P87C51UFPN datasheet, PDF - EEWORLD Datasheet

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P87C51UFPN: DescriptionCMOS single-chip 8-bit microcontrollers; CategoryThe embedded processor and controller Microcontrollers and processors; File Size261KB，38 Pages; ManufacturerPhilips Semiconductors (NXP Semiconductors N.V.); Websitehttps://www.nxp.com/

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P87C51UFPN Overview

CMOS single-chip 8-bit microcontrollers

P87C51UFPN Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Philips Semiconductors (NXP Semiconductors N.V.)
package instruction	DIP, DIP40,.6
Reach Compliance Code	unknow
bit size	8
CPU series	8051
JESD-30 code	R-PDIP-T40
JESD-609 code	e0
Number of terminals	40
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP40,.6
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5 V
Certification status	Not Qualified
RAM (bytes)	128
rom(word)	4096
ROM programmability	UVPROM
speed	33 MHz
Maximum slew rate	30.8 mA
Nominal supply voltage	5 V
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

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INTEGRATED CIRCUITS

80C51/87C51/80C31

80C51 8-bit microcontroller family

4K/128 OTP/ROM/ROMless low voltage (2.7V–5.5V),

low power, high speed (33 MHz)

Product specification

Supersedes data of 1999 Apr 01

IC28 Data Handbook

2000 Jan 20

Philips

Semiconductors

P87C51UFPN Related Products

	P87C51UFPN	P87C51	P87C51SFBB	P87C51SBPN	P87C51SBBB	P80C51SFBB	P80C31UFPN	P80C31UBAA	P80C31SFBB	P80C31
Description	CMOS single-chip 8-bit microcontrollers	CMOS single-chip 8-bit microcontrollers	CMOS single-chip 8-bit microcontrollers	8-BIT, OTPROM, 16 MHz, MICROCONTROLLER, PDIP40	CMOS single-chip 8-bit microcontrollers	CMOS single-chip 8-bit microcontrollers	CMOS single-chip 8-bit microcontrollers	CMOS single-chip 8-bit microcontrollers	CMOS single-chip 8-bit microcontrollers	CMOS single-chip 8-bit microcontrollers
Is it Rohs certified?	incompatible	-	incompatible	conform to	incompatible	incompatible	incompatible	incompatible	incompatible	-
Maker	Philips Semiconductors (NXP Semiconductors N.V.)	-	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)	-
package instruction	DIP, DIP40,.6	-	QFP, QFP44,.5SQ,32	DIP, DIP40,.6	QFP, QFP44,.5SQ,32	QFP, QFP44,.5SQ,32	DIP, DIP40,.6	QCCJ, LDCC44,.7SQ	QFP, QFP44,.5SQ,32	-
Reach Compliance Code	unknow	-	unknow	unknow	unknow	unknow	unknow	unknow	unknow	-
bit size	8	-	8	8	8	8	8	8	8	-
CPU series	8051	-	8051	8051	8051	8051	8051	8051	8051	-
JESD-30 code	R-PDIP-T40	-	S-PQFP-G44	R-PDIP-T40	S-PQFP-G44	S-PQFP-G44	R-PDIP-T40	S-PQCC-J44	S-PQFP-G44	-
JESD-609 code	e0	-	e0	-	e0	e0	e0	e0	e0	-
Number of terminals	40	-	44	40	44	44	40	44	44	-
Maximum operating temperature	85 °C	-	85 °C	70 °C	70 °C	85 °C	85 °C	70 °C	85 °C	-
Package body material	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-
encapsulated code	DIP	-	QFP	DIP	QFP	QFP	DIP	QCCJ	QFP	-
Encapsulate equivalent code	DIP40,.6	-	QFP44,.5SQ,32	DIP40,.6	QFP44,.5SQ,32	QFP44,.5SQ,32	DIP40,.6	LDCC44,.7SQ	QFP44,.5SQ,32	-
Package shape	RECTANGULAR	-	SQUARE	RECTANGULAR	SQUARE	SQUARE	RECTANGULAR	SQUARE	SQUARE	-
Package form	IN-LINE	-	FLATPACK	IN-LINE	FLATPACK	FLATPACK	IN-LINE	CHIP CARRIER	FLATPACK	-
power supply	5 V	-	3/5 V	3/5 V	3/5 V	3/5 V	5 V	5 V	3/5 V	-
Certification status	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-
RAM (bytes)	128	-	128	128	128	128	128	128	128	-
speed	33 MHz	-	16 MHz	16 MHz	16 MHz	16 MHz	33 MHz	33 MHz	16 MHz	-
Maximum slew rate	30.8 mA	-	15.5 mA	15.5 mA	15.5 mA	15.5 mA	30.8 mA	30.8 mA	15.5 mA	-
surface mount	NO	-	YES	NO	YES	YES	NO	YES	YES	-
technology	CMOS	-	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	-
Temperature level	INDUSTRIAL	-	INDUSTRIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	-
Terminal surface	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-
Terminal form	THROUGH-HOLE	-	GULL WING	THROUGH-HOLE	GULL WING	GULL WING	THROUGH-HOLE	J BEND	GULL WING	-
Terminal pitch	2.54 mm	-	0.8 mm	2.54 mm	0.8 mm	0.8 mm	2.54 mm	1.27 mm	0.8 mm	-
Terminal location	DUAL	-	QUAD	DUAL	QUAD	QUAD	DUAL	QUAD	QUAD	-

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