FDC6330L
February 1999
FDC6330L
Integrated Load Switch
General Description
This device is particularly suited for compact power
management in portable electronic equipment where 3V
to 20V input and 2.3A output current capability are needed.
This load switch integrates a small N-Channel power
MOSFET (Q1) which drives a large P-Channel power
MOSFET (Q2) in one tiny SuperSOT
TM
-6 package.
Features
•
V
= 0.2V @ V = 12V, I =2.5 A. R
DROP
DROP
IN
IN
L
L
(ON)
(ON)
= 0.08
Ω
V
= 0.2V @ V = 5V,I = 1.6 A. R
= 0.125
Ω.
•
Control MOSFET (Q1) includes Zener protection for
ESD ruggedness (>6kV Human Body Model).
•
High performance PowerTrench
TM
technology for
extremely low on-resistance.
•
SuperSOT
TM
-6 package design using copper lead frame
for superior thermal and electrical capabilities.
Applications
•
Power management
•
Load actuation
Vin,R1
4
Q2
3
Vout,C1
EQUIVALENT CIRCUIT
ON/OFF
5
Q1
2
Vout,C1
IN
V
DR OP
+
-
OUT
R1,C1
6
See Application Circuit
1
R2
ON/OFF
SuperSOT -6
Absolute Maximum Ratings
Symbol
V
IN
V
ON/OFF
I
D
P
D
T
J
, T
stg
ESD
Input Voltage Range
On/Off Voltage Range
Load Current
- Continuous
- Pulsed
Maximum Power Dissipation
o
TM
T
A
=25 C unless otherwise noted
Parameter
(Note 1)
Ratings
3 - 20
1.5 - 8
(Note 2)
Units
V
V
A
W
°
C
kV
2.3
10
0.7
-55 to +150
6
(Note 1)
Operating and Storage Temperature Range
Electrostatic Discharge Rating MIL-STD-883D
Human-Body-Model (100pf/1500 Ohm)
Thermal Characteristics
R
θ
JA
R
θ
JC
Thermal Resistance, Junction-to-Ambient
Thermal Resistance, Junction-to-Case
(Note 2)
(Note 2)
180
60
°
C/W
°
C/W
Package Marking and Ordering Information
Device Marking
Device
FDC6330L
Reel Size
7’’
Tape width
8mm
Quantity
3000 units
.
330 (
.
Denotes pin 1)
©1999
Fairchild Semiconductor Corporation
FDC6330L Rev. C
FDC6330L
Electrical Characteristics
Symbol
Parameter
T
A
=25 C unless otherwise noted
o
Test Conditions
Min
Typ
Max
Units
OFF Characteristics
I
FL
Leakage Current
(Note 3)
V
IN
= 20 V, V
ON/OFF
= 250
µ
A
1
µ
A
ON Characteristics
V
DROP
R
(ON)
I
L
Conduction Voltage
Q
2
- Static On-Resistance
Load Current
V
IN
= 12 V, V
ON/OFF
= 3.3 V, I
L
= 2.5 A
V
IN
= 5 V, V
ON/OFF
= 3.3 V, I
L
= 1.6 A
V
GS
= -12 V, I
D
= -2.3 A
V
GS
= -5 V, I
D
= -1.9 A
V
DROP
= 0.2 V, V
IN
= 12 V, V
ON/OFF
= 3.3 V
V
DROP
= 0.2 V, V
IN
= 5 V, V
ON/OFF
= 3.3 V
0.054
0.081
2.5
1.6
0.2
0.2
0.08
0.125
V
V
Ω
A
Notes:
1. Range of Vin can be up to 30V, but R1 and R2 must be scaled such that VGS of Q2 does not exceed 20V.
2. R
θJA
is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting
surface of the drain pins. R
is guaranteed by design while R
is determined by the user’s board design.
θJC
θJA
3. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%.
FDC6330L Load Switch Application
External Component Recommendation:
For applications where Co
≤
1µF.
For slew rate control, select R2 in the range of 1k - 4.7kΩ .
For additional in-rush current control,C1
≤
1000pF can be added.
Select R1 so that the R1/R2 ratio ranges from 10 - 100. R1 is required to turn Q2 off.
FDC6330L Rev. C
FDC6330L
Typical Characteristics
(continued)
0.4
0.5
TJ = 125°C
0.4
0.3
V
DROP
(V)
TJ = 125°C
V
DROP
(V)
0.3
T = 25 °C
J
0.2
T = 25 °C
J
0.2
0.1
V
IN
= 12 V
V
ON/OF F
= 1. 5 - 8 V
PW =300 us, D
≤
2%
0.1
V
IN
= 5V
V
ON/OF F
= 1. 5 - 8 V
PW =300 us, D
≤
2%
0
0
1
2
I
L
, (A)
3
4
5
0
0
1
2
I
L
, (A)
3
4
5
Figure 1. Conduction Voltage Drop
Variation with Load Current.
Figure 2. Conduction Voltage Drop
Variation with Load Current.
0.25
IL = 1A
V
ON/OFF
= 1.5 - 8 V
PW =3 00 us, D
≤
2%
0.2
R
(ON)
,(Ohm)
0.15
T = 1 25°C
J
0.1
0.05
T = 25 °C
J
0
2
4
6
V
I N
, (V)
8
10
12
Figure 3. On-Resistance Variation
with Input Voltage.
TRANSIENT THERMAL RESISTANCE
1
0.5
D = 0.5
r(t), NORMALIZED EFFECTIVE
0.2
0.1
0.05
0.2
0.1
0.05
0.02
0.01
R
θ
JA
(t) = r(t) * R
θ
JA
R
θ
JA
=180°C/W
P(pk)
t
1
t
2
0.02
0.01
0.0001
Single Pulse
T
J
- T
A
= P * R JA (t)
θ
Duty Cycle, D = t
1
/ t
2
0.001
0.01
0.1
t
1
, TIME (sec)
1
10
100
300
Figure 4.Transient Thermal Response Curve.
Thermal characterization performed using the conditions described in Note 2.
Transient themal response will change depending on the circuit board design.
FDC6330L Rev. C
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is
not intended to be an exhaustive list of all such trademarks.
ACEx™
CoolFET™
CROSSVOLT™
E
2
CMOS
TM
FACT™
FACT Quiet Series™
FAST
®
FASTr™
GTO™
HiSeC™
DISCLAIMER
ISOPLANAR™
MICROWIRE™
POP™
PowerTrench™
QS™
Quiet Series™
SuperSOT™-3
SuperSOT™-6
SuperSOT™-8
TinyLogic™
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER
NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD
DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT
OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT
RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or
2. A critical component is any component of a life
support device or system whose failure to perform can
systems which, (a) are intended for surgical implant into
be reasonably expected to cause the failure of the life
the body, or (b) support or sustain life, or (c) whose
support device or system, or to affect its safety or
failure to perform when properly used in accordance
with instructions for use provided in the labeling, can be
effectiveness.
reasonably expected to result in significant injury to the
user.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Advance Information
Product Status
Formative or
In Design
Definition
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
Preliminary
First Production
No Identification Needed
Full Production
Obsolete
Not In Production
This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
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