Microcontroller,
| Parameter Name | Attribute value |
| Objectid | 145117161120 |
| package instruction | BGA-112 |
| Reach Compliance Code | unknown |
| ECCN code | 3A991.A.2 |
| Date Of Intro | 2019-11-15 |
| YTEOL | 0.5 |
| Has ADC | YES |
| Address bus width | 28 |
| bit size | 32 |
| boundary scan | NO |
| CPU series | CORTEX-M3 |
| maximum clock frequency | 48 MHz |
| DAC channel | YES |
| DMA channel | YES |
| External data bus width | 16 |
| Format | FIXED POINT |
| Integrated cache | NO |
| JESD-30 code | S-PBGA-B112 |
| JESD-609 code | e4 |
| length | 10 mm |
| low power mode | YES |
| Humidity sensitivity level | 3 |
| Number of DMA channels | 12 |
| Number of external interrupt devices | 16 |
| Number of I/O lines | 86 |
| Number of terminals | 112 |
| Number of timers | 5 |
| On-chip data RAM width | 32 |
| On-chip program ROM width | 8 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| PWM channel | YES |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | LFBGA |
| Encapsulate equivalent code | BGA112,11X11,32 |
| Package shape | SQUARE |
| Package form | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Peak Reflow Temperature (Celsius) | 260 |
| RAM (bytes) | 32768 |
| RAM (number of words) | 8192 |
| rom(word) | 262144 |
| ROM programmability | FLASH |
| Maximum seat height | 1.3 mm |
| speed | 48 MHz |
| Maximum supply voltage | 3.8 V |
| Minimum supply voltage | 3 V |
| Nominal supply voltage | 3 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | NICKEL GOLD |
| Terminal form | BALL |
| Terminal pitch | 0.8 mm |
| Terminal location | BOTTOM |
| Maximum time at peak reflow temperature | 40 |
| width | 10 mm |
| uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER, RISC |
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