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1812Y6300680JXR

Description
Ceramic Capacitor, Multilayer, Ceramic, 630V, X7R, -/+15ppm/Cel TC, 0.000068uF, 1812
CategoryPassive components    capacitor   
File Size172KB,3 Pages
ManufacturerSyfer
Environmental Compliance
Download Datasheet Parametric View All

1812Y6300680JXR Overview

Ceramic Capacitor, Multilayer, Ceramic, 630V, X7R, -/+15ppm/Cel TC, 0.000068uF, 1812

1812Y6300680JXR Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerSyfer
package instructionCHIP
Reach Compliance Codecompliant
ECCN codeEAR99
capacitance0.000068 µF
Capacitor typeCERAMIC CAPACITOR
dielectric materialsCERAMIC
high2.5 mm
JESD-609 codee3
length4.5 mm
Installation featuresSURFACE MOUNT
multi-layerYes
negative tolerance5%
Number of terminals2
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package formSMT
method of packingTR, Embossed Plastic, 13 Inch
positive tolerance5%
Rated (DC) voltage (URdc)630 V
size code1812
surface mountYES
Temperature characteristic codeX7R
Temperature Coefficient15% ppm/°C
Terminal surfaceMatte Tin (Sn) - with Nickel (Ni) barrier
Terminal shapeWRAPAROUND
width3.2 mm
Base Number Matches1
Surface Mount
Chip Capacitors
X7R
Polymer Termination
- a lead free termination
in ceramic devices that may not always be evident during the board
assembly process. Sometimes it may be the end customer who
finds out - when equipment fails!
Capacitor Body and Electrodes
Termination
MLCC’s are widely used in electronic circuit design for a multitude of
applications. Their small package size, technical performance and
suitability for automated assembly makes them the component of
choice for the specifier.
However, despite the technical benefits, ceramic components are brittle
and need careful handling on the production floor. In some
circumstances they may be prone to mechanical stress damage if not
used in an appropriate manner. Board flexing, depanelisation,
mounting through hole components, poor storage and automatic
testing may all result in cracking.
Careful process control is important at all stages of circuit board
assembly and transportation - from component placement to test and
packaging. Any significant board flexing may result in stress fractures
Solder Fillet
Force
Crack Initiation
Substrate
Fig 1. Typical Mechanical Crack
Ca
pa
cit
03
06
05
08
10
12
08
18
06
12
10pF
12
15
18
22
27
33
39
47
56
68
82
100pF
120
150
180
220
270
330
390
470
560
680
820
1.0nF
1.2
1.5
1.8
2.2
2.7
3.3
3.9
4.7
5.6
6.8
8.2
10
12
15
18
22
27
33
39
47
56
68
82
100
120
150
180
220
270
330
390
470
560
680
820
1.0µF
1.2
1.5
1.8
2.2
2.7
3.3
3.9
4.7
5.6
6.8
8.2
10
12
15
an
ce
500V
630V
1KV
2KV
500V
500V
1KV
2KV
630V
250V
500V
630V
1KV
2KV
3KV
200V
200V
200V
250V
250V
50/63V
100V
250V
50/63V
25V
25V
100V
16V
16V
100V
16V
25V
50/63V
200V
250V
50/63V
100V
25V
16V
X7R
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