B015-0200-006-Z datasheet, PDF

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B015-0200-006-Z: DescriptionIC Socket, SIP2, 2 Contact(s), 2.54mm Term Pitch, Solder; CategoryThe connector socket; File Size249KB，1 Pages; ManufacturerSMP Technology Inc.

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B015-0200-006-Z Overview

IC Socket, SIP2, 2 Contact(s), 2.54mm Term Pitch, Solder

B015-0200-006-Z Parametric

Parameter Name	Attribute value
Objectid	304390552
Reach Compliance Code	unknown
ECCN code	EAR99
Other features	ROHS COMPLIANT
subject depth	0.167 inch
body length	0.2 inch
Contact to complete cooperation	AU ON NI
Contact completed and terminated	TIN
Contact material	BE-CU
Contact style	RND PIN-SKT
current rating	3 A
Device slot type	IC SOCKET
Type of equipment used	SIP2
Dielectric withstand voltage	1000VAC V
Shell material	GLASS FILLED POLYESTER
Insulation resistance	1000000000 Ω
Plug contact pitch	0.1 inch
Installation method	STRAIGHT
Number of contacts	2
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
PCB contact pattern	RECTANGULAR
Terminal pitch	2.54 mm
Termination type	SOLDER

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ELECTRICAL:

CURRENT: 3A

CONTACT RESISTANCE: < 4m

Ω

INSULATOR RESISTANCE: > 1000M

Ω

OPERATING VOLTAGE: 60V AC/DC

DIELECTRIC WITHSTANDING VOLTAGE: 1000VAC FOR 1 MIN.

HOW TO ORDER:

B

0

1

NUMBER OF CONTACTS:

01 thru 64

5

-

X

0

X

-

0

X

-

Z

RoHS COMPLIANT

MATERIAL:

CONTACT OUTER SLEEVE: BRASS

CLIP (4 FINGER CONTACT): BERYLLIUM COPPER

CONTACT PLATING: OPTIONAL TIN OR GOLD OVER 80u" NICKEL

INSULATOR: GLASS FILLED POLYESTER (UL94V-0)

MECHANICAL:

"H" DIMENSION

CONTACT HEIGHT:

0 - 7.46mm (0.294")

1 - 5.84mm (0.230")

2 - 8.89mm (0.350")

3 - 11.30mm (0.445")

* OPTION "0" STANDARD

CLIP PLATING:

0 - Au FLASH

1 - 10u" Au

2 - 30u" Au

CONTACT PLATING OVERALL:

0 - FULL TIN

1 - FULL Au FLASH

3 - 10u" Au

4 - 15u" Au

5 - 30u" Au

CONTACT SELECTIVE PLATING:

6 - Au FLASH CONTACT AREA/TIN TAIL

7 - 10u" Au CONTACT AREA/TIN TAIL

8 - 15u" Au CONTACT AREA/TIN TAIL

9 - 30u" Au CONTACT AREA/TIN TAIL

OPERATING TEMPERATURE (GOLD PLATING): -55° C TO +125° C

OPERATING TEMPERATURE (TIN PLATING): -40° C TO +105° C

SOLDER TEMPERATURE: 260° C FOR 10 SEC. (MAX.)

Rev

0

Issued

A Revised for RoHS Compliance

Drawn Checked Approved

Date

6/15/98

S.E.

S.M.

11/01/05

G.T.

S.M.

SMP TECHNOLOGY, INC.

SIP Socket, 2.54mm Pitch, Machine Pin

TOL. DEC.

.X +/- 0.35

.XX +/- 0.25

.XXX +/-

ANGLE +/-

UNIT: mm

SERIES: B 0 1 5-XXXX-XXX-Z

Pg: 1

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