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5962-9669201HXC

Description
Flash, 512KX8, 150ns, CDIP32, CERAMIC, DIP-32
Categorystorage    storage   
File Size5MB,923 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
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5962-9669201HXC Overview

Flash, 512KX8, 150ns, CDIP32, CERAMIC, DIP-32

5962-9669201HXC Parametric

Parameter NameAttribute value
Objectid2078454729
package instructionCERAMIC, DIP-32
Reach Compliance Codeunknown
Maximum access time150 ns
command user interfaceNO
Data pollingYES
JESD-30 codeR-CDIP-T32
JESD-609 codee4
length41.73 mm
memory density4194304 bit
Memory IC TypeFLASH
memory width8
Number of functions1
Number of departments/size8
Number of terminals32
word count524288 words
character code512000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize512KX8
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeDIP
Encapsulate equivalent codeDIP32,.6
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
Programming voltage5 V
Certification statusNot Qualified
Filter level38535Q/M;38534H;883B
Maximum seat height5.08 mm
Department size64K
Maximum standby current0.0016 A
Maximum slew rate0.05 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelMILITARY
Terminal surfaceGOLD
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
switch bitNO
typeNOR TYPE
width15.24 mm
NOT MEASUREMENT
SENSITIVE
MIL-HDBK-103AJ
19 SEPTEMBER 2011
SUPERSEDING
MIL-HDBK-103AH
28 MARCH 2011
DEPARTMENT OF DEFENSE
HANDBOOK
LIST OF STANDARD MICROCIRCUIT DRAWINGS
This handbook is for guidance only. Do not cite this document
as a requirement.
AMSC N/A
FSC 5962
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