortex-M0 microcontroller
LPC1100L series available as TSSOP28 package, DIP28 package, TSSOP20
package, and SO20 package.
Extended temperature (40
C
to +105
C)
for selected parts (see
Table 2).
3. Applications
eMetering
Alarm systems
Lighting
White goods
4. Ordering information
Table 1.
Ordering information
Package
Name
LPC1110FD20
LPC1111FDH20/002
LPC1112FD20/102
LPC1112FDH20/102
LPC1112FDH28/102
LPC1114FDH28/102
LPC1114FN28/102
LPC1111FHN33/101
LPC1111FHN33/102
LPC1111FHN33/201
LPC1111FHN33/202
LPC1111FHN33/103
LPC1111JHN33/103
LPC1111FHN33/203
LPC1111JHN33/203
LPC1112FHN33/101
LPC1112FHN33/102
SO20
TSSOP20
SO20
TSSOP20
TSSOP28
TSSOP28
DIP28
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
Description
SO20: plastic small outline package; 20 leads; body width 7.5 mm
TSSOP20: plastic thin shrink small outline package; 20 leads; body
width 4.4 mm
SO20: plastic small outline package; 20 leads; body width 7.5 mm
TSSOP20: plastic thin shrink small outline package; 20 leads; body
width 4.4 mm
TSSOP28: plastic thin shrink small outline package; 28 leads; body
width 4.4 mm
TSSOP28: plastic thin shrink small outline package; 28 leads; body
width 4.4 mm
DIP28: plastic dual in-line package; 28 leads (600 mil)
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7
7
0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7
7
0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7
7
0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7
7
0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7
7
0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7
7
0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7
7
0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7
7
0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7
7
0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7
7
0.85 mm
All information provided in this document is subject to legal disclaimers.
Type number
Version
SOT163-1
SOT360-1
SOT163-1
SOT360-1
SOT361-1
SOT361-1
SOT117-1
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
SO20, TSSOP20, TSSOP28, and DIP28 packages
HVQFN24/33, LQFP48, and TFBGA48 packages
LPC111X
© NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet
Rev. 9.2 — 26 March 2014
3 of 127
NXP Semiconductors
LPC1110/11/12/13/14/15
32-bit ARM Cortex-M0 microcontroller
Table 1.
Ordering information
…continued
Package
Name
Description
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7
7
0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7
7
0.85 mm
Version
n/a
n/a
HVQFN33
HVQFN33
HVQFN24
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
Type number
LPC1112FHN33/201
LPC1112FHN33/202
LPC1112FHN24/202
LPC1112FHI33/102
LPC1112FHI33/202
LPC1112FHI33/203
LPC1112JHI33/203
LPC1112FHN33/103
LPC1112JHN33/103
LPC1112JHN33/203
LPC1112FHN33/203
LPC1113FHN33/201
LPC1113FHN33/202
LPC1113FHN33/203
LPC1113JHN33/203
LPC1113FHN33/301
LPC1113FHN33/302
LPC1113FHN33/303
LPC1113JHN33/303
LPC1114FHN33/201
LPC1114FHN33/202
LPC1114FHN33/301
LPC1114FHN33/302
HVQFN24: plastic thermal enhanced very thin quad flat package; no SOT616-3
leads; 24 terminals; body 4 x 4 x 0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 5
5
0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 5
5
0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 5
5
0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 5
5
0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7
7
0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7
7
0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7
7
0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7
7
0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7
7
0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7
7
0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7
7
0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7
7
0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7
7
0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7
7
0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7
7
0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7
7
0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7
7
0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7
7
0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7
7
0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7
7
0.85 mm
All information provided in this document is subject to legal disclaimers.
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
LPC111X
© NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet
Rev. 9.2 — 26 March 2014
4 of 127
NXP Semiconductors
LPC1110/11/12/13/14/15
32-bit ARM Cortex-M0 microcontroller
Table 1.
Ordering information
…continued
Package
Name
Description
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 5
5
0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 5
5
0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 5
5
0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7
7
0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7
7
0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7
7
0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7
7
0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7
7
0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7
7
0.85 mm
Version
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
LQFP48
LQFP48
LQFP48
LQFP48
LQFP48
LQFP48
LQFP48
LQFP48
LQFP48
LQFP48
LQFP48
LQFP48
LQFP48
Type number
LPC1114FHI33/302
LPC1114FHI33/303
LPC1114JHI33/303
LPC1114FHN33/203
LPC1114JHN33/203
LPC1114FHN33/303
LPC1114JHN33/303
LPC1114FHN33/333
LPC1114JHN33/333
LPC1113FBD48/301
LPC1113FBD48/302
LPC1113FBD48/303
LPC1113JBD48/303
LPC1114FBD48/301
LPC1114FBD48/302
LPC1114FBD48/303
LPC1114JBD48/303
LPC1114FBD48/323
LPC1114JBD48/323
LPC1114FBD48/333
LPC1114JBD48/333
LPC1115FBD48/303
LQFP48: plastic low profile quad flat package; 48 leads; body 7
7
SOT313-2
1.4 mm
LQFP48: plastic low profile quad flat package; 48 leads; body 7
7
SOT313-2
1.4 mm
LQFP48: plastic low profile quad flat package; 48 leads; body 7
7
SOT313-2
1.4 mm
LQFP48: plastic low profile quad flat package; 48 leads; body 7
7
SOT313-2
1.4 mm
LQFP48: plastic low profile quad flat package; 48 leads; body 7
7
SOT313-2
1.4 mm
LQFP48: plastic low profile quad flat package; 48 leads; body 7
7
SOT313-2
1.4 mm
LQFP48: plastic low profile quad flat package; 48 leads; body 7
7
SOT313-2
1.4 mm
LQFP48: plastic low profile quad flat package; 48 leads; body 7
7
SOT313-2
1.4 mm
LQFP48: plastic low profile quad flat package; 48 leads; body 7
7
SOT313-2
1.4 mm
LQFP48: plastic low profile quad flat package; 48 leads; body 7
7
SOT313-2
1.4 mm
LQFP48: plastic low profile quad flat package; 48 leads; body 7
7
SOT313-2
1.4 mm
LQFP48: plastic low profile quad flat package; 48 leads; body 7
7
SOT313-2
1.4 mm
LQFP48: plastic low profile quad flat package; 48 leads; body 7
7
SOT313-2
1.4 mm
LPC111X
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet
Rev. 9.2 — 26 March 2014
5 of 127
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